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公开(公告)号：KR1020060069756A
公开(公告)日：2006-06-22
申请号：KR1020040108433
申请日：2004-12-18
Applicant: 삼성전기주식회사
IPC: H05K3/46
CPC classification number: H05K3/4652 , H05K3/0032 , H05K3/28 , H05K3/4038 , H05K3/421
Abstract: 본 발명은 다층인쇄회로기판의 층간 정합 방법에 관한 것으로서, 특히 내층에 형성된 가이드 마크 위의 외층의 동박과 레진을 제거하여 내부 가이드 마크가 명확히 보이도록 하여 기준홀을 가공함으로 층간 정합이 개선된 다층인쇄회로기판의 층간 정합 방법에 관한 것이다.
또한, 본 발명에 따르면, 인쇄회로기판의 원판의 동박에 회로패턴 및 기준홀을 가공하기 위한 가이드 마크를 형성하는 제1 단계; 상기 인쇄회로기판의 원판에 절연접착수지를 적층하고, 외층을 적층하여 압축하는 제 2 단계; 상기 절연접착수지와 외층에 가이드 마크에 대응하는 윈도우를 형성하는 제 3 단계; CCD 카메라로 상기 내층에 형성된 가이드 마크을 인식하여 인쇄회로기판을 정렬한 후, 관통홀을 형성하기 위한 기준홀을 가공하여 복수의 관통홀을 형성하는 제 4 단계; 및 CCD 카메라로 상기 내층에 형성된 가이드 마크을 재인식하여 인쇄회로기판을 재정렬한 후, 블라인드 비아홀을 형성하기 위한 기준홀을 가공하여 복수의 블라인드 비아홀을 형성하는 제 5 단계를 포함하여 이루어진 다층인쇄회로기판의 층간 정합 방법이 제공된다.
다층인쇄회로기판, 층간 정합, Registration-
公开(公告)号：KR100584979B1
公开(公告)日：2006-05-29
申请号：KR1020030065185
申请日：2003-09-19
Applicant: 삼성전기주식회사
Inventor： 강명삼
IPC: H01L43/12
Abstract: 본 발명은 동일 평면상에 형성된 사각-링 형상의 자성체를 이용하고 상기 자성체의 상/하부에 드라이빙 패턴 및 픽업 패턴을 동시에 형성함으로써, 동일 평면상에서 X축 및 Y축을 동시에 감지하면서 소형화 할 수 있는 인쇄회로기판 기술을 이용한 미약자계 감지용 센서 및 그 제조방법에 관한 것으로, 동일한 평면상에서 X축과 Y축을 동시에 감지할 수 있도록 사각-링 형상을 지닌 자성체와, 상기 자성체의 하부 및 상부에 각각 적층되며, 상기 사각-링 형상의 자성체를 감는 형태가 되도록 드라이빙 패턴 및 픽업 패턴이 형성되어 있는 제1 적층체 및 제2 적층체를 포함하며, 여기서, 상기 제1 적층체 및 제2 적층체에 형성되는 드라이빙 패턴 및 픽업 패턴은 각각 상호 도통되는 것을 특징으로 한다.
미약자계, 인쇄회로기판, 자성체, 드라이빙 패턴, 픽업 패턴-
公开(公告)号：KR100547359B1
公开(公告)日：2006-01-26
申请号：KR1020030069630
申请日：2003-10-07
Applicant: 삼성전기주식회사
IPC: G11B7/09
Abstract: 본 발명은 인쇄회로기판 기술을 사용하여 광픽업 액추에이터 모듈 구성 부품 중, 권선 코일을 인쇄회로기판으로 대체한 광픽업 액추에이터, 그 액추에이터를 장착한 광픽업 장치 및 그 제조 방법에 관한 것이다.
본 발명에 따른 광픽업용 액추에이터는, 트랙킹 회로 패턴 및 포커싱 회로 패턴을 포함하는 2개의 인쇄회로기판; 상기 2개의 인쇄회로기판 사이에 배치된 대물 렌즈 부착부; 및 상기 2개의 인쇄회로기판에 자기장을 인가하기 위한 자성체를 포함하는 것을 특징으로 한다.
