公开(公告)号：US06310390B1

公开(公告)日：2001-10-30

申请号：US09288423

申请日：1999-04-08

Applicant: Walter Moden

Inventor： Walter Moden

IPC: H01C23495

CPC classification number: H01L23/49838 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/4951 ,  H01L23/49572 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/05124 ,  H01L2224/05155 ,  H01L2224/05554 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05599 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/16237 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: A BGA package and a method for fabricating the package are provided. The package includes a semiconductor die, internal conductors wire bonded to bond pads on the die, external ball contacts attached to ball bonding pads formed on the conductors in a dense grid pattern, and an encapsulating resin encapsulating the die and conductors. The package is fabricated using a lead frame having lead fingers that form the conductors. The die is back bonded to a polymer tape placed across the lead fingers, and then wire bonded to bonding pads on the conductors. In addition, the encapsulating resin is molded to include openings for the ball contacts which are aligned with the ball bonding pads. An alternate embodiment BGA package includes a polymer substrate adhesively bonded to a face of the die. The polymer substrate includes conductors having beam leads aligned with an opening through the polymer substrate. The opening provides access for a bonding tool for bonding bumps on the beam leads to bond pads on the die.

Abstract translation: 提供一种BGA封装和一种制造该封装的方法。 该封装包括半导体管芯，与导体上的接合焊盘接合的内部导体导线，以致密栅格图案形成在导体上的球形接合焊盘附着的外部球形触点以及封装芯片和导体的封装树脂。 使用具有形成导体的引线指的引线框来制造封装。 将模具背面粘合到横跨引线指状物放置的聚合物带上，然后将引线键合到导体上的接合焊盘。 此外，封装树脂被模制成包括与球接触垫对准的球接触开口。 一种替代实施方案BGA封装包括粘合到模具的表面上的聚合物基底。 聚合物基板包括具有与通过聚合物基板的开口对准的光束引线的导体。 该开口提供用于将梁引线上的凸块与模具上的接合焊盘接合的接合工具。

公开(公告)号：US06303981B1

公开(公告)日：2001-10-16

申请号：US09388323

申请日：1999-09-01

Applicant: Walter Moden

Inventor： Walter Moden

IPC: H01L23495

CPC classification number: H01L24/06 ,  H01L23/4951 ,  H01L23/49537 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/056 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/4917 ,  H01L2224/73215 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/01026 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A semiconductor package, and a method for fabricating the package are provided. The package includes a plastic body, and a pair of stacked semiconductor dice encapsulated in the plastic body, and wire bonded to separate leadframe segments. A first leadframe segment includes lead fingers configured to support a first semiconductor die of the stacked pair, and to form terminal leads of the package. A second leadframe segment is attached to the first leadframe segment, and includes lead fingers that support a second semiconductor die of the stacked pair. The lead fingers of the second leadframe are in physical and electrical contact with the leadfingers of the first leadframe. In addition, tip portions of the lead fingers of the first leadframe segment are staggered relative to tip portions of the lead fingers of the second leadframe segment to provide space for bond wires. The lead fingers support the dice during encapsulation, and also provide a heat conductive path for transferring heat from the dice during operation. The package can be constructed using lead-on-chip leadframes and conventional semiconductor packaging equipment.

Abstract translation: 提供一种半导体封装以及一种制造该封装的方法。 封装包括一个塑料体和一对封装在塑料体中的堆叠的半导体芯片，以及引线接合到分离的引线框架段。 第一引线框段包括构造成支撑堆叠对的第一半导体管芯并且形成封装的端子引线的引线。 第二引线框架段附接到第一引线框架段，并且包括支撑堆叠对的第二半导体管芯的引线指。 第二引线框的引线指与第一引线框的引线脚物理和电接触。 此外，第一引线框架段的引线指尖的尖端部分相对于第二引线框架引线的尖端部分交错，以提供接合线的空间。 引导指在封装期间支撑骰子，并且还提供用于在操作期间从骰子传递热量的导热路径。 封装可以使用片上引线框架和常规半导体封装设备构建。

