公开(公告)号：EP3256910B1

公开(公告)日：2018-10-31

申请号：EP16709989.4

申请日：2016-02-12

Applicant: Tronic's Microsystems

Inventor： GAFF, Vincent ,  VISSE, Pierre-Marie ,  RIBETTO, Luca

IPC: G04B17/06 ,  G04B17/22 ,  B81B3/00

CPC classification number: G04B17/066 ,  B81B3/0081 ,  F16F1/021 ,  G04B17/04 ,  G04B17/22

公开(公告)号：EP3218302A1

公开(公告)日：2017-09-20

申请号：EP15791617.2

申请日：2015-11-09

Applicant: Tronic's Microsystems

Inventor： COLLET, Joël

IPC: B81C1/00 ,  B81C99/00

CPC classification number: B81B3/0051 ,  B81C1/00182 ,  B81C1/00333 ,  B81C2201/0194 ,  B81C2203/051 ,  G01L9/0042

Abstract: The invention relates to an electromechanical device characterised in that it comprises a stack made up of an insulating layer (31) inserted between two solid layers (10, 30), and a micromechanical structure (60, 61) with predetermined thickness suspended above a recess (4) with predetermined depth, the recess (4) and the micromechanical structure (60, 61) making up one of the two solid layers (10, 30) of the stack, and the insulating layer (31) making up the bottom of said recess (4).

Abstract translation: 本发明涉及一种机电装置，其特征在于，其包括由插入在两个固体层（10,30）之间的绝缘层（31）和具有预定厚度的微机械结构（60,61） （4），所述凹部（4）和所述微机械结构（60,61）构成所述堆叠的所述两个固体层（10,30）中的一个，并且所述绝缘层（31）构成所述堆叠的底部 所述凹槽（4）。

公开(公告)号：EP2349915B1

公开(公告)日：2012-07-18

申请号：EP09753216.2

申请日：2009-11-10

Applicant: Tronic's Microsystems

Inventor： AZOLEY, Philippe ,  GILET, Jean-Michel ,  NICOLAS, Stéphane

IPC: B81B7/00 ,  G01P1/02 ,  H01L23/485

CPC classification number: B81B7/007 ,  B81B2207/012 ,  B81B2207/07 ,  B81C2203/0118 ,  G01P1/023 ,  G01P15/0802 ,  H01L24/02 ,  H01L2224/04042 ,  H01L2224/48472 ,  H01L2924/01087 ,  H01L2924/10156 ,  H01L2924/10157 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A micro-electromechanical component produced from a semiconductor substrate, comprising an internal moving portion which includes conductive elements and contacts on its outer surface, said contacts being electrically connected to said conductive elements, said electrical contacts being capable of accommodating soldered interconnect wires which are themselves designed to be connected to electrical contacts provided on device which accommodates said component, characterized in that electrical contacts are arranged in an area which extends between upper face of the component and lateral face, said contacts having a concave shape and having two regions capable of accommodating soldered interconnect wires, said regions being substantially perpendicular to each other and parallel to said upper face and said lateral face respectively.

公开(公告)号：EP1011133B1

公开(公告)日：2010-06-30

申请号：EP99403134.2

申请日：1999-12-14

Applicant: ELA MEDICAL ,  Tronic's Microsystems

Inventor： Van Campenhout, Yves ,  Gilet, Dominique ,  Legay, Thierry ,  Bono, Hubert

IPC: H01L21/56 ,  H01L23/31

CPC classification number: H01L23/3107 ,  H01L21/56 ,  H01L24/48 ,  H01L29/0657 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099

公开(公告)号：EP0642699B1

公开(公告)日：2007-11-07

申请号：EP93913073.8

申请日：1993-05-26

Applicant: Tronic's Microsystems ,  ELA MEDICAL

Inventor： VAL, Christian ,  VAN CAMPENHOUT, Yves ,  GILET, Dominique

IPC: H01L23/52 ,  H01L21/60 ,  H01L23/49 ,  H01L23/522

CPC classification number: H01L23/5385 ,  H01L23/485 ,  H01L25/0652 ,  H01L2224/274 ,  H01L2224/45144 ,  H01L2924/01079 ,  H01L2924/09701 ,  H05K1/0298 ,  H05K1/182 ,  H01L2924/00

Abstract: The solid-state device includes at least one chip on a support. The chip (12) is coated with an electrically insulating and heat stable material (13). Through the electrically insulating and heat stable material (13) pass electrical connection leads (16) which connect the chip sites (15) to metallic contact pads (14), the leads (16) being substantially perpendicular both to said sites (15) and said metallic contact pads (14).