보빈, 인쇄회로기판, 포커싱, 트랙킹-
公开(公告)号：KR1020050028675A
公开(公告)日：2005-03-23
申请号：KR1020030065185
申请日：2003-09-19
Applicant: 삼성전기주식회사
Inventor： 강명삼
IPC: H01L43/12
Abstract: A weak-magnetic field sensor using a PCB(printed circuit board) is provided to simultaneously detect an X-axis and a Y-axis on the same plane by using a quadrangular ring-type magnetic material on the same plane and by simultaneously forming a driving pattern and a pick-up pattern on/under the magnetic material. A magnetic material(10) has a quadrangular ring type to simultaneously detect the X-axis and Y-axis on the same plane. A driving pattern(25) and a pick-up pattern(27) are formed in the first and second stack materials(20,30) to have a type of being wound around the magnetic material of the quadrangular ring type. The first and second stack materials are stacked on and under the magnetic material. The driving pattern and the pick-up pattern that are stacked on the first and second stack materials conduct each other.
Abstract translation: 提供使用PCB（印刷电路板）的弱磁场传感器，通过在同一平面上使用四边形环型磁性材料同时检测同一平面上的X轴和Y轴，同时形成 驱动模式和磁性材料上/下的拾取图案。 磁性材料（10）具有四边形环型，以同时检测同一平面上的X轴和Y轴。 在第一和第二堆叠材料（20,30）中形成驱动图案（25）和拾取图案（27），以使其缠绕在四边形环形磁性材料上。 第一和第二堆叠材料堆叠在磁性材料上和下面。 堆叠在第一和第二堆叠材料上的驱动图案和拾取图案彼此导电。
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公开(公告)号：KR1020050027757A
公开(公告)日：2005-03-21
申请号：KR1020030064123
申请日：2003-09-16
Applicant: 삼성전기주식회사
IPC: G11B7/08
CPC classification number: H05K1/165 , G11B7/08582 , G11B7/0933 , G11B7/0935 , H05K1/115 , H05K2201/097 , H05K2201/10121
Abstract: A bobbin incorporated with a winding coil, an optical pickup actuator employing the bobbin, and a manufacturing method thereof are provided to integrate a bobbin with a winding coil which moves the bobbin to an exact position in focus/track directions by using a PCB technology, thereby tremendously reducing the number of components and the weight of the bobbin. Tracking circuit patterns(302a,302b) are formed on both sides of a PCB(301). Focusing circuit patterns(303a,303b) are formed on both sides of the PCB(301). Via holes(306a-306d) connect the tracking circuit patterns(302a,302b) with the focusing circuit patterns(303a,303b), respectively. An objective lens attaching unit(304) is formed on the PCB(301). Connection pads(305a,305b) supply power to the circuit patterns(302a,302b,303a,303b).
Abstract translation: 并入绕组线圈的绕线器，采用绕线管的光拾取器致动器及其制造方法，其特征在于，将线轴与卷绕线圈组合起来，该绕线线圈通过使用PCB技术将线轴移动到焦点/轨迹方向的精确位置， 从而极大地减少了部件的数量和线轴的重量。 跟踪电路图案（302a，302b）形成在PCB（301）的两侧。 聚焦电路图案（303a，303b）形成在PCB（301）的两侧。 通孔（306a-306d）分别将跟踪电路图案（302a，302b）与聚焦电路图案（303a，303b）连接。 物镜安装单元（304）形成在PCB（301）上。 连接焊盘（305a，305b）向电路图案（302a，302b，303a，303b）供电。
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Patent Agency Ranking
公开(公告)号：KR100467839B1
公开(公告)日：2005-01-24
申请号：KR1020020012765
申请日：2002-03-09
Applicant: 삼성전기주식회사
CPC classification number: H05K1/165 , G01R33/05 , H05K3/4602 , H05K3/4652 , H05K2201/086 , H05K2201/09536 , H05K2201/10416
Abstract: A weak-magnetic field sensor using printed circuit board manufacturing technique and a method of manufacturing the same which detects earth magnetism to obtain positional information is disclosed. The sensor comprises a magnetic layer patterned in a certain shape; a first stacked board stacked on a lower surface of the magnetic layer and formed with a first driving pattern; a second stacked board stacked on an upper surface of the magnetic layer and formed with a second driving pattern, the first and second driving patterns being electrically connected to each other; a third lower stacked board stacked on a lower surface of the first stacked board and formed with a first pickup pattern; and a third upper stacked board stacked on an upper surface of the second stacked board and formed with a second pickup pattern, the third lower and upper stacked boards being electrically connected to each other.
