公开(公告)号：US20230317708A1

公开(公告)日：2023-10-05

申请号：US18194236

申请日：2023-03-31

Applicant: Apple Inc.

Inventor： Wei Chen ,  Jie-Hua Zhao ,  Jun Zhai ,  Po-Hao Chang ,  Hsien-Che Lin ,  Ying-Chieh Ke ,  Kunzhong Hu

IPC: H01L25/18 ,  H01L23/24

CPC classification number: H01L25/18 ,  H01L23/24

Abstract: Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.

公开(公告)号：US20230223348A1

公开(公告)日：2023-07-13

申请号：US18163033

申请日：2023-02-01

Applicant: Apple Inc.

Inventor： Jun Zhai ,  Chonghua Zhong ,  Kunzhong Hu

IPC: H01L23/538 ,  H01L25/00 ,  H01L21/48 ,  H01L23/00 ,  H01L25/065 ,  H01L21/683 ,  H01L25/10 ,  H01L23/16 ,  H01L23/498 ,  H01L23/31 ,  H01L25/18

CPC classification number: H01L23/5385 ,  H01L25/50 ,  H01L21/486 ,  H01L24/96 ,  H01L25/0655 ,  H01L23/5383 ,  H01L24/19 ,  H01L23/5386 ,  H01L21/4853 ,  H01L21/6835 ,  H01L25/105 ,  H01L23/16 ,  H01L23/5384 ,  H01L23/49833 ,  H01L2924/15192 ,  H01L2224/92125 ,  H01L24/16 ,  H01L23/49827 ,  H01L2225/1023 ,  H01L2924/19105 ,  H01L2924/19011 ,  H01L2224/131 ,  H01L2224/12105 ,  H01L23/3128 ,  H01L2924/37001 ,  H01L2224/81005 ,  H01L2225/1094 ,  H01L2924/3511 ,  H01L2224/92225 ,  H01L2224/16237 ,  H01L23/49822 ,  H01L2924/1432 ,  H01L2224/04105 ,  H01L2924/15311 ,  H01L2924/1431 ,  H01L2224/16227 ,  H01L2221/68359 ,  H01L2924/19043 ,  H01L24/73 ,  H01L23/49816 ,  H01L2224/1703 ,  H01L2924/1434 ,  H01L24/17 ,  H01L21/4857 ,  H01L2224/16235 ,  H01L2224/0401 ,  H01L2924/19042 ,  H01L2924/19041 ,  H01L2224/73267 ,  H01L2225/1058 ,  H01L2224/73253 ,  H01L24/13 ,  H01L25/18 ,  H01L2224/97 ,  H01L2224/92244 ,  H01L2224/32225 ,  H01L24/32 ,  H01L24/81 ,  H01L24/92 ,  H01L2224/73204

Abstract: Multiple component package structures are described in which an interposer chiplet is integrated to provide fine routing between components. In an embodiment, the interposer chiplet and a plurality of conductive vias are encapsulated in an encapsulation layer. A first plurality of terminals of the first and second components may be in electrical connection with the plurality of conductive pillars and a second plurality of terminals of first and second components may be in electrical connection with the interposer chiplet.

公开(公告)号：US11670548B2

公开(公告)日：2023-06-06

申请号：US17080609

申请日：2020-10-26

Applicant: Apple Inc.

Inventor： Vidhya Ramachandran ,  Jun Zhai ,  Chonghua Zhong ,  Kunzhong Hu ,  Shawn Searles ,  Joseph T. DiBene, II ,  Mengzhi Pang

IPC: H01L21/77 ,  H01L25/16 ,  H01L25/03 ,  H01L25/18 ,  H01L21/66 ,  H01L23/00

CPC classification number: H01L21/77 ,  H01L22/20 ,  H01L24/32 ,  H01L24/73 ,  H01L25/03 ,  H01L25/16 ,  H01L25/18 ,  H01L24/17 ,  H01L2224/12105 ,  H01L2224/1403 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/24195 ,  H01L2924/12 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1427 ,  H01L2924/1432 ,  H01L2924/1433 ,  H01L2924/1436 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19103 ,  H01L2924/19104

Abstract: Systems that include integrated circuit dies and voltage regulator units are disclosed. Such systems may include a voltage regulator module and an integrated circuit mounted in a common system package. The voltage regulator module may include a voltage regulator circuit and one or more passive devices mounted to a common substrate, and the integrated circuit may include a System-on-a-chip. The system package may include an interconnect region that includes wires fabricated on multiple conductive layers within the interconnect region. At least one power supply terminal of the integrated circuit may be coupled to an output of the voltage regulator module via a wire included in the interconnect region.

公开(公告)号：US20230085890A1

公开(公告)日：2023-03-23

申请号：US17483535

申请日：2021-09-23

Applicant: Apple Inc.

Inventor： Sanjay Dabral ,  Jun Zhai ,  Jung-Cheng Yeh ,  Kunzhong Hu ,  Raymundo Camenforte ,  Thomas Hoffmann

IPC: H01L23/528 ,  H01L23/58 ,  H01L23/538 ,  H01L23/48 ,  H01L25/065

Abstract: Multi-die structures and methods of fabrication are described. In an embodiment, a multi-die structure includes a first die, a second die, and die-to-die routing connecting the first die to the second die. The die-to-die interconnection may be monolithically integrated as a chip-level die-to-die routing, or external package-level die-to-die routing.

