Abstract:
PURPOSE:To realize element isolation as patterned by using selective isolation by a method wherein hydrazine is used for etching a silicon substrate for the formation of a U-geometry groove, a silicon nitride film is formed on the entire surface except on the bottom of the U-geometry groove, and an isolating oxide film is formed in the U-geometry groove. CONSTITUTION:After the formation of an oxide film 8 by thermal oxidation on the surface of a silicon substrate 4, a window 9 is provided in an element isolating region which is for the isolation of an element region 20 for the formation of a semiconductor element, an anisotropic etching process is accomplished for the silicon substrate 4 through the window 9, and the etching process is stopped midway for the formation of a V groove 11 with its cross section shaped after the letter U. Next, a silicon nitride film 12 is formed to serve as a mask for selective oxidation and a window 13 is provided in the silicon nitride film 12 only in the bottom of the V groove 11. Under such conditions, an isolating oxide film 14 fills up the V groove 11 after oxidation is accomplished for the isolating region. The silicon nitride film 12 impedes the isolating oxide film 14 from going into under the insulating region, which prevents bird's beaks. In this way, an element region is prevented from growing larger than necessary. The silicon nitride film is then removed for the establishment of high- precision element isolation.
Abstract:
PURPOSE:To improve wet oxidation of an wafer by a method wherein vapor and oxygen only are supplied to the central part of a quartz tube. CONSTITUTION:An introduction tube 5 is branched at the connecting part 10 to the quartz tube 4 into a gas tube 5a and an water drop tube 5b. The gas tube 5a is protruded inside toward the axially central direction of the quartz tube 4, and the water drop tube 5b is made to creep on the inside bottom of the quartz tube 4. Water drops 9 condensed in dews roll down the water drop tube 5b at the connecting part 10, and vapor and oxygen only are absorbed in the central part of the quartz tube 4.
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor sensor, and its manufacturing method, capable of ensuring the airtightness of a space for housing the components of a moving part and a detecting element with good reproducibility, while enhancing the reproducibility of the electric property of a connecting part which electrically connects one end part of a feedthrough wiring conductor to the other end of which is connected to the conductor pattern of a packaging board without using a bonding wire, and a conductive material portion being opposed to the one end part. SOLUTION: A first board 2 for a package is joined to one surface side of a sensor chip 1 having a weight portion 12 and a bending portion 13 as the moving part, and a second board 3 for a package is joined to the other surface side. A recession 25 formed in the first board 2 constitutes a recession for housing a pad 15 being the conductive material portion. The volume of the internal space of the recession is set to a value capable of house a connecting part 24 connecting the pad 15 and the feedthrough wiring conductor 23 electrically, in addition to the pad 15. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an optical switch preventing an increase of an optical loss by enhancing the strength of mirror units formed according to a semiconductor process and the optical switch made by matrically arranging them and performing an accurate mirror operation. SOLUTION: The optical switch is provided with a mirror unit 60 which has a mirror 111 for reflecting a light beam; a support part 302 for movably supporting the mirror 111 and a movable part for moving the mirror 111, and switches an optical path of the light beam by the movement of the mirror 111, wherein a side wall 101 having cut-out parts on the optical path is disposed on the surrounding of the mirror unit 60 (a frame part 301). COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a packaged electronic part which is given a highly reliable sealing property by surely adhering a device with a protective member without specifying an adhesive agent. SOLUTION: The package electronic part is provided with a substrate 5, a device 1 formed or mounted on/to the substrate 5, and a transparent protective member 2 to cover and protect the device 1. A photo-curing material 3 is used to seal a space between the device 1 and the protective member 2 together with its periphery, and a light (ultraviolet ray) is given thereto from the upside of the protective member 2 to photo-cure the photo-curing material 3. Furthermore, a thermosetting material 4 is applied as to cover the photo-curing material 3 and to fit the protective member 2 to the substrate 5, and the whole body is thermally cured to make the packaged electronic part. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a matrix type optical switch in which a loss of light propagating on an optical path is suppressed, and method of manufacturing the matrix type optical switch. SOLUTION: The matrix type optical switch includes N×M movable mirrors R 1, 1 -R N, M disposed at crossings of optical paths (grooves) 2 rrayed in a grid shape and graded-index optical fibers Fr 1, 1 -Fr N-1, M , Fc 1, 1 -Fc N, M-1 inserted between adjacent mirrors R 1, 1 -R N, M , wherein the optical paths 2 are switched by putting the movable mirrors R 1, 1 -R N, M into and out of the crossings of the optical paths 2, and refractive index of the graded-index optical fibers Fr 1, 1 -Fr N-1, M , Fc 1, 1 -Fc N, M-1 are decreased diametrically from their center axis. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor structure having a movable part which is separated from a support substrate and composed of structurally integrated and electrically separated two or more parts. SOLUTION: The method for manufacturing a semiconductor structure has a recessed part forming process, in which a recessed part is formed by selectively removing a first substrate from a first main surface of the first substrate, a recessed part embedding process, in which an insulator is embedded to the recessed part, and a rear face etching process in which a protruding part of the first substrate having the embedded insulator is left behind by uniformly removing the first substrate from a second main surface arranged oppositely to the first main surface. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an optical switch which can decrease insertion loss and cross talk. SOLUTION: The optical switch operates in such a manner that at least a pair of opposing optical waveguides is intersected with each other and the optical paths of light beams are switched by inserting and retracting a reflector into and from the intersection of the optical waveguides. In the state where the reflector is inserted into the intersection, the reflector is in a size larger than an ellipse having the diameter twice or more of the diameter of the light beam on the reflector with respect to the center of the light beam as the reference. Or, in the state where the reflector is retracted from the intersection, the reflector does not overlap the ellipse having the diameter twice the diameter of the light beam with respect to the center of the light beam as the reference. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an electrostatic actuator for holding the displaced state of a needle even when a voltage applied between a movable electrode and a fixed electrode is eliminated and more saving a power consumption. SOLUTION: The electrostatic actuator comprises the movable electrode 2 provided on the needle 21 integrally formed through an elastic supporting body 22 at a fixed part 23 fixed on the surface of a supporting substrate 1, a fixed electrode 3 fixed on the supporting substrate 1 and made to face the movable electrode 2 at an interval so as to be capacitively coupled, a switch plate 4 erected on the needle 21 for passing through light when the needle 21 is at one position and interrupting the light when it is at the other position; and a holding means composed of a fixed engaging part 6 recess-projection connected with a movable engaging part 5 fixed to the supporting substrate 1 and projectingly provided from the needle 1. Corresponding to electrostatic force generated between the movable electrode 2 and the fixed electrode 3, the recess-projection engagement of the movable engaging part 5 and the fixed engaging part 6 is set and released and the needle 21 is displaced. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a three-axis acceleration sensor with improved sensitivity by narrowing the essential total width of a beam for constituting a flexible part. SOLUTION: A flexible part 2 is constituted of two parallel beams 21 and another beam 22 that is formed for connecting base parts at the side of a fixing part, and the width of the essential flexible part 2 is narrowed. A piezo resistor 23 or 24 for x or y axis is formed at the connection site with a connection part 3 of each beam 21, and a piezo resistor 25 for z axis is formed at another beam 22.