公开(公告)号：US11070747B2

公开(公告)日：2021-07-20

申请号：US15919116

申请日：2018-03-12

Applicant: FLIR SYSTEMS, INC.

Inventor： Brian Simolon ,  Eric A. Kurth ,  Mark Nussmeier ,  Nicholas Högasten ,  Theodore R. Hoelter ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp

IPC: H04N5/33 ,  H01L27/146 ,  H04N5/378 ,  H04N5/225

Abstract: Various techniques are provided for implementing a segmented focal plane array (FPA) of infrared sensors. In one example, a system includes a segmented FPA. The segmented FPA includes a top die having an array of infrared sensors (e.g., bolometers). The top die may also include a portion of a read-out integrated circuit (ROIC). The segmented FPA also includes a bottom die having at least a portion of the ROIC. The top and the bottom dies are electrically coupled via inter-die connections. Advantageously, the segmented FPA may be fabricated with a higher yield and a smaller footprint compared with conventional FPA architectures. Moreover, the segmented FPA may be fabricated using different semiconductor processes for each die.

公开(公告)号：US20190141261A1

公开(公告)日：2019-05-09

申请号：US16147381

申请日：2018-09-28

Applicant: FLIR Systems, Inc.

Inventor： Nicholas Högasten ,  Mark Nussmeier ,  Eric A. Kurth ,  Theodore R. Hoelter ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp

IPC: H04N5/33 ,  H04N5/225 ,  H01L27/146 ,  H04N13/243

Abstract: An imager array may be provided as part of an imaging system. The imager array may include a plurality of infrared imaging modules. Each infrared imaging module may include a plurality of infrared sensors associated with an optical element. The infrared imaging modules may be oriented, for example, substantially in a plane facing the same direction and configured to detect images from the same scene. Such images may be processed in accordance with various techniques to provide images of infrared radiation. The infrared imaging modules may include filters or lens coatings to selectively detect desired ranges of infrared radiation. Such arrangements of infrared imaging modules in an imager array may be used to advantageous effect in a variety of different applications.

公开(公告)号：US10091439B2

公开(公告)日：2018-10-02

申请号：US14137573

申请日：2013-12-20

Applicant: FLIR Systems, Inc.

Inventor： Nicholas Högasten ,  Mark Nussmeier ,  Eric A. Kurth ,  Theodore R. Hoelter ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp

IPC: H04N5/33 ,  H04N13/243 ,  H01L27/146 ,  H04N5/225 ,  H04N5/365 ,  H04N5/367 ,  H04N13/218

Abstract: An imager array may be provided as part of an imaging system. The imager array may include a plurality of infrared imaging modules. Each infrared imaging module may include a plurality of infrared sensors associated with an optical element. The infrared imaging modules may be oriented, for example, substantially in a plane facing the same direction and configured to detect images from the same scene. Such images may be processed in accordance with various techniques to provide images of infrared radiation. The infrared imaging modules may include filters or lens coatings to selectively detect desired ranges of infrared radiation. Such arrangements of infrared imaging modules in an imager array may be used to advantageous effect in a variety of different applications.

公开(公告)号：US09986175B2

公开(公告)日：2018-05-29

申请号：US14747202

申请日：2015-06-23

Applicant: FLIR Systems, Inc.

Inventor： Jeffrey D. Frank ,  Nicholas Högasten ,  Theodore R. Hoelter ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp ,  Andrew C. Teich ,  Dwight Dumpert ,  Mark Nussmeier ,  Eric A. Kurth

IPC: G01J5/00 ,  H04N5/33 ,  H04N5/232 ,  H04N5/365 ,  H04N5/225

CPC classification number: H04N5/33 ,  H04N5/2252 ,  H04N5/2257 ,  H04N5/2258 ,  H04N5/23229 ,  H04N5/23241 ,  H04N5/3651

Abstract: Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. For example, a device attachment may include a housing with a tub on a rear surface thereof shaped to at least partially receive a user device, an infrared sensor assembly disposed within the housing and configured to capture thermal infrared image data, and a processing module communicatively coupled to the infrared sensor assembly and configured to transmit the thermal infrared image data to the user device. Thermal infrared image data may be captured by the infrared sensor assembly and transmitted to the user device by the processing module in response to a request transmitted by an application program or other software/hardware routines running on the user device.

公开(公告)号：US09961277B2

公开(公告)日：2018-05-01

申请号：US14751437

申请日：2015-06-26

Applicant: FLIR Systems, Inc.

Inventor： Theodore R. Hoelter ,  Mark Nussmeier ,  Eric A. Kurth ,  Nicholas Högasten ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp

IPC: H04N5/33 ,  H04N5/225 ,  G01J5/04 ,  H01L27/146 ,  G01J5/06 ,  G01J5/08 ,  G01J5/20 ,  H04N5/365 ,  G01J5/02 ,  G01J5/00

CPC classification number: H04N5/33 ,  G01J5/025 ,  G01J5/0265 ,  G01J5/027 ,  G01J5/04 ,  G01J5/061 ,  G01J5/0881 ,  G01J5/20 ,  G01J2005/0077 ,  G01J2005/202 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/73265 ,  H04N5/2257 ,  H04N5/332 ,  H04N5/3655 ,  H04N5/3656 ,  H01L2924/00014

Abstract: In one embodiment, an infrared (IR) sensor module includes an IR sensor assembly, including a substrate, a microbolometer array disposed on an upper surface of the substrate; and a cap disposed on the upper surface of the substrate and hermetically enclosing the microbolometer array. A base is disposed below the substrate, and a heat spreader having a generally planar portion is interposed between a lower surface of the substrate and an upper surface of the base. In some embodiments, the heat spreader can include a material having an anisotropic thermal conductivity, e.g., graphite.