Abstract translation: 公开了一种使用印刷电路板制造技术的弱磁场传感器及其制造方法，其检测地磁以获得位置信息。 该传感器包括以特定形状图案化的磁性层; 第一叠层板，其堆叠在所述磁性层的下表面上并且形成有第一驱动模式; 第二叠层板，堆叠在所述磁性层的上表面上并形成有第二驱动图案，所述第一驱动图案和所述第二驱动图案彼此电连接; 堆叠在第一叠层板的下表面上并形成有第一拾取图案的第三下层叠板; 以及第三上层叠板，所述第三上层叠板堆叠在所述第二叠层板的上表面上并形成有第二拾取图案，所述第三下层叠板和所述上层叠板彼此电连接。
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公开(公告)号：KR100464098B1
公开(公告)日：2005-01-03
申请号：KR1020020013753
申请日：2002-03-14
Applicant: 삼성전기주식회사
CPC classification number: G01R33/05 , G01R15/185 , G01R33/04 , Y10T29/49073 , Y10T29/49075
Abstract: A fluxgate sensor integrated in a printed circuit board. The fluxgate sensor has soft magnetic cores having a lower core and an upper core mounted on the lower core, for forming a closed magnetic path on a printed circuit board, an excitation coil formed as a metal film, alternately winding the upper and the lower soft magnetic cores substantially in a number '8' pattern, and a pick-up coil formed as a metal film, having a structure of winding the upper and the lower soft magnetic cores substantially in a solenoid pattern, the pick-up coil being placed on the same plane as an external contour of the excitation coil. The fluxgate sensor integrated in the printed circuit board can be mass-produced at a cheap manufacturing cost. The fluxgate sensor also can be made compact-sized, and at the same time, is capable of forming a closed-magnetic path. As a result, flux leakage is minimized, and the fluxgate sensor has a high sensitivity as it detects the magnetic field through a variable driving.
Abstract translation: 集成在印刷电路板中的磁通门传感器。 磁通门传感器具有软磁芯，其具有下芯和安装在下芯上的上芯，用于在印刷电路板上形成闭合磁路，励磁线圈形成为金属膜，交替地缠绕上软芯和下软芯 具有基本上为数字“8”形式的磁芯和形成为金属膜的拾取线圈，具有将上部和下部软磁芯基本上以螺线管图案缠绕的结构，拾取线圈被置于 与励磁线圈的外部轮廓相同的平面。 集成在印刷电路板中的磁通门传感器可以以便宜的制造成本批量生产。 磁通门传感器也可以制成紧凑尺寸，并且同时能够形成闭合磁路。 结果，磁通泄漏被最小化，并且磁通门传感器通过可变驱动检测磁场时具有高灵敏度。
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公开(公告)号：KR1020030073790A
公开(公告)日：2003-09-19
申请号：KR1020020013524
申请日：2002-03-13
Applicant: 삼성전기주식회사
IPC: H01L43/00
CPC classification number: G01R33/05 , G01R33/04 , Y10T29/4906
Abstract: PURPOSE: A method for fabricating a fluxgate sensor is provided to greatly reduce the size of a system by integrating a fluxgate sensor with other sensors and a circuit, and to detect an organic magnetic field according to an external magnetic field by differentially driving an organic voltage from each core and each side. CONSTITUTION: A prepreg(22) and a soft magnetic layer(24) are bonded to the upper surface of the first metal plate(21). The soft magnetic layer is etched to form a soft magnetic core(1,2). A prepreg(25) and the second metal plate(26) are bonded to the upper surface of the soft magnetic core to form the first substrate. The first through holes(27) are formed at both sides of the first substrate extended from the soft magnetic core. The first through holes are plated, respectively. Both surfaces of the substrate are etched to form an excitation coil. A prepreg(29) and the third metal plate(30) are bonded to the upper surface of the excitation coil to form the second substrate. The second through hole(31) is formed in the outside of the first through hole of the second substrate. The second through hole is plated. Both surfaces of the second substrate of the second substrate are etched to form a magnetic field variation detecting coil. A prepreg(32) and the fourth metal plate(33) are bonded to the upper surface of the magnetic field variation detecting coil. Both surfaces of the third substrate is etched to form a pad(34) for electrical conduction.