公开(公告)号：US06291894B1

公开(公告)日：2001-09-18

申请号：US09143765

申请日：1998-08-31

Applicant: Warren Farnworth ,  Larry Kinsman ,  Walter Moden

Inventor： Warren Farnworth ,  Larry Kinsman ,  Walter Moden

IPC: H01L2348

CPC classification number: H01L23/528 ,  H01L23/3171 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0657 ,  H01L2224/05599 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2225/06593 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A method for packaging a semiconductor device includes connecting a plurality of wire leads to a corresponding plurality of electrical connection pads on the semiconductor device, covering at least a portion of the semiconductor device and at least a portion of each of the wire leads with an encapsulating material, and removing a portion of the encapsulating material and a portion of each of the wire leads to form a packaged semiconductor device wherein each of the wire leads has an exposed portion only at an end. The invention also includes a packaged semiconductor device having an integrated circuit device with a plurality of electrical connection pads, a plurality of wire leads coupled to the plurality of electrical connection pads, and a covering of encapsulating material covering at least a portion of the integrated circuit device and covering each of the wire leads, wherein each of the wire leads has an exposed end. The present invention contemplates wire bonding and encapsulation of individual die as well as multiple die on a single wafer.

Abstract translation: 一种用于封装半导体器件的方法包括将多个引线引线连接到半导体器件上的对应的多个电连接焊盘，覆盖半导体器件的至少一部分以及每个引线的至少一部分具有封装 并且去除所述封装材料的一部分和所述导线引线中的每一个的一部分以形成封装的半导体器件，其中所述引线中的每一个仅在一端具有暴露部分。 本发明还包括具有集成电路器件的封装半导体器件，该集成电路器件具有多个电连接焊盘，耦合到多个电连接焊盘的多个引线引线以及覆盖该集成电路的至少一部分的封装材料的覆盖物 装置并且覆盖每个导线，其中每个导线具有暴露端。 本发明设想在单个晶片上引线接合和封装单个管芯以及多个管芯。

公开(公告)号：US5286679A

公开(公告)日：1994-02-15

申请号：US33140

申请日：1993-03-18

Applicant: Warren M. Farnworth ,  Ed A. Shrock ,  Scott Clifford ,  Jerrold L. King ,  Walter Moden

Inventor： Warren M. Farnworth ,  Ed A. Shrock ,  Scott Clifford ,  Jerrold L. King ,  Walter Moden

IPC: H01L21/60 ,  H01L23/495

CPC classification number: H01L24/06 ,  H01L23/4951 ,  H01L23/49513 ,  H01L24/32 ,  H01L2224/04042 ,  H01L2224/06136 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/83855 ,  H01L2224/8388 ,  H01L2224/85447 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/181

Abstract: An improved method for attaching a semiconductor die to a leadframe is provided The improved method comprises forming a patterned adhesive layer on a side of a semiconductor wafer prior to singulation of the dies from the wafer. The adhesive layer is patterned such that wire bonding pads on the dies, as well as the streets between the dies, are free of adhesive material The adhesive layer may be deposited and patterned using a hot or cold screen printing process, by depositing and photopatterning a photosensitive adhesive, or using a resist etch back method. During a packaging process for attaching a die to a leadframe, the adhesive layer is heated and the lead fingers of the leadframe are placed in contact with the die under pressure. In an alternate embodiment of the invention, the lead fingers, rather than a side of the dies, are coated with an adhesive layer.

Abstract translation: 提供了一种用于将半导体管芯附接到引线框架的改进方法。改进的方法包括在从晶片分割模具之前在半导体晶片的侧面上形成图案化的粘合剂层。 图案化粘合剂层，使得模具上的引线接合焊盘以及模具之间的街道不含粘合材料。粘合剂层可以使用热或冷丝网印刷方法沉积和图案化，通过沉积和光图案化 感光性粘合剂，或者使用抗蚀剂回蚀法。 在用于将管芯附接到引线框架的封装过程中，粘合剂层被加热，引线框架的引线指针在压力下与模具接触。 在本发明的替代实施例中，引线指而不是模具的一侧涂覆有粘合剂层。

