公开(公告)号：KR1020120066435A

公开(公告)日：2012-06-22

申请号：KR1020100127784

申请日：2010-12-14

Applicant: 삼성전기주식회사

Inventor： 박지현 ,  최석문 ,  이영기

IPC: H05K7/20 ,  H05K1/02

Abstract: PURPOSE: A method for manufacturing a heat radiation substrate is provided to simplify process by welding a substrate and a heat radiation module through ion junction and to obtain junction uniformity through the ion junction. CONSTITUTION: An insulating layer(20) is formed by anodizing the surface of a metal core(10). The metal core is a base for forming a heat radiation substrate. A heat radiation module(30) formed into metal is attached to one side of the insulating layer. The heat radiation module and the metal core are ion-welded. The heat radiation module and the metal core are same material. A metal layer is formed on the metal core. A circuit pattern is formed on the metal layer.

Abstract translation: 目的：提供一种用于制造散热衬底的方法，以通过离子接合焊接衬底和散热模块来简化工艺，并通过离子结得到结的均匀性。 构成：通过阳极氧化金属芯（10）的表面形成绝缘层（20）。 金属芯是用于形成散热基板的基座。 形成金属的散热模块（30）附着在绝缘层的一侧。 散热模块和金属芯是离子焊接的。 散热模块和金属芯是相同的材料。 在金属芯上形成金属层。 在金属层上形成电路图案。

公开(公告)号：KR1020110008634A

公开(公告)日：2011-01-27

申请号：KR1020090066060

申请日：2009-07-20

Applicant: 삼성전기주식회사

Inventor： 가오,샨 ,  최석문 ,  김태현 ,  홍주표 ,  장범식 ,  박지현

IPC: H01L23/373

CPC classification number: H01L25/072 ,  H01L23/3121 ,  H01L23/3735 ,  H01L23/427 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/071 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: PURPOSE: A power semiconductor module and a method of manufacturing the same are provided to improve radiation efficiency by adopting an anode oxidation metal layer having small interface and thickness. CONSTITUTION: A metal plate(110) comprises a first penetration hole and an anode oxidation layer. The anode oxidation layer is formed on the surface of the metal plate and inside the first penetration hole. A cooling member(130) comprises a second penetration hole while having the metal plate in both sides. Circuit layers are connected through a via hole formed in the first penetration hole and the second penetration hole. A power device is connected to the circuit layers. A resin sealing member(160) covers the circuit layer and the power device. A housing is installed in the metal plate in order to form the encapsulation space of the resin sealing member.

Abstract translation: 目的：提供一种功率半导体模块及其制造方法，以通过采用具有小的界面和厚度的阳极氧化金属层来提高辐射效率。 构成：金属板（110）包括第一穿透孔和阳极氧化层。 阳极氧化层形成在金属板的表面和第一穿透孔的内部。 冷却构件（130）包括第二穿透孔，同时在两侧具有金属板。 电路层通过形成在第一贯通孔和第二贯通孔中的通孔连接。 功率器件连接到电路层。 树脂密封构件（160）覆盖电路层和功率装置。 为了形成树脂密封部件的密封空间，在金属板上安装有壳体。

公开(公告)号：KR1020100055198A

公开(公告)日：2010-05-26

申请号：KR1020080114162

申请日：2008-11-17

Applicant: 삼성전기주식회사

Inventor： 이현기 ,  이영규 ,  배준희 ,  박지현 ,  이재훈

IPC: G02B26/00

CPC classification number: G02B26/0841 ,  B81B2201/04 ,  G02B5/1847 ,  G02B5/1861 ,  G02B26/0858 ,  H01L24/80

Abstract: PURPOSE: An optical modulator module package is provided to reduce manufacture costs by attaching a light modulator element on a second substrate. CONSTITUTION: A wiring pattern is formed on a first substrate(4). A plurality of driver ICs(6) generates a driving voltage according to a control signal. A second substrate(2) is attached on the first substrate of a driver IC. The second substrate comprises a via hole(18), which is electrically interlinks the bottom and top of the boding. The second substrate comprises a window(24) at the center. The light modulator element(8) comprises a micro-mirror(10). The light modulator element is attached on the second substrate. The micro-mirror diffracts the incident light and outputs the diffracted light. The diffracted light has a plurality of order of diffractions.

Abstract translation: 目的：提供光调制器模块封装以通过将光调制器元件附接在第二基板上来降低制造成本。 构成：在第一基板（4）上形成布线图案。 多个驱动器IC（6）根据控制信号产生驱动电压。 第二基板（2）附接在驱动器IC的第一基板上。 所述第二基板包括通孔（18），所述通孔（18）电连接所述封装的底部和顶部。 第二基板包括在中心的窗口（24）。 光调制元件（8）包括微镜（10）。 光调制器元件附接在第二基板上。 微镜衍射入射光并输出衍射光。 衍射光具有多个衍射级。