公开(公告)号：WO2019133020A1

公开(公告)日：2019-07-04

申请号：PCT/US2017/069158

申请日：2017-12-30

Applicant: INTEL CORPORATION ,  DOGIAMIS, Georgios C. ,  OSTER, Sasha N. ,  ELSHERBINI, Adel A. ,  EWY, Erich N. ,  SWAN, Johanna M.

Inventor： DOGIAMIS, Georgios C. ,  OSTER, Sasha N. ,  ELSHERBINI, Adel A. ,  EWY, Erich N. ,  SWAN, Johanna M.

IPC: B60R16/023 ,  B60R16/03 ,  H04B1/08 ,  H04B1/3822 ,  H01P3/16

Abstract: Embodiments include a sensor node, an active sensor node, and a vehicle with a communication system that includes sensor nodes. The sensor node include a package substrate, a diplexer/combiner block on the package substrate, a transceiver communicatively coupled to the diplexer/combiner block, and a first mm-wave launcher coupled to the diplexer/combiner block. The sensor node may have a sensor communicatively coupled to the transceiver, the sensor is communicatively coupled to the transceiver by an electrical cable and located on the package substrate. The sensor node may include that the sensor operates at a frequency band for communicating with an electronic control unit (ECU) communicatively coupled to the sensor node. The sensor node may have a filter communicatively coupled to the diplexer/combiner block, the transceiver communicatively coupled to the filter, the filter substantially removes frequencies from RF signals other than the frequency band of the sensor.

公开(公告)号：WO2019132926A1

公开(公告)日：2019-07-04

申请号：PCT/US2017/068754

申请日：2017-12-28

Applicant: INTEL CORPORATION ,  KAMGAING, Telesphor ,  NAIR, Vijay K. ,  EID, Feras ,  DOGIAMIS, Georgios C. ,  SWAN, Johanna M. ,  LEUSCHNER, Stephan

Inventor： KAMGAING, Telesphor ,  NAIR, Vijay K. ,  EID, Feras ,  DOGIAMIS, Georgios C. ,  SWAN, Johanna M. ,  LEUSCHNER, Stephan

IPC: H03H9/145 ,  H03H9/02

Abstract: RF front end systems or modules with an acoustic wave resonator (AWR) on an interposer substrate are described. In an example, an integrated system includes an active die, the active die comprising a semiconductor substrate having a plurality of active circuits therein. An interposer is also included, the interposer comprising an acoustic wave resonator (AWR). A seal frame couples the active die to the interposer, the seal frame surrounding the acoustic wave resonator and hermetically sealing the acoustic wave resonator between the active die and the interposer.

公开(公告)号：WO2019132924A1

公开(公告)日：2019-07-04

申请号：PCT/US2017/068750

申请日：2017-12-28

Applicant: INTEL CORPORATION ,  EID, Feras ,  KAMGAING, Telesphor ,  DOGIAMIS, Georgios C. ,  NAIR, Vijay K. ,  SWAN, Johanna M.

Inventor： EID, Feras ,  KAMGAING, Telesphor ,  DOGIAMIS, Georgios C. ,  NAIR, Vijay K. ,  SWAN, Johanna M.

IPC: H03H9/64 ,  H03H9/25 ,  H03H9/145

Abstract: Packaged RF front end systems including a hybrid filter and an active circuit in a single package are described. In an example, a package includes an active die comprising an acoustic wave resonator. A package substrate is electrically coupled to the active die. A seal frame surrounds the acoustic wave resonator and is attached to the active die and to the package substrate, the seal frame hermetically sealing the acoustic wave resonator in a cavity between the active die and the package substrate.

公开(公告)号：WO2019005020A1

公开(公告)日：2019-01-03

申请号：PCT/US2017/039597

申请日：2017-06-27

Applicant: INTEL CORPORATION

Inventor： EID, Feras ,  ALEKSOV, Aleksandar ,  DOGIAMIS, Georgios C. ,  SOUNART, Thomas L. ,  SWAN, Johanna

IPC: H01L23/58 ,  H01L23/14 ,  H01L23/485 ,  H01L49/02 ,  H01L41/08

Abstract: Embodiments of the invention include a microelectronic device that includes a plurality of organic dielectric layers and a piezoelectrically actuated tunable capacitor having a variable capacitance formed in-situ with at least one organic dielectric layer of the plurality of organic dielectric layers. A piezoelectric actuator of the tunable capacitor includes first and second conductive electrodes and a piezoelectric layer that is positioned between the first and second conductive electrodes.