公开(公告)号：US20060270107A1

公开(公告)日：2006-11-30

申请号：US11483452

申请日：2006-07-10

Applicant: Michael Morrison ,  Walter Moden ,  Corey Jacobsen

Inventor： Michael Morrison ,  Walter Moden ,  Corey Jacobsen

IPC: H01L21/00

CPC classification number: H01L21/00 ,  B33Y80/00 ,  H01L23/3114 ,  H01L23/36 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/49109 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/45099

Abstract: A semiconductor device assembly and method of making the device are disclosed. The assembly comprises a semiconductor die attached to an electrically conductive layer, which is, in turn, connected to a dielectric layer carrying conductive traces of the electrical connection layer. The conductive traces provide connection between an array of discrete conductive elements and bonding wires connected to bond pads of the die. The conductive layer enhances thermal conduction and structural stiffness for the assembly. In addition, the conductive layer provides a voltage reference plane that may be connected to a power source, a ground source, or an intermediate reference voltage. The conductive layer also includes at least one electrical current isolation slot, which segments the conductive layer to help isolate noise induced in one segment of the conductive layer from the other segments.

公开(公告)号：US20060030072A1

公开(公告)日：2006-02-09

申请号：US11219214

申请日：2005-09-01

Applicant: Larry Kinsman ,  Walter Moden ,  Warren Farnworth

Inventor： Larry Kinsman ,  Walter Moden ,  Warren Farnworth

IPC: H01L21/50

CPC classification number: H05K3/301 ,  H01L25/105 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K2201/10454 ,  H05K2201/10696 ,  Y10S83/942 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

Abstract: A method for securing a semiconductor device to a carrier substrate includes inserting a semiconductor device with a plurality of stub contacts extending from a bottom edge thereof into a receptacle of an alignment device associated with the carrier substrate. Upon attachment of the alignment device to a carrier substrate and insertion of a vertically mountable semiconductor device into the receptacle, the semiconductor device is biased so as to establish and maintain electrical communication between the semiconductor device and the carrier substrate.

公开(公告)号：US20060001155A1

公开(公告)日：2006-01-05

申请号：US11219135

申请日：2005-09-01

Applicant: Larry Kinsman ,  Walter Moden ,  Warren Farnworth

Inventor： Larry Kinsman ,  Walter Moden ,  Warren Farnworth

IPC: H01L23/04

CPC classification number: H05K3/301 ,  H01L25/105 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K2201/10454 ,  H05K2201/10696 ,  Y10S83/942 ,  Y10T29/49121 ,  Y10T29/4913 ,  Y10T29/49135 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

Abstract: A semiconductor device package including leads with substantially planar exposed portions extending from a bottom edge of the package. The exposed portions of the leads may comprise stub contacts extending perpendicularly from the bottom edge. The exposed portions of the leads may be substantially rigid or nondeformable. A complementary alignment device that may be used with the semiconductor device package may include a receptacle for receiving the semiconductor device package.

Abstract translation: 一种半导体器件封装，包括具有从封装的底部边缘延伸的基本平坦的暴露部分的引线。 引线的露出部分可以包括从底部边缘垂直延伸的短截线。 引线的暴露部分可以是基本上刚性的或不可变形的。 可以与半导体器件封装一起使用的互补对准装置可以包括用于接收半导体器件封装的插座。

公开(公告)号：US20050272172A1

公开(公告)日：2005-12-08

申请号：US11197966

申请日：2005-08-05

Applicant: Walter Moden ,  John Jacobson

Inventor： Walter Moden ,  John Jacobson

IPC: G01R1/04 ,  G01R31/26 ,  H01L21/44 ,  H01L21/66

CPC classification number: G01R1/04 ,  G01R1/0483 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2924/01019 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of using adhesive tape to temporarily retain a die being temporarily held in a fixture during testing and burn-in. The method of the present invention uses a die cut piece of adhesively coated tape to hold a die in a test and burn-in fixture. Upon subsequent heating of the tape beyond the normal operating range of the adhesive coating on the tape, the die is removed from the tape, the tape is removed from the test and burn-in fixture, and the remaining adhesive, if any, is removed from the test and burn-in fixture.

