公开(公告)号：US11868264B2

公开(公告)日：2024-01-09

申请号：US18168157

申请日：2023-02-13

Applicant: Intel Corporation

Inventor： Abhishek R. Appu ,  Altug Koker ,  Joydeep Ray ,  David Puffer ,  Prasoonkumar Surti ,  Lakshminarayanan Striramassarma ,  Vasanth Ranganathan ,  Kiran C. Veernapu ,  Balaji Vembu ,  Pattabhiraman K

IPC: G06F12/0877 ,  G06F12/0802 ,  G06F12/0855 ,  G06F12/0806 ,  G06F12/0846 ,  G06F12/0868 ,  G06T1/60 ,  G06F12/126 ,  G06F12/0893

CPC classification number: G06F12/0877 ,  G06F12/0802 ,  G06F12/0806 ,  G06F12/0848 ,  G06F12/0855 ,  G06F12/0868 ,  G06F12/126 ,  G06T1/60 ,  G06F12/0893

Abstract: One embodiment provides circuitry coupled with cache memory and a memory interface, the circuitry to compress compute data at multiple cache line granularity, and a processing resource coupled with the memory interface and the cache memory. The processing resource is configured to perform a general-purpose compute operation on compute data associated with multiple cache lines of the cache memory. The circuitry is configured to compress the compute data before a write of the compute data via the memory interface to the memory bus, in association with a read of the compute data associated with the multiple cache lines via the memory interface, decompress the compute data, and provide the decompressed compute data to the processing resource.

公开(公告)号：US20240005443A1

公开(公告)日：2024-01-04

申请号：US18455128

申请日：2023-08-24

Applicant: Intel Corporation

Inventor： Naveen Matam ,  Lance Cheney ,  Eric Finley ,  Varghese George ,  Sanjeev Jahagirdar ,  Altug Koker ,  Josh Mastronarde ,  Iqbal Rajwani ,  Lakshminarayanan Striramassarma ,  Melaku Teshome ,  Vikranth Vemulapalli ,  Binoj Xavier

IPC: G06T1/20 ,  G06F13/40

CPC classification number: G06T1/20 ,  G06F13/4027

Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially and distinctly packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.

公开(公告)号：US11410266B2

公开(公告)日：2022-08-09

申请号：US17069188

申请日：2020-10-13

Applicant: Intel Corporation

Inventor： Naveen Matam ,  Lance Cheney ,  Eric Finley ,  Varghese George ,  Sanjeev Jahagirdar ,  Altug Koker ,  Josh Mastronarde ,  Iqbal Rajwani ,  Lakshminarayanan Striramassarma ,  Melaku Teshome ,  Vikranth Vemulapalli ,  Binoj Xavier

IPC: G06T1/20 ,  G06F13/40

Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.

公开(公告)号：US11386521B2

公开(公告)日：2022-07-12

申请号：US17161941

申请日：2021-01-29

Applicant: Intel Corporation

Inventor： Altug Koker ,  Lance Cheney ,  Eric Finley ,  Varghese George ,  Sanjeev Jahagirdar ,  Josh Mastronarde ,  Naveen Matam ,  Iqbal Rajwani ,  Lakshminarayanan Striramassarma ,  Melaku Teshome ,  Vikranth Vemulapalli ,  Binoj Xavier

IPC: G06T1/20 ,  G06F13/40

Abstract: A disaggregated processor package can be configured to accept interchangeable chiplets. Interchangeability is enabled by specifying a standard physical interconnect for chiplets that can enable the chiplet to interface with a fabric or bridge interconnect. Chiplets from different IP designers can conform to the common interconnect, enabling such chiplets to be interchangeable during assembly. The fabric and bridge interconnects logic on the chiplet can then be configured to confirm with the actual interconnect layout of the on-board logic of the chiplet. Additionally, data from chiplets can be transmitted across an inter-chiplet fabric using encapsulation, such that the actual data being transferred is opaque to the fabric, further enable interchangeability of the individual chiplets. With such an interchangeable design, higher or lower density memory can be inserted into memory chiplet slots, while compute or graphics chiplets with a higher or lower core count can be inserted into logic chiplet slots.

公开(公告)号：US11263141B2

公开(公告)日：2022-03-01

申请号：US17026264

申请日：2020-09-20

Applicant: Intel Corporation

Inventor： Abhishek R. Appu ,  Altug Koker ,  Joydeep Ray ,  David Puffer ,  Prasoonkumar Surti ,  Lakshminarayanan Striramassarma ,  Vasanth Ranganathan ,  Kiran C. Veernapu ,  Balaji Vembu ,  Pattabhiraman K

IPC: G06F12/0877 ,  G06F12/0802 ,  G06F12/0855 ,  G06F12/0806 ,  G06F12/0846 ,  G06F12/0868 ,  G06T1/60 ,  G06F12/126 ,  G06F12/0893

Abstract: In an example, an apparatus comprises a plurality of execution units, and a cache memory communicatively coupled to the plurality of execution units, wherein the cache memory is structured into a plurality of sectors, wherein each sector in the plurality of sectors comprises at least two cache lines. Other embodiments are also disclosed and claimed.