公开(公告)号：US09843742B2

公开(公告)日：2017-12-12

申请号：US13893809

申请日：2013-05-14

Applicant: FLIR Systems, Inc.

Inventor： Stanley H. Garrow ,  Nicholas Högasten ,  Theodore R. Hoelter ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp ,  Eric A. Kurth ,  Malin Ingerhed

IPC: H04N5/33 ,  H04N5/365

CPC classification number: H04N5/33 ,  H04N5/3651 ,  H04N5/3658

Abstract: Various techniques are provided to capture one or more thermal image frames using an infrared sensor array that is fixably positioned to substantially de-align rows and columns of infrared sensors. In one example, an infrared imaging system includes an infrared sensor array comprising a plurality of infrared sensors arranged in rows and columns and adapted to capture a thermal image frame of a scene exhibiting at least one substantially horizontal or substantially vertical feature. The infrared imaging system also includes a housing. The infrared sensor array is fixably positioned within the housing to substantially de-align the rows and columns from the feature while the thermal image frame is captured.

公开(公告)号：US20170318237A1

公开(公告)日：2017-11-02

申请号：US15645949

申请日：2017-07-10

Applicant: FLIR Systems, Inc.

Inventor： Mark Nussmeier ,  Eric A. Kurth ,  Nicholas Högasten ,  Theodore R. Hoelter ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp

IPC: H04N5/33 ,  H04N5/225 ,  H04N5/378 ,  H04N5/357 ,  H04M1/725

CPC classification number: H04N5/33 ,  H04M1/725 ,  H04M2250/52 ,  H04N5/2252 ,  H04N5/2257 ,  H04N5/357 ,  H04N5/378

Abstract: Various techniques are provided for implementing an infrared imaging system. In one example, a system includes a focal plane array (FPA). The FPA includes an array of infrared sensors adapted to image a scene. The FPA also includes a bias circuit adapted to provide a bias voltage to the infrared sensors. The bias voltage is selected from a range of approximately 0.2 volts to approximately 0.7 volts. The FPA also includes a read out integrated circuit (ROIC) adapted to provide signals from the infrared sensors corresponding to captured image frames. Other implementations are also provided.

公开(公告)号：US09756264B2

公开(公告)日：2017-09-05

申请号：US14750781

申请日：2015-06-25

Applicant: FLIR Systems, Inc.

Inventor： Theodore R. Hoelter ,  Nicholas Högasten ,  Malin Ingerhed ,  Mark Nussmeier ,  Eric A. Kurth ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp

IPC: G06K9/40 ,  H04N5/33 ,  H04N5/365 ,  H04N5/367 ,  G06T5/00 ,  G06T5/20 ,  H04N5/225

CPC classification number: H04N5/33 ,  G06T5/002 ,  G06T5/20 ,  G06T2207/10048 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/3651 ,  H04N5/3658 ,  H04N5/3675

Abstract: Various techniques are provided to identify anomalous pixels in images captured by imaging devices. In one example, an infrared image frame is received. The infrared image frame is captured by a plurality of infrared sensors based on infrared radiation passed through an optical element. A pixel of the infrared image frame is selected. A plurality of neighborhood pixels of the infrared image frame are selected. Values of the selected pixel and the neighborhood pixels are processed to determine whether the value of the selected pixel exhibits a disparity in relation to the neighborhood pixels that exceeds a maximum disparity associated with a configuration of the optical element and the infrared sensors. The selected pixel is selectively designated as an anomalous pixel based on the processing.

公开(公告)号：US09756262B2

公开(公告)日：2017-09-05

申请号：US14135493

申请日：2013-12-19

Applicant: FLIR Systems, Inc.

Inventor： Jeffrey D. Frank ,  Shawn Jepson ,  Mark Nussmeier ,  Eric A. Kurth ,  Nicholas Högasten ,  Theodore R. Hoelter ,  Katrin Strandemar ,  Pierre Boulanger ,  Barbara Sharp

IPC: B60Q1/00 ,  H04N5/33 ,  H04N5/225

CPC classification number: H04N5/33 ,  B60Q1/00 ,  H04N5/2257

Abstract: Techniques are disclosed for systems and methods using small form factor infrared imaging modules to monitor aspects of a power system. A system may include one or more infrared imaging modules, a processor, a memory, a display, a communication module, and modules to control components of a power system. Infrared imaging modules may be mounted on, installed in, or otherwise integrated with a power system having one or more power system components. The infrared imaging modules may be configured to capture thermal images of portions of the power system. Various thermal image analytics and profiling may be performed on the captured thermal images to determine the operating conditions and temperatures of portions of the power system. Monitoring information may be generated based on the determined conditions and temperatures and then presented to a user of the power system.

公开(公告)号：US09723227B2

公开(公告)日：2017-08-01

申请号：US14099818

申请日：2013-12-06

Applicant: FLIR Systems, Inc.

Inventor： Nicholas Högasten ,  Theodore R. Hoelter ,  Katrin Strandemar

IPC: H04N5/33

CPC classification number: H04N5/33

Abstract: Various techniques are disclosed for performing non-uniformity correction (NUC) for infrared imaging devices. Intentionally blurred image frames may be obtained and processed to correct for FPN (e.g., random spatially uncorrelated FPN in one embodiment) associated with infrared sensors of the infrared imaging device. Intentionally blurred image frames may be used to distinguish between FPN associated with the infrared sensors and desired scene information. Advantageously, such techniques may be implemented without requiring the use of a shutter to perform flat field correction for the infrared imaging device.