公开(公告)号：US11594494B2

公开(公告)日：2023-02-28

申请号：US17166795

申请日：2021-02-03

Applicant: Apple Inc.

Inventor： Jun Zhai ,  Chonghua Zhong ,  Kunzhong Hu

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/683 ,  H01L23/498 ,  H01L25/00 ,  H01L23/16 ,  H01L23/00 ,  H01L25/10 ,  H01L25/065 ,  H01L25/18 ,  H01L23/31

Abstract: Multiple component package structures are described in which an interposer chiplet is integrated to provide fine routing between components. In an embodiment, the interposer chiplet and a plurality of conductive vias are encapsulated in an encapsulation layer. A first plurality of terminals of the first and second components may be in electrical connection with the plurality of conductive pillars and a second plurality of terminals of first and second components may be in electrical connection with the interposer chiplet.

公开(公告)号：US11476203B2

公开(公告)日：2022-10-18

申请号：US17216278

申请日：2021-03-29

Applicant: Apple Inc.

Inventor： Sanjay Dabral ,  Jun Zhai

IPC: H01L23/48 ,  H01L21/44 ,  H01L23/538 ,  H01L23/488 ,  H01L23/00 ,  H01L25/18 ,  H01L21/66 ,  H01L23/522 ,  H01L23/528 ,  H01L23/58 ,  H01L23/498

Abstract: Stitched die structures, and methods for interconnecting die are described. In an embodiment, a stitched die structure includes a semiconductor substrate that includes a first die area of a first die and a second die area of a second die separate from the first die area. A back-end-of-the-line (BEOL) build-up structure spans over the first die area and the second die area, and includes a first metallic seal directly over a first peripheral area of the first die area, a second metallic seal directly over a second peripheral area of the second die area, and a die-to-die routing extending through the first metallic seal and the second metallic seal to electrically connect the first die to the second die.

公开(公告)号：US20220093523A1

公开(公告)日：2022-03-24

申请号：US17027097

申请日：2020-09-21

Applicant: Apple Inc.

Inventor： Karthik Shanmugam ,  Jun Zhai

IPC: H01L23/538 ,  H01L25/16 ,  H01L21/56 ,  H01L23/485 ,  H05K1/18

Abstract: One or more stud bumps may form a conductive column to a component having back side metallization. In an embodiment, the column of stud bumps may be about 130 um vertically (Z-direction). Providing a microelectronics package with a column of stud bumps electrically connected to a component having back side metallization may provide a cost effective electrical interconnect and may enable the incorporation of components of different thicknesses, including that the component thicknesses are independent of each other, in a single fanout package, while providing a thin package profile and back side surface finish integration.

公开(公告)号：US20220093522A1

公开(公告)日：2022-03-24

申请号：US17026708

申请日：2020-09-21

Applicant: Apple Inc.

Inventor： Karthik Shanmugam ,  Jun Zhai ,  Rajasekaran Swaminathan

IPC: H01L23/538 ,  H01L23/31 ,  H05K1/18 ,  H01L25/16 ,  H01L21/56

Abstract: Packages and packaging techniques are described in which a patterned carrier substrate can be used to create a reconstituted fanout substrate with a topography that can accommodate components of different thicknesses. In an embodiment, a wiring layer is formed directly on a multiple level topography of a molding compound layer including embedded components.

公开(公告)号：US11063046B2

公开(公告)日：2021-07-13

申请号：US16529043

申请日：2019-08-01

Applicant: Apple Inc.

Inventor： Jared L. Zerbe ,  Emerson S. Fang ,  Jun Zhai ,  Shawn Searles

IPC: H01L27/10 ,  H01L23/13 ,  H01L23/64 ,  H01L23/00 ,  H01L25/065 ,  H01L25/16 ,  H01L25/18 ,  H01L23/498 ,  H01G4/228 ,  H01L49/02 ,  H01L23/48 ,  H01L25/10 ,  H01L23/50

Abstract: A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device may include one or more current consuming elements. A passive device may be coupled to the power consuming device. The passive device may include a plurality of passive elements formed on a semiconductor substrate. The passive elements may be arranged in an array of structures on the semiconductor substrate. The power consuming device and the passive device may be coupled using one or more terminals. The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.

公开(公告)号：US10756622B2

公开(公告)日：2020-08-25

申请号：US16231904

申请日：2018-12-24

Applicant: Apple Inc.

Inventor： Sanjay Dabral ,  David A. Secker ,  Jun Zhai ,  Ralf M. Schmitt ,  Vidhya Ramachandran ,  Wenjie Mao

IPC: H02M3/07 ,  G05F3/10 ,  H01L29/66 ,  H01L23/00 ,  H01L23/522

Abstract: Power management systems are described. In an embodiment, a power management system includes a voltage source, a circuit load located within a chip, and a switched capacitor voltage regulator (SCVR) coupled to voltage source and the circuit load to receive an input voltage from the voltage source and supply an output voltage to the circuit load. The SCVR may include circuitry located within the chip and a discrete integrated passive device (IPD) connected to the chip.