公开(公告)号：WO2018063367A1

公开(公告)日：2018-04-05

申请号：PCT/US2016/054900

申请日：2016-09-30

Applicant: INTEL CORPORATION ,  KAMGAING, Telesphor ,  OSTER, Sasha ,  DOGIAMIS, Georgios ,  ELSHERBINI, Adel ,  LIFF, Shawna ,  ALEKSOV, Aleksandar ,  SWAN, Johanna ,  RAWLINGS, Brandon

Inventor： KAMGAING, Telesphor ,  OSTER, Sasha ,  DOGIAMIS, Georgios ,  ELSHERBINI, Adel ,  LIFF, Shawna ,  ALEKSOV, Aleksandar ,  SWAN, Johanna ,  RAWLINGS, Brandon

IPC: H01P1/04 ,  H01P3/12 ,  H01P5/08

CPC classification number: H01P1/042 ,  H01P1/022 ,  H01P3/12 ,  H01P3/121 ,  H01P3/122 ,  H01P11/002

Abstract: Generally, this disclosure provides apparatus and systems for coupling waveguides to a server package with a modular connector system, as well as methods for fabricating such a connector system. Such a system may be formed with connecting waveguides that turn a desired amount, which in turn may allow a server package to send a signal through a waveguide bundle in any given direction without bending waveguides.

Abstract translation: 通常，本公开提供了用于将波导耦合到具有模块化连接器系统的服务器封装的装置和系统，以及用于制造这种连接器系统的方法。 这种系统可以用连接波导形成，该连接波导转动所需量，这又可以允许服务器封装在任何给定方向上通过波导束发送信号而不弯曲波导。

公开(公告)号：WO2018063341A1

公开(公告)日：2018-04-05

申请号：PCT/US2016/054832

申请日：2016-09-30

Applicant: INTEL CORPORATION

Inventor： ELSHERBINI, Adel A. ,  OSTER, Sasha, N. ,  DOGIAMIS, Georgios C. ,  KAMGAING, Telesphor ,  LIFF, Shawna M. ,  ALEKSOV, Aleksandar ,  RAWLINGS, Brandon M. ,  DISCHLER, Richard, J.

IPC: H01P3/02 ,  H01P3/127 ,  H01P3/12 ,  H01P3/16

CPC classification number: H01P3/122 ,  H01P3/127 ,  H01P3/16 ,  H01P11/002

Abstract: An apparatus comprises a waveguide including: an elongate waveguide core including a dielectric material, wherein the waveguide core includes at least one space arranged lengthwise along the waveguide core that is void of the dielectric material; and a conductive layer arranged around the waveguide core.

Abstract translation: 一种装置包括波导，该波导包括：包括电介质材料的细长波导芯，其中该波导芯包括沿着该波导芯纵向排列的至少一个空间，该空间没有该电介质材料; 以及围绕波导芯设置的导电层。

公开(公告)号：WO2017111920A1

公开(公告)日：2017-06-29

申请号：PCT/US2015/067190

申请日：2015-12-21

Applicant: INTEL CORPORATION

Inventor： KAMGAING, Telesphor ,  DOGIAMIS, Georgios C. ,  NAIR, Vijay K.

IPC: H01Q3/34 ,  H01Q21/06

CPC classification number: H01Q3/36 ,  H01Q21/06 ,  H01Q23/00

Abstract: Embodiments of the invention include a communication module that includes a die having a transceiver and a phase shifter die that is coupled to the die. The phase shifter includes a power combiner and splitter. The communication module also includes a substrate that is coupled to the phase shifter die. The substrate includes an antenna unit with steerable beam forming capability for transmitting and receiving communications.

Abstract translation: 本发明的实施例包括通信模块，该通信模块包括具有收发器和耦合到管芯的移相器管芯的管芯。 移相器包括一个功率合成器和分配器。 通信模块还包括耦合到移相器管芯的衬底。 基片包括一个天线单元，具有可控波束形成能力，用于发送和接收通信。

公开(公告)号：WO2017111917A1

公开(公告)日：2017-06-29

申请号：PCT/US2015/067184

申请日：2015-12-21

Applicant: INTEL CORPORATION

Inventor： NAIR, Vijay K. ,  OSTER, Sasha N. ,  ELSHERBINI, Adel A. ,  KAMGAING, Telesphor ,  EID, Feras

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/46

CPC classification number: H05K1/0243 ,  H01P3/121 ,  H01P5/107 ,  H05K3/4697 ,  H05K2201/037 ,  H05K2201/09618

Abstract: Embodiments of the invention include a waveguide structure that includes a lower member, at least one sidewall member coupled to the lower member, and an upper member. The lower member, the at least one sidewall member, and the upper member include at least one conductive layer to form a cavity in a substrate for allowing communications between devices that are coupled or attached to the substrate.