公开(公告)号：WO2018125241A1

公开(公告)日：2018-07-05

申请号：PCT/US2016/069622

申请日：2016-12-30

Applicant: INTEL CORPORATION

Inventor： KAMGAING, Telesphor ,  DOGIAMIS, Georgios C. ,  OSTER, Sasha N.

IPC: H01L23/00 ,  H01L23/488 ,  H01L23/522

Abstract: Embodiments of the invention include a microelectronic device that includes a substrate having transistor layers and interconnect layers including conductive layers to form connections to transistor layers. A capacitive bump is disposed on the interconnect layers. The capacitive bump includes a first electrode, a dielectric layer, and a second electrode. In another example, an inductive bump is disposed on the interconnect layers. The inductive bump includes a conductor and a magnetic layer that surrounds the conductor.

公开(公告)号：WO2018063683A1

公开(公告)日：2018-04-05

申请号：PCT/US2017/049217

申请日：2017-08-29

Applicant: INTEL CORPORATION

Inventor： LIFF, Shawna M. ,  ELSHERBINI, Adel A. ,  OSTER, Sasha N. ,  EID, Feras ,  DOGIAMIS, Georgios C. ,  SOUNART, Thomas L. ,  SWAN, Johanna M.

IPC: H01L41/113 ,  H01L41/04 ,  H01L41/047 ,  H01L41/187

CPC classification number: H04L41/0816 ,  A61B5/02055 ,  A61B5/021 ,  A61B5/02405 ,  A61B5/08 ,  A61B5/145 ,  A61B5/4266 ,  A61B5/4824 ,  A61B5/7282 ,  A61B5/7285 ,  A61B2560/0462 ,  H01H57/00 ,  H01H2037/008 ,  H01H2057/006 ,  H01L41/0471 ,  H01L41/094 ,  H01L41/187 ,  H01L41/1873 ,  H01L41/1876 ,  H04L41/0886

Abstract: Embodiments of the invention include a physiological sensor system. According to an embodiment the sensor system may include a package substrate, a plurality of sensors formed on the substrate, a second electrical component, and an encryption bank formed along a data transmission path between the plurality of sensors and the second electrical component. In an embodiment the encryption bank may include a plurality of portions that each have one or more switches integrated into the package substrate. In an embodiment each sensor transmits data to the second electrical component along different portions of the encryption bank. In some embodiments, the switches may be piezoelectrically actuated. In other embodiments the switches may be actuated by thermal expansion. Additional embodiments may include tri- or bi-stable mechanical switches.

Abstract translation: 本发明的实施例包括生理传感器系统。 根据一个实施例，传感器系统可以包括封装衬底，在衬底上形成的多个传感器，第二电部件以及沿着多个传感器和第二电部件之间的数据传输路径形成的加密组。 在一个实施例中，加密组可以包括多个部分，每个部分具有集成到封装衬底中的一个或多个开关。 在一个实施例中，每个传感器沿加密银行的不同部分向第二电子组件传输数据。 在一些实施例中，开关可以被压电致动。 在其他实施例中，开关可以通过热膨胀来致动。 其他实施例可以包括三稳或双稳机械开关。

公开(公告)号：WO2018063676A1

公开(公告)日：2018-04-05

申请号：PCT/US2017/049173

申请日：2017-08-29

Applicant: INTEL CORPORATION

Inventor： ELSHERBINI, Adel A. ,  OSTER, Sasha N. ,  SWAN, Johanna M. ,  DOGIAMIS, Georgios C. ,  LIFF, Shawna M. ,  ALEKSOV, Aleksandar ,  KAMGAING, Telesphor

IPC: H01P1/16 ,  H01P3/00 ,  H01Q13/02

CPC classification number: H01P5/1007 ,  H01P5/10 ,  H01P5/107 ,  H01P11/00 ,  H01Q13/02

Abstract: The systems and methods described herein provide a traveling wave launcher system physically and communicably coupled to a semiconductor package and to a waveguide. The traveling wave launcher system includes a slot-line signal converter and a tapered slot launcher. The slot-line signal converter may be formed integral with the semiconductor package and includes a balun structure that converts the microstrip signal to a slot-line signal. The tapered slot launcher is communicably coupled to the slot-line signal converter and includes a first plate and a second plate that form a slot. The tapered slot launcher converts the slot-line signal to a traveling wave signal that is propagated to the waveguide.