Abstract translation: 在测试和老化期间使用胶带临时保持模具临时保持在固定装置中的方法。 本发明的方法使用粘合涂覆带的模切片将模具保持在测试和老化固定装置中。 在随后将带加热超过胶带上的粘合剂涂层的正常操作范围之后，将模具从带上移除，将带从测试和老化固定装置中取出，并且剩余的粘合剂（如果有的话）被去除 从测试和老化装置。

公开(公告)号：US06969632B2

公开(公告)日：2005-11-29

申请号：US10847413

申请日：2004-05-17

Applicant: Walter Moden

Inventor： Walter Moden

IPC: G01R31/02 ,  H01L21/00 ,  H01L21/44 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L23/31 ,  H01L27/14 ,  H01L27/146

CPC classification number: H01L27/14634 ,  H01L21/563 ,  H01L23/3185 ,  H01L24/28 ,  H01L24/31 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/85 ,  H01L24/86 ,  H01L27/14643 ,  H01L2224/0401 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/16 ,  H01L2224/45124 ,  H01L2224/48747 ,  H01L2224/73203 ,  H01L2224/73207 ,  H01L2224/73257 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83102 ,  H01L2224/83951 ,  H01L2224/8592 ,  H01L2224/92125 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/00014 ,  H01L2224/48744 ,  H01L2924/00

Abstract: A semiconductor package includes a substrate, and a semiconductor die flip chip mounted to the substrate. The package also includes substrate circuitry on a circuit side of the substrate, die circuitry on a back side of the die, terminal contacts on the die circuitry, bonded connections between the substrate circuitry and the die circuitry, and an encapsulant on the bonded connections and edges of the die. The die can include an image sensor on the circuit side configured to receive electromagnetic radiation transmitted through the substrate. A method for fabricating the package includes the step of providing a wafer with multiple dice, forming the die circuitry on the dice, and singulating the wafer into individual dice. The method also includes the steps of providing a substrate panel with multiple substrates, forming the substrate circuitry on the substrates, flip chip bonding the dice to the substrates, forming bonded connections between the dice and the substrates, forming the terminal contacts on the die circuitry, and singulating the panel into separate components.

Abstract translation: 半导体封装包括衬底和安装到衬底的半导体管芯倒装芯片。 封装还包括在衬底的电路侧上的衬底电路，裸片的背面上的裸片电路，裸片电路上的端子触点，衬底电路和裸片电路之间的结合连接，以及粘合连接上的密封剂 模具边缘。 芯片可以包括在电路侧的图像传感器，其配置为接收透射通过基板的电磁辐射。 制造封装的方法包括以下步骤：提供具有多个裸片的晶片，在裸片上形成裸片电路，并将晶片分成单独的裸片。 该方法还包括以下步骤：向衬底面板提供多个衬底，在衬底上形成衬底电路，将裸片倒装芯片接合到衬底，在裸片与衬底之间形成接合连接，在裸片电路上形成端子触点 ，并将面板分成单独的组件。

公开(公告)号：US20050255612A1

公开(公告)日：2005-11-17

申请号：US11188156

申请日：2005-07-22

Applicant: Tongbi Jiang ,  Syed Ahmad ,  Walter Moden

Inventor： Tongbi Jiang ,  Syed Ahmad ,  Walter Moden

IPC: H01L21/66 ,  H01L23/495

CPC classification number: H01L23/49513 ,  H01L23/4951 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73257 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: The present invention is directed to a method of attaching a leadframe to a singulated good die using a wet film adhesive applied in a predetermined pattern on the active surface of the good die, the lead finger of a leadframe, or both. By applying the adhesive only to identified good dice, time and material are saved over a process that applies adhesive to the entire wafer. By attaching the leadframe to the good die with a wet film, it is possible to remove the leadframe from the good die for rework if the good die subsequently tests unacceptable.