Abstract translation: 本发明的实施例包括一种波导结构，其包括下部件，至少一个连接到下部件的侧壁件和上部件。 下部构件，至少一个侧壁构件和上部构件包括至少一个导电层，以在基底中形成空腔，以允许耦合或附接到基底的装置之间的通信。

公开(公告)号：WO2017099730A1

公开(公告)日：2017-06-15

申请号：PCT/US2015/064511

申请日：2015-12-08

Applicant: INTEL CORPORATION

Inventor： KAMGAING, Telesphor ,  DISCHLER, Richard J.

IPC: G06F1/16 ,  G06F15/17

CPC classification number: G06F1/16 ,  H05K1/0274 ,  H05K1/147 ,  H05K2201/045 ,  H05K2201/046

Abstract: Wireless interconnects are shown on flexible cables for communication between computing platforms. One example has an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, a cable on the package substrate coupled to the integrated circuit chip at one end, a radio chip on the cable coupled to the cable at the other end, the radio chip to modulate data over a carrier and to transmit the modulated data, and a waveguide transition coupled to a dielectric waveguide to receive the transmitted modulated data from the radio and to couple it into the waveguide, the waveguide to carry the modulated data to an external component.

Abstract translation: 无线互连显示在灵活的电缆上用于计算平台之间的通信。 一个示例具有集成电路芯片，用于承载集成电路芯片的封装衬底，具有用于将集成电路芯片连接到外部组件的导电连接器的封装衬底，在一端处耦合到集成电路芯片的封装衬底上的电缆， 电缆上的无线电芯片在另一端耦合到电缆，无线电芯片在载波上调制数据并传输调制的数据，以及耦合到介质波导的波导转换以接收来自无线电的传输的调制数据，以及 将其耦合到波导中，波导将调制数据传送到外部组件。

公开(公告)号：WO2017052659A1

公开(公告)日：2017-03-30

申请号：PCT/US2015/052495

申请日：2015-09-25

Applicant: INTEL CORPORATION

Inventor： LIFF, Shawna ,  ELSHERBINI, Adel A. ,  KAMGAING, Telesphor ,  OSTER, Sasha N. ,  CHAWLA, Gaurav

IPC: G06F13/14 ,  G06F13/00 ,  H01R11/01 ,  H04M9/06

CPC classification number: G06F13/00 ,  G06F13/14 ,  H04M9/06

Abstract: Microelectronic package communication is described using radio interfaces connected through wiring. One example includes a system board, an integrated circuit chip, and a package substrate mounted to the system board to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components. A radio on the package substrate is coupled to the integrated circuit chip to modulate the data onto a carrier and to transmit the modulated data. A radio on the system board receives the transmitted modulated data and demodulates the received data, and a cable interface is coupled to the system board radio to couple the received demodulated data to a cable.

Abstract translation: 使用通过布线连接的无线电接口描述微电子封装通信。 一个示例包括安装到系统板以承载集成电路芯片的系统板，集成电路芯片和封装衬底，封装衬底具有导电连接器以将集成电路芯片连接到外部组件。 封装衬底上的无线电装置耦合到集成电路芯片以将数据调制到载波上并传输调制数据。 系统板上的无线电装置接收发送的调制数据并解调所接收的数据，并且电缆接口耦合到系统板无线电装置，以将接收到的解调数据耦合到电缆。

公开(公告)号：WO2017052651A1

公开(公告)日：2017-03-30

申请号：PCT/US2015/052472

申请日：2015-09-25

Applicant: INTEL CORPORATION

Inventor： ELSHERBINI, Adel A. ,  KAMGAING, Telesphor ,  OSTER, Sasha N. ,  RAWLINGS, Brandon M. ,  DOGIAMIS, Georgios C.

IPC: H04B1/00 ,  G06F13/14

CPC classification number: H04B1/00 ,  H01L25/00 ,  H01L2224/16225 ,  H01L2924/15311

Abstract: Communication is described between integrated circuit packages using a millimeter-wave wireless radio fabric. In one example a first package has a radio transceiver to communicate with a radio transceiver of a second package. The second package has a radio transceiver to communicate with the radio transceiver of the first package. A switch communicates with the first package and the second package to establish a connection through the respective radio transceivers between the first package and the second package. A system board carries the first package, the second package, and the switch.

Abstract translation: 在使用毫米波无线电布的集成电路封装之间描述了通信。 在一个示例中，第一包装具有无线电收发器以与第二包装的无线电收发器进行通信。 第二包装具有无线电收发器以与第一包装的无线电收发器进行通信。 交换机与第一包装和第二包装件通信，以在第一包装和第二包装之间通过相应的无线电收发器建立连接。 系统板承载第一包装，第二包装和开关。

公开(公告)号：WO2017052648A1

公开(公告)日：2017-03-30

申请号：PCT/US2015/052463

申请日：2015-09-25

Applicant: INTEL CORPORATION

Inventor： KAMGAING, Telesphor ,  ADEL, Elsherbini ,  COHEN, Emanuel

IPC: H01L25/16 ,  H01L25/065

CPC classification number: H01L23/66 ,  H01L24/16 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2223/6688 ,  H01L2224/16235 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1421 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15321 ,  H01L2924/19105

Abstract: A microelectronic package is described with a wireless interconnect for chip-to-chip communication. In one example, the package includes an integrated circuit chip, a package substrate to carry the integrated circuit chip, the package substrate having conductive connectors to connect the integrated circuit chip to external components, a radio coupled to the integrated circuit chip to receive data from the integrated circuit chip and modulate the data onto a radio frequency carrier, and an antenna on the package substrate coupled to the radio to send the modulated data over the carrier to an external device.

