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公开(公告)号：BRPI0908712A2
公开(公告)日：2015-07-28
申请号：BRPI0908712
申请日：2009-03-18
Applicant: BASF SE
Inventor： JAIN SACHIN , GABRIEL CLAUS , DESBOIS PHILIPPE , OPFERMANN DIRK , EIBECK PETER , BRUCHMANN BERND , KLATT MARTIN
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公开(公告)号：ES2532878T3
公开(公告)日：2015-04-01
申请号：ES12707305
申请日：2012-03-06
Applicant: BASF SE
Inventor： BENTEN REBEKKA VON , EIBECK PETER
Abstract: Uso de masas de conformado termoplásticas que contienen como componentes esenciales A) del 29 al 99,8 % en peso de un poliéster, B) del 0,2 al 2,0 % en peso de sales de metal alcalino de ácidos carboxílicos alifáticos o sus mezclas, en relación con el 100 % en peso de A) y B), estando compuesto el componente B) de formiato sódico, acetato sódico, adipato disódico, sal sódica de ácido poliacrílico o sus mezclas, así como además C) del 0 al 70 % en peso de otros aditivos, dando la suma de los % en peso de A) a C) el 100 % para la fabricación de cuerpos de conformado transparentes a láser de cualquier tipo.
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公开(公告)号：UA106795C2
公开(公告)日：2014-10-10
申请号：UAA201214474
申请日：2011-05-10
Applicant: BASF SE
Inventor： VON BENTEN REBEKKA , EIBECK PETER , HECKMANN WALTER , KURIKOV JORDAN , PULBERE MARIUS SORIN
Abstract: Винахідстосуєтьсязастосуваннятермопластичнихформувальнихмас, якімістятьяксуттєвікомпоненти: A) від 29 до 99,95 мас. % поліестеру, B) від 0,05 до 2,0 мас. % Na2CO3, K2CO3, NaHCO3, KHCO3 абоїхсумішейвідносно 100 мас. % компонентівА) іВ), атакож, крімцього, C) від 0 до 70 мас. % іншихдодатковихречовин, причомусумамас. % компонентівА) - С) складає 100 %, длявиготовленняформованихвиробівбудь-якоговиду, проникнихдлялазерноговипромінювання.
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公开(公告)号：PT2571931E
公开(公告)日：2014-07-25
申请号：PT11721267
申请日：2011-05-10
Applicant: BASF SE
Inventor： HECKMANN WALTER , BENTEN REBEKKA VON , EIBECK PETER , KURIKOV JORDAN , PULBERE MARIUS SORIN
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公开(公告)号：AU2011254776A1
公开(公告)日：2012-12-20
申请号：AU2011254776
申请日：2011-05-10
Applicant: BASF SE
Inventor： BENTEN REBEKKA VON , EIBECK PETER
Abstract: The invention relates to the use of thermoplastic molding compounds, comprising as substantial components: A) 29 to 99.95 wt % of a polyesters, B) 0.05 to 2.0 wt % of Na
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Patent Agency Ranking
公开(公告)号：CA2798879A1
公开(公告)日：2011-11-07
申请号：CA2798879
申请日：2011-05-10
Applicant: BASF SE
Inventor： BENTEN REBEKKA VON , EIBECK PETER
Abstract: The invention relates to the use of thermoplastic molding compounds, comprising as substantial components: A) 29 to 99.95 wt % of a polyesters, B) 0.05 to 2.0 wt % of Na2CO3, K2CO3, NaHCO3, KHCO3 or mixtures thereof, relative to 100 wt % of A) and B), and additionally, C) 0 to 70 wt % of further additives, where the sum of the wt % of A) to C) is 100 %, for producing laser-transparent molded parts of any kind.
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公开(公告)号：AT496090T
公开(公告)日：2011-02-15
申请号：AT07802518
申请日：2007-08-07
Applicant: BASF SE
Inventor： EIBECK PETER , ENGELMANN JOCHEN , NEUHAUS RALF , BERNNAT ANKA
Abstract: Thermoplastic molding compositions, comprising: (A) from 20 to 85% by weight of at least one polyamide whose number of amino end groups is ≧50 mmol/kg, (B) from 14.9 to 60% by weight of glass fibers. (C) from 0.01 to 2% by weight of at least one heat stabilizer, (D) from 0 to 1.5% by weight of at least one mold-release agent, and (E) from 0 to 30% by weight of other additives, where the total of the percentages by weight of (A)-(E) is 100.
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公开(公告)号：DE502005003682D1
公开(公告)日：2008-05-21
申请号：DE502005003682
申请日：2005-10-14
Applicant: BASF SE
Inventor： EIBECK PETER , BRUCHMANN BERND , EIPPER ANDREAS , STUMBE JEAN-FRANCOIS , NEUHAUS RALF , FISCHER MICHAEL , ENGELMANN JOCHEN , DESBOIS PHILIPPE
Abstract: Thermoplastic molding compositions, comprising A) from 10 to 99% by weight of at least one thermoplastic polyamide, B) from 0.01 to 50% by weight of B1) at least one highly branched or hyperbranched polycarbonate with an OH number of from 1 to 600 mg KOH/g of polycarbonate (to DIN 53240, Part 2), or B2) at least one highly branched or hyperbranched polyester of AxBy type, where x is at least 1.1 and y is at least 2.1, or a mixture of these, C) from 0 to 60% by weight of other additives, where the total of the percentages by weight of components A) to C) is 100%.
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公开(公告)号：BR112022001111A2
公开(公告)日：2022-03-15
申请号：BR112022001111
申请日：2020-09-03
Applicant: BASF SE
Inventor： ANDREAS THOMAS HAEDLER , GUBBELS ERIK , CREMER JENS , SCHOEMER MARTINA , DEGLMANN PETER , EIBECK PETER , SURE REBECCA , TINA ELISABETH WELLER
IPC: C08K5/00 , C08K5/3417 , C08K7/02
Abstract: composição termoplástica de moldagem, uso de pelo menos um composto de carbazol, uso de composições termoplásticas de moldagem e fibra. composição termoplástica de moldagem, caracterizada por compreender: a) de 10 a 99,99% em peso de um polímero termoplástico, b) de 0,01 a 20% em peso de pelo menos um composto de carbazol selecionado a partir de carbazol substituído e não substituído e compostos orgânicos contendo pelo menos um resíduo de carbazol substituído ou não substituído quimicamente ligado, c) de 0 a 70% em peso de outros aditivos, em que o total das porcentagens em peso dos componentes a) a c) é de 100% em peso.
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公开(公告)号：CA3142607A1
公开(公告)日：2020-12-10
申请号：CA3142607
申请日：2020-05-27
Applicant: BASF SE
Inventor： GUBBELS ERIK , HENNIG INGOLF , SCHOEMER MARTINA , EIBECK PETER
Abstract: The present invention relates to an electromagnetic millimetre wave absorber material, preferably having a volume resistivity of more than 1 Ocm, containing solid particles having an aspect ratio (length:diameter) of at least 5 of a first electrically conductive material, particles having an aspect ratio (length:diameter) of less than 5 of a second electrically conductive material and an electrically non-conductive polymer, wherein the absorber material is capable of absorbing electromagnetic waves in a frequency region of 60 GHz or more. The invention also relates to its use and method for absorbing as well as a sensor apparatus comprising said absorber material.
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