Abstract translation: 该半导体器件包括布置在载体上的至少一个芯片上。 该芯片涂覆有电绝缘和热稳定的材料。 此电绝缘和热稳定的材料是通过电连接引线穿透连接芯片到金属化触点的位点，并且引线基本上垂直于所述两个所述位点和所述所述金属化触点。

公开(公告)号：EP1079732A1

公开(公告)日：2001-03-07

申请号：EP99920877.0

申请日：1999-05-17

Applicant: COMMISSARIAT A L'ENERGIE ATOMIQUE ,  Absys ,  Tronic's Microsystems

Inventor： CLERC, Jean-Frédéric ,  PERRUCHOT, François ,  RENARD, Stéphane

IPC: A61B5/0215 ,  A61B5/00

CPC classification number: A61B5/0215 ,  A61B5/0002

Abstract: The invention concerns a system for measuring at least one physical parameter in a site of a patient's body accessible by a medical probe, comprising a medical probe (1) consisting of a rod (2) equipped with means sensing said parameter and means for delivering an electric signal representing said parameter, and collected by the sensor, to a data processing device external to the patient. The sensor is contained in an electronic measuring module (41, 42) which also includes other elements constituted by electronic means associated with the sensor for supplying a measurement signal, means for remote transmission of the measurement signal, means for powering said elements.

公开(公告)号：EP2813465B1

公开(公告)日：2020-01-15

申请号：EP13290136.4

申请日：2013-06-12

Applicant: Tronic's Microsystems

Inventor： Collet, Joël ,  Cuzzocrea, Julien

IPC: B81B7/00

公开(公告)号：EP2938569B1

公开(公告)日：2019-09-04

申请号：EP13821889.6

申请日：2013-12-24

Applicant: Tronic's Microsystems ,  Commissariat à l'Énergie Atomique et aux Énergies Alternatives

Inventor： BOILLOT, François-Xavier ,  LAOUBI, Rémi ,  JOURDAN, Guillaume

IPC: B81B3/00 ,  G01P15/08 ,  G01P15/12 ,  G01P15/125

公开(公告)号：EP2795253B1

公开(公告)日：2018-10-03

申请号：EP12821255.2

申请日：2012-12-20

Applicant: Tronic's Microsystems

Inventor： LECLERC, Jacques

IPC: G01C19/5712 ,  G01P15/18

CPC classification number: G01P15/18 ,  G01C19/5712 ,  G01P15/08 ,  G01P15/125 ,  G01P15/14 ,  G01P2015/0862

Abstract: A resonator micro-electronic inertial sensor, preferably a micro-electromechanical system (MEMS) sensor (e.g. a gyro), for detecting linear accelerations and rotation rates in more than one axis comprises: €¢ a proof-mass system (21.1, ..., 21.4) flexibly suspended above a substrate for performing a rotational in-plane vibration about a central axis (24,) €¢ a drive electrode system (D1, ..., D4) for driving the proof-mass system (21.1, ..., 21.4) to perform said rotational in-plane vibration, €¢ and a sensing electrode system (S1, ..., S8) connected to the proof-mass system (21.1, ..., 21.4) for detecting linear accelerations or rotation rates in more than one axis. Said proof-mass system (21.1, ..., 21.4) has more than two proof-mass elements flexibly coupled (25.1a, 25.1 b) to each other. Each proof-mass element (21.1, 21.2) is directly and flexibly connected (23.1, 25.1a, 25.1 b) to an anchor structure (22) on the substrate (32). The proof-mass elements (21.1, ..., 21.4) are preferably arranged in a ring-shaped configuration between an inner and an outer radius (R1, R2) with respect to the central axis (24).

公开(公告)号：EP3256910A1

公开(公告)日：2017-12-20

申请号：EP16709989.4

申请日：2016-02-12

Applicant: Tronic's Microsystems

Inventor： GAFF, Vincent ,  VISSE, Pierre-Marie ,  RIBETTO, Luca

IPC: G04B17/06 ,  G04B17/22 ,  B81B3/00

CPC classification number: G04B17/066 ,  B81B3/0081 ,  F16F1/021 ,  G04B17/04 ,  G04B17/22

Abstract: The invention relates to a mechanical oscillator equipped with a bar (11), said bar (11) including a first silicon layer (Cs1) having a crystal lattice extending in a first direction (Ds1) of a plane, a thermally compensating layer (Co1) formed from a material having a Young's modulus of thermal coefficient of opposite sign to that of silicon, and a second silicon layer (Cs2) having a crystal lattice extending in a second direction (Ds2) of the plane, the first and second directions (Ds1, Ds2) being shifted by an angle of 45° in the plane of the layers, and the thermally compensating layer (Co1) extending between the first and second silicon layers (Cs1, Cs2).