公开(公告)号：US20220058852A1

公开(公告)日：2022-02-24

申请号：US17497618

申请日：2021-10-08

Applicant: Intel Corporation

Inventor： Prasoonkumar Surti ,  Arthur Hunter ,  Kamal Sinha ,  Scott Janus ,  Brent Insko ,  Vasanth Ranganathan ,  Lakshminarayanan Striramassarma

IPC: G06T15/00 ,  G06T1/20 ,  G06T1/60 ,  G06T17/20

Abstract: Embodiments are generally directed to multi-tile graphics processor rendering. An embodiment of an apparatus includes a memory for storage of data; and one or more processors including a graphics processing unit (GPU) to process data, wherein the GPU includes a plurality of GPU tiles, wherein, upon geometric data being assigned to each of a plurality of screen tiles, the apparatus is to transfer the geometric data to the plurality of GPU tiles.

公开(公告)号：US20220036500A1

公开(公告)日：2022-02-03

申请号：US17500375

申请日：2021-10-13

Applicant: Intel Corporation

Inventor： Naveen Matam ,  Lance Cheney ,  Eric Finley ,  Varghese George ,  Sanjeev Jahagirdar ,  Altug Koker ,  Josh Mastronarde ,  Iqbal Rajwani ,  Lakshminarayanan Striramassarma ,  Melaku Teshome ,  Vikranth Vemulapalli ,  Binoj Xavier

IPC: G06T1/20 ,  G06F13/40

Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially and distinctly packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.

公开(公告)号：US20210303481A1

公开(公告)日：2021-09-30

申请号：US17212503

申请日：2021-03-25

Applicant: Intel Corporation

Inventor： Joydeep Ray ,  Altug Koker ,  Elmoustapha Ould-Ahmed-Vall ,  Michael Macpherson ,  Aravindh V. Anantaraman ,  Vasanth Ranganathan ,  Lakshminarayanan Striramassarma ,  Varghese George ,  Abhishek Appu ,  Prasoonkumar Surti

IPC: G06F13/16 ,  G06F9/50 ,  G06F9/38 ,  G06F9/30 ,  G06T1/20 ,  G06T1/60

Abstract: An apparatus to facilitate efficient data sharing for graphics data processing operations is disclosed. The apparatus includes a processing resource to generate a stream of instructions, an L1 cache communicably coupled to the processing resource and comprising an on-page detector circuit to determine that a set of memory requests in the stream of instructions access a same memory page; and set a marker in a first request of the set of memory requests; and arbitration circuitry communicably coupled to the L1 cache, the arbitration circuitry to route the set of memory requests to memory comprising the memory page and to, in response to receiving the first request with the marker set, remain with the processing resource to process the set of memory requests.

公开(公告)号：US20210193196A1

公开(公告)日：2021-06-24

申请号：US16725747

申请日：2019-12-23

Applicant: Intel Corporation

Inventor： Charles Augustine ,  Somnath Paul ,  Turbo Majumder ,  Iqbal Rajwani ,  Andrew Lines ,  Altug Koker ,  Lakshminarayanan Striramassarma ,  Muhammad Khellah

IPC: G11C7/10 ,  G11C7/12 ,  G11C7/22

Abstract: Prior knowledge of access pattern is leveraged to improve energy dissipation for general matrix operations. This improves memory access energy for a multitude of applications such as image processing, deep neural networks, and scientific computing workloads, for example. In some embodiments, prior knowledge of access pattern allows for burst read and/or write operations. As such, burst mode solution can provide energy savings in both READ (RD) and WRITE (WR) operations. For machine learning or inference, the weight values are known ahead in time (e.g., inference operation), and so the unused bytes in the cache line are exploited to store a sparsity map that is used for disabling read from either upper or lower half of the cache line, thus saving dynamic capacitance.

公开(公告)号：US20210035258A1

公开(公告)日：2021-02-04

申请号：US17064427

申请日：2020-10-06

Applicant: Intel Corporation

Inventor： Joydeep Ray ,  Scott Janus ,  Varghese George ,  Subramaniam Maiyuran ,  Altug Koker ,  Abhishek Appu ,  Prasoonkumar Surti ,  Vasanth Ranganathan ,  Andrei Valentin ,  Ashutosh Garg ,  Yoav Harel ,  Arthur Hunter, JR. ,  SungYe Kim ,  Mike Macpherson ,  Elmoustapha Ould-Ahmed-Vall ,  William Sadler ,  Lakshminarayanan Striramassarma ,  Vikranth Vemulapalli

IPC: G06T1/20 ,  G06F9/50 ,  G06F15/80 ,  G06F12/0806 ,  G06N3/04 ,  G06N3/08 ,  G06F17/16

Abstract: Embodiments described herein include, software, firmware, and hardware logic that provides techniques to perform arithmetic on sparse data via a systolic processing unit. Embodiment described herein provided techniques to skip computational operations for zero filled matrices and sub-matrices. Embodiments additionally provide techniques to maintain data compression through to a processing unit. Embodiments additionally provide an architecture for a sparse aware logic unit.