Abstract translation: 目的：提供一种用于制造磁通门传感器的方法，通过将磁通门传感器与其他传感器和电路进行集成来大大减小系统的尺寸，并通过差分驱动有机电压来检测根据外部磁场的有机磁场 从每个核心和每一边。 构成：将预浸料（22）和软磁性层（24）结合到第一金属板（21）的上表面。 软磁层被蚀刻以形成软磁芯（1,2）。 将预浸料坯（25）和第二金属板（26）接合到软磁芯的上表面以形成第一基板。 第一通孔（27）形成在从软磁芯延伸的第一基板的两侧。 第一通孔分别电镀。 蚀刻基板的两个表面以形成激励线圈。 预浸料坯（29）和第三金属板（30）结合到励磁线圈的上表面以形成第二基板。 第二通孔（31）形成在第二基板的第一通孔的外侧。 第二通孔被电镀。 蚀刻第二衬底的第二衬底的两个表面以形成磁场变化检测线圈。 预浸料坯（32）和第四金属板（33）与磁场变化检测线圈的上表面接合。 蚀刻第三衬底的两个表面以形成用于导电的焊盘（34）。
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公开(公告)号：KR100396796B1
公开(公告)日：2003-09-02
申请号：KR1020010045544
申请日：2001-07-27
Applicant: 삼성전기주식회사
IPC: H01L23/36
CPC classification number: H01L21/50 , H01L23/36 , H01L23/49816 , H01L2924/0002 , Y10T156/1744 , H01L2924/00
Abstract: Disclosed are a method for preparing a high performance BGA board and a jig applicable to the method. The method comprises pre-bonding an adhesive to a BGA board laminated structure or a heatsink by use of a jig; and main-bonding the BGA board laminated structure or the heatsink to which the adhesive is previously stuck in the pre-bonding step to the heatsink or the BGA board laminated structure, respectively, by use of a jig. A high performance BGA board can be prepared by use of an individual heatsink and a strip-type jig without a strip-type heatsink, and in which the Ni-plated side of the heatsink can be prevented from being contaminated.
Abstract translation: 公开了用于制备适用于该方法的高性能BGA板和夹具的方法。 该方法包括使用夹具将粘合剂预粘合至BGA板叠层结构或散热器; 并且通过使用夹具将在预粘合步骤中预先粘合有粘合剂的BGA板叠层结构或散热片正面粘合到散热器或BGA板叠层结构。 高性能BGA板可以通过使用单独的散热器和没有条形散热片的条形夹具来制备，并且可以防止散热片的镀镍侧受到污染。
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公开(公告)号：KR1020030010311A
公开(公告)日：2003-02-05
申请号：KR1020010045211
申请日：2001-07-26
Applicant: 삼성전기주식회사
IPC: H05K1/14
CPC classification number: H05K3/4697 , H05K1/0298 , H05K3/429 , H05K2201/10734
Abstract: PURPOSE: A high-performance BGA(Ball Grid Array) substrate and a method for fabricating the same are provided to prevent a scratch due to a router in a cavity forming process by controlling the thickness of the second layer and the thickness of an adhesive. CONSTITUTION: A high-performance BGA substrate is formed with six layers of the first to the sixth layers(10,20,30,40,50,60). An adhesive(70) is inserted between the layers, namely between the first and the second layers(10,20), between the second and the third layers(20,30), between the third and the fourth layers(30,40), between the fourth and the fifth layers(40,50), and the fifth and the sixth layers(50,60). The thickness of the adhesive(70) is 50 to 70 micro meter. The thickness of the remaining layers(10,30,40,50,60) except for second layer(20) is less than 0.3mm. The thickness of the second layer(20) is four times as much as the thickness of the remaining layers(10,30,40,50,60).
Abstract translation: 目的：提供一种高性能BGA（球栅阵列）基板及其制造方法，以通过控制第二层的厚度和粘合剂的厚度来防止由于路由器在空腔形成过程中的划痕。 构成：高性能BGA衬底由六层第一层（10,20,30,40,50,60）形成。 粘合剂（70）插入在层之间，即第一和第二层（10,20）之间，第二层和第三层之间，第三层和第四层之间（30,40）之间。 ，第四层和第五层（40,50）之间，以及第五层和第六层（50,60）之间。 粘合剂（70）的厚度为50〜70微米。 除了第二层（20）之外的剩余层（10,30,40,50,60）的厚度小于0.3mm。 第二层（20）的厚度是其余层（10,30,40,50,60）的厚度的四倍。
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