Abstract translation: 使用无线互连来描述微电子封装，用于芯片到芯片通信。 在一个示例中，封装包括集成电路芯片，用于承载集成电路芯片的封装衬底，封装衬底具有用于将集成电路芯片连接到外部组件的导电连接器，耦合到集成电路芯片的无线电接收数据， 集成电路芯片并将数据调制到射频载波上，以及耦合到无线电装置的封装衬底上的天线，以将载波上的调制数据发送到外部设备。

公开(公告)号：WO2015171118A1

公开(公告)日：2015-11-12

申请号：PCT/US2014/036949

申请日：2014-05-06

Applicant: INTEL CORPORATION ,  KAMGAING, Telesphor ,  ELSHERBINI, Adel A. ,  FRANK, Torrey W.

Inventor： KAMGAING, Telesphor ,  ELSHERBINI, Adel A. ,  FRANK, Torrey W.

IPC: H01L23/12

CPC classification number: H01L23/49838 ,  G06F1/1613 ,  H01L21/288 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/145 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/5223 ,  H01L23/562 ,  H01L23/66 ,  H01L2223/6672 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/10253 ,  H01L2924/1421 ,  H01L2924/1433 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/3511

Abstract: Embodiments of the present disclosure describe a multi-layer package with antenna and associated techniques and configurations. In one embodiment, an integrated circuit (IC) package assembly includes a first layer having a first side and a second side disposed opposite to the first side a second layer coupled with the first side of the first layer, one or more antenna elements coupled with the second layer and a third layer coupled with the second side of the first layer, wherein the first layer is a reinforcement layer having a tensile modulus that is greater than a tensile modulus of the second layer and the third layer. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例描述了具有天线和相关联的技术和配置的多层封装。 在一个实施例中，集成电路（IC）封装组件包括具有第一侧的第一层和与第一侧相对设置的第二层，第二层与第一层的第一侧耦合，一个或多个天线元件与 所述第二层和与所述第一层的第二侧耦合的第三层，其中所述第一层是具有大于所述第二层和所述第三层的拉伸模量的拉伸模量的增强层。 可以描述和/或要求保护其他实施例。

公开(公告)号：WO2013101249A1

公开(公告)日：2013-07-04

申请号：PCT/US2011/068285

申请日：2011-12-31

Applicant: INTEL CORPORATION ,  SARASWAT, Ruchir ,  SCHAEFER, Andre ,  ZILLMANN, Uwe ,  DUEVEL, Andreas ,  RAO, Valluri ,  KAMGAING, Telesphor ,  KRISHNAMURTHY, Harish

Inventor： SARASWAT, Ruchir ,  SCHAEFER, Andre ,  ZILLMANN, Uwe ,  DUEVEL, Andreas ,  RAO, Valluri ,  KAMGAING, Telesphor ,  KRISHNAMURTHY, Harish

IPC: G05F1/08 ,  G05F1/565 ,  H01L23/31

CPC classification number: G05F1/618 ,  H01L23/481 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/642 ,  H01L23/645 ,  H01L25/0657 ,  H01L25/18 ,  H01L27/0207 ,  H01L28/10 ,  H01L28/40 ,  H01L2225/06513 ,  H01L2225/06544 ,  H01L2225/06565 ,  H01L2924/0002 ,  H02M3/156 ,  H02M7/003 ,  H01L2924/00

Abstract: A voltage regulator for one or more dies in a multi-stack integrated circuit includes an inductor located on a die, a voltage controller that is electrically coupled to the inductor and is also located on the die, and a capacitor that is electrically coupled to the inductor and the voltage controller and is also located on the die. The inductor defines an interior space and the voltage controller and the capacitor are located within the interior space of the inductor. The inductor can be a lateral inductor or a through layer via inductor. The multi-stack integrated circuit may have multiple dies. A voltage controller may be electrically coupled to each of the dies, although it may be located on only one of the dies. Alternatively, separate voltage controllers may be electrically coupled to each of the multiple dies and may be located on each of the respective dies.

Abstract translation: 用于多堆叠集成电路中的一个或多个管芯的电压调节器包括位于管芯上的电感器，电耦合到电感器并且还位于管芯上的电压控制器，以及电耦合到 电感和电压控制器，也位于模具上。 电感器定义了内部空间，电压控制器和电容器位于电感器的内部空间内。 电感器可以是横向电感器或通过电感器的贯穿层。 多层集成电路可以具有多个管芯。 电压控制器可以电耦合到每个模具，尽管它可以仅位于一个模具上。 或者，单独的电压控制器可以电耦合到多个管芯中的每个，并且可以位于每个相应的管芯上。