Abstract translation: 这里描述的系统和方法提供了一种行波发射器系统，其物理和可通信地耦合到半导体封装和波导。 行波发射器系统包括一个槽线信号转换器和一个锥形槽发射器。 槽线信号转换器可以与半导体封装整体形成并且包括将微带信号转换为槽线信号的平衡 - 不平衡转换器结构。 锥形槽发射器可通信地耦合到槽线信号转换器并且包括形成槽的第一板和第二板。 锥形槽发射器将槽线信号转换成传播到波​​导的行波信号。

公开(公告)号：WO2018063560A1

公开(公告)日：2018-04-05

申请号：PCT/US2017/047299

申请日：2017-08-17

Applicant: INTEL CORPORATION

Inventor： DOGIAMIS, Georgios C. ,  OSTER, Sasha N. ,  KAMGAING, Telesphor ,  ELSHERBINI, Adel A. ,  SWAN, Johanna M. ,  LIFF, Shawna M. ,  ALEKSOV, Aleksandar ,  RAWLINGS, Brandon M. ,  DISCHLER, Richard J.

IPC: G02B6/10 ,  G06F13/18 ,  G02B6/12

CPC classification number: H01P3/122 ,  G06F1/182 ,  H01P3/14 ,  H01P3/16 ,  H01P11/006

Abstract: An apparatus comprises a plurality of waveguides, wherein the waveguides include a dielectric material; an outer shell; and a supporting feature within the outer shell, wherein the waveguides are arranged separate from each other within the outer shell by the supporting feature.

Abstract translation: 一种设备包括多个波导，其中波导包括电介质材料; 外壳; 以及在外壳内的支撑特征，其中波导通过支撑特征彼此分离地布置在外壳内。

公开(公告)号：WO2018063341A8

公开(公告)日：2018-04-05

申请号：PCT/US2016/054832

申请日：2016-09-30

Applicant: INTEL CORPORATION

Inventor： ELSHERBINI, Adel A. ,  OSTER, Sasha, N. ,  DOGIAMIS, Georgios C. ,  KAMGAING, Telesphor ,  LIFF, Shawna M. ,  ALEKSOV, Aleksandar ,  SWAN, Johanna M. ,  RAWLINGS, Brandon M. ,  DISCHLER, Richard, J.

IPC: H01P3/02 ,  H01P3/127 ,  H01P3/12 ,  H01P3/16

Abstract: An apparatus comprises a waveguide including: an elongate waveguide core including a dielectric material, wherein the waveguide core includes at least one space arranged lengthwise along the waveguide core that is void of the dielectric material; and a conductive layer arranged around the waveguide core.

公开(公告)号：WO2018004689A1

公开(公告)日：2018-01-04

申请号：PCT/US2016/040844

申请日：2016-07-01

Applicant: INTEL CORPORATION

Inventor： DOGIAMIS, Georgios C. ,  ELSHERBINI, Adel A. ,  LIFF, Shawna M. ,  SWAN, Johanna ,  CULIC-VISKOTA, Jelena ,  SOUNART, Thomas L. ,  EID, Feras ,  OSTER, Sasha N.

IPC: G01R15/14 ,  G01R31/28 ,  H01L41/047 ,  H01L41/18 ,  H01L41/083

CPC classification number: G01R15/20 ,  G01R15/14 ,  G01R15/205 ,  G01R15/247 ,  H01L41/06 ,  H01L41/1132 ,  H01L41/125

Abstract: Embodiments of the invention include a current sensing device for sensing current in an organic substrate. The current sensing device includes a released base structure that is positioned in proximity to a cavity of the organic substrate and a piezoelectric film stack that is positioned in proximity to the released base structure. The piezoelectric film stack includes a piezoelectric material in contact with first and second electrodes. A magnetic field is applied to the current sensing device and this causes movement of the released base structure and the piezoelectric stack which induces a voltage (potential difference) between the first and second electrodes.

Abstract translation: 本发明的实施例包括用于感测有机衬底中的电流的电流感测装置。 电流感测装置包括释放的基底结构和定位在释放的基底结构附近的压电薄膜叠层，该释放的基底结构位于有机基底的空腔附近。 压电薄膜叠层包括与第一和第二电极接触的压电材料。 磁场被施加到电流感测装置，并且这导致释放的基础结构和压电叠堆的移动，其引起第一和第二电极之间的电压（电势差）。