Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive composition having high radiation sensitivity and a development margin that achieves formation of a preferable pattern feature even a developing time exceeds the optimum developing time in a developing process, and capable of forming a patterned thin film with excellent adhesiveness, and to provide an interlayer insulating film and a microlens formed from the composition. SOLUTION: The radiation-sensitive resin composition contains: a copolymer of an unsaturated carboxylic acid and/or an unsaturated carboxylic acid anhydride, an epoxy group-containing unsaturated compound, a phenolic skeleton-containing unsaturated compound, and an unsaturated compound except the above described compounds; and a 1, 2-quinone diazide compound. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition capable of forming microlenses excellent in thickness, resolution, pattern shape, heat resistance, transparency, heat discoloration resistance, solvent resistance, and also capable of having good storage stability. SOLUTION: The radiation sensitive resin composition comprises: (A) an alkali-soluble copolymer obtained by polymerizing 100 wt.%, in total, of 10-50 wt.% of a polymerizable unsaturated compound (a) having an acidic functional group, 20-60 wt.% of a polymerizable unsaturated compound (b) having an alicyclic hydrocarbon group but not having an acidic functional group and 5-40 wt.% of another polymerizable unsaturated compound (c); (B) a polymerizable unsaturated compound including a polymerizable unsaturated compound having an alicyclic hydrocarbon group but not having an acidic functional group as an essential component; and (C) a photopolymerization initiator. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which is suitably used for simultaneously forming protrusions and spacers of a vertically aligned liquid crystal display element. SOLUTION: The radiation-sensitive resin composition for forming the protrusions and/or the spacers for the vertical alignment liquid crystal display element contains a copolymer [A] of an unsaturated carboxylic acid and/or an unsaturated carboxylic acid anhydride (a1), an unsaturated compound containing at least a skeleton selected from a group of a tetrahydrofuran skeleton, a furan skeleton, a tetrahydropyran skeleton, a pyran skeleton, a lactone skeleton, an oxyethylene skeleton with two to ten repeating units, and an oxypropylene skeleton with two to ten repeating units (a2), and an olefinically unsaturated compound (a3) other than (a1) and (a2); and a 1,2-quinone diazide compound [B]. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To achieve enhancing curability of a resin composition and a photosensitive composition suitably used for forming a surface protective film and an interlayer insulator which electronic parts and the like have, and reducing an internal stress remaining on a board when forming a cured film on the board using the composition.SOLUTION: There is provided a photosensitive composition containing (A) a resin having a phenolic hydroxyl group, (B1) a crosslinking agent having at least two oxazoline groups, (B2) a crosslinking agent having at least two groups represented by -CHOR, where R is a hydrogen atom, an alkyl group or an acetyl group having 1 to 10 carbon atoms, and (C) a photosensitive acid generator.
Abstract:
PROBLEM TO BE SOLVED: To provide: a resin composition capable of forming a cured film excellent in elongation property; a polymer suitable as a constituting component of the composition; a cured film formed from the composition; and electronic parts having the cured film.SOLUTION: A resin composition contains: (A) a polymer having a structural unit represented by formula (a1) and having a hydroxyl group, and a structural unit represented by formula (a2) and having a cationically polymerizable group; and (F) a solvent.
Abstract:
PROBLEM TO BE SOLVED: To provide a positive radiation sensitive resin composition which excels in application property and radiation sensitivity, provides good pattern form and can form an interlayer insulating film having excellent heat resistance, solvent resistance, light transmittance, dry-etching resistance, and the interlayer insulating film obtained from the composition and a method for forming the film. SOLUTION: The radiation sensitive resin composition is a positive radiation sensitive resin composition containing [A] an alkali-soluble resin, [B] 1,2-quinone diazide compound, and [C] a compound represented by the general formula (1), and is achieved by the interlayer insulating film made thereof and method of forming them. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a polysiloxane based positive radiation sensitive composition which can form an interlayer insulation film having superior storage stability, radiation sensitivity, and melt flow-proofness, and high various performance such as surface hardness, refractive index, heat resistance, transparency, or low dielectric property. SOLUTION: The positive radiation sensitive composition includes [A] polysiloxane, [B] photoacid generator or photobase generator, and [C] metal chelate compound. Preferably, [A] polysiloxane is polysiloxane obtained by hydrolysis condensation of hydrolyzable silane compound under presence of [C] metal chelate compound, and [B] photoacid generator contains quinonediazide. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having high sensitivity to radiation, capable of forming an interlayer dielectric having adhesion, high heat resistance, resolution, high transmittance and high reliability, capable of forming a microlens having high transmittance and a good melt figure when the composition is used for forming a microlens, and having excellent storage stability. SOLUTION: The radiation-sensitive resin composition contains (A) a copolymer and (B) a 1,2-quinonediazide compound, wherein the copolymer (A) contains a copolymer produced through a step of polymerizing monomers containing (a1) an unsaturated carboxylic acid and/or an unsaturated carboxylic acid anhydride and (a2) an epoxy group-containing unsaturated compound in the presence of a compound expressed by formula (1). In formula (1), Z 1 and Z 2 each independently represents a benzyl group which may be substituted with an alkyl group having 4 to 18 C. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having an extremely little amount of a volatile component generated upon forming a spacer, and capable of responding to high-speed coating by a slit die coating method. SOLUTION: The radiation-sensitive resin composition contains: [A] a polymer having at least one group selected from carboxyl groups and carboxylic acid anhydride groups, and a group derived from a specified polyvalent thiol compound represented by pentaerythritol tetrakis(3-mercaptopropionate), and having a ratio (Mw/Mn) of 1.0 to 2.8, which is a ratio of a weight average molecular weight (Mw) in terms of polystyrene to a number average molecular weight (Mn) in terms of polystyrene measured by gel permeation chromatography; [B] a polymerizable unsaturated compound; and [C] a radiation-sensitive polymerization initiator. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having high radiation sensitivity, having such a development margin as to form a good pattern profile even in a developing time exceeding the optimum developing time in a developing step, and capable of easily forming a patterned thin film excellent in adhesion. SOLUTION: The radiation-sensitive resin composition comprises: [A] a copolymer of (a1) at least one compound selected from the group consisting of unsaturated carboxylic acids and unsaturated carboxylic acid anhydrides, (a2) an unsaturated compound having at least one group selected from the group consisting of an oxiranyl group and an oxetanyl group, and (a3) an unsaturated compound other than the compounds (a1) and (a2); [B] a 1,2-quinonediazide compound; and [C] a compound having an alicyclic oxiranyl group but not having a carboxyl group. The radiation-sensitive resin composition is suitable for use particularly in the formation of an interlayer insulation film or microlenses. COPYRIGHT: (C)2009,JPO&INPIT