公开(公告)号：JP2004205961A

公开(公告)日：2004-07-22

申请号：JP2002377302

申请日：2002-12-26

Applicant: Ngk Insulators Ltd ,  日本碍子株式会社

Inventor： TOYODA SHUHEI ,  FUKUYAMA MASASHI ,  IWASAKI YASUNORI

IPC: G02B6/42 ,  H01L23/02 ,  H01L31/02 ,  H01S5/022

Abstract: PROBLEM TO BE SOLVED: To provide an optical element package which has a sealed structure facilitating and stabilizing sealing, is miniaturized, reduces the number of parts, improves yield and is capable of efficiently propagating (transmitting) light.
SOLUTION: In an optical element package 10 provided with a package 2 having two or more input/output openings 3, an optical element 1 housed inside the package 2, a connecting member 4a for ensuring optical connection between the optical element 1 and external equipment and a sealed structure 5a for sealing the input/output openings 3 and air-tightly holding the optical element 1 inside the package 2, the connecting member 4a comprises the sealed structure by closing the input/output openings 3 of the package 2 with at least its one part.
COPYRIGHT: (C)2004,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种具有促进和稳定密封的密封结构的光学元件封装，其小型化，减少部件数量，提高产量并能够有效地传播（传输）光。 解决方案：在设置有具有两个或更多个输入/输出开口3的封装2的光学元件封装10中，容纳在封装2内部的光学元件1，用于确保光学元件1和 外部设备和用于密封输入/输出开口3并将光学元件1气密地保持在包装2内部的密封结构5a，连接构件4a包括通过将包装2的输入/输出开口3关闭的密封结构， 至少其一部分。 版权所有（C）2004，JPO＆NCIPI

公开(公告)号：JP2002190650A

公开(公告)日：2002-07-05

申请号：JP2000391324

申请日：2000-12-22

Applicant: NGK INSULATORS LTD

Inventor： KATO HIROSHI ,  ASANO MURAHITO ,  TANI TAKUHIRO ,  IWASAKI YASUNORI

IPC: H01S5/40 ,  H01S5/022 ,  H01S5/068

Abstract: PROBLEM TO BE SOLVED: To suppress variation in a laser drive current, when laser diodes multi-channeled in a parallel arrangement operate at a high speed. SOLUTION: The current supply structure of a parallel multichannel laser diode is constituted in a structure that a strip-shaped power supply pattern 3 for supplying a drive current to each laser diode 1 is formed adjacent to the array of the laser diodes 1, 1... mounted on a substrate 2. This pattern 3 has current introducing pads 4 and 4 for receiving the supply of a current on its left and right end parts and at the same time, bonding pads 5 are respectively projected between the laser diode arrays corresponding to the laser diodes 1 and the bonding pads 5 are wire-bonded with a package side power supply line 9 formed in the vicinity of the substrate 2.

公开(公告)号：JP2002190639A

公开(公告)日：2002-07-05

申请号：JP2000391313

申请日：2000-12-22

Applicant: NGK INSULATORS LTD

Inventor： KATO HIROSHI ,  ASANO MURAHITO ,  TANI TAKUHIRO ,  IWASAKI YASUNORI

IPC: H01S5/042 ,  H01S5/022

Abstract: PROBLEM TO BE SOLVED: To enable stable high-speed operation of laser diodes. SOLUTION: The apparatus includes a submount substrate 1 having a plurality of laser diodes 6, 6,..., 6 arranged side by side as well as a driver IC 2 having current switch circuits 3 for driving the laser diodes 6, a buffer circuit 4, an input amplifier circuit 5 and so on. A strip of power supply pattern 8 is formed on the substrate 1 next to the row of diodes 6, and connection pads 14 for supplying a current to the current switch circuit 3 are provided adjacent to interconnections with the respective diodes 6 to supply the operational current from the pads 14 to the switch circuit 3 via wire bonding.

公开(公告)号：JP2012085286A

公开(公告)日：2012-04-26

申请号：JP2011220316

申请日：2011-10-04

Applicant: Ngk Insulators Ltd ,  日本碍子株式会社

Inventor： KOBAYASHI HIROTOSHI ,  SAKURAI TAKAFUMI ,  HORI YUJI ,  IWASAKI YASUNORI

IPC: H03H3/08 ,  H01L41/09 ,  H01L41/18 ,  H01L41/22 ,  H01L41/24 ,  H03H9/25

CPC classification number: H03H9/0585 ,  H03H3/10 ,  H03H9/02574 ,  H03H9/02622 ,  Y10T29/42

Abstract: PROBLEM TO BE SOLVED: To prevent bubbles from being produced in a composite substrate where a piezoelectric substrate and a support substrate are bonded via an adhesive layer.SOLUTION: (a) A piezoelectric substrate 21 having micro protrusions and recesses formed on the rear surface 11a, and a support substrate 12 having a thermal expansion coefficient smaller than that of the piezoelectric substrate 21 are prepared. (b) A filling layer 23 is formed by coating the rear surface 11a with a filer to fill in the micro protrusions and recesses. (c) Surface of the filling layer 23 is mirror finished so that the arithmetic average roughness Ra becomes smaller than that of the rear surface 11a in (a). (d) Surface 13a of a filling layer 13 and surface of the support substrate 12 are bonded via an adhesive layer 14 to form a composite substrate 20.

Abstract translation: 要解决的问题：为了防止在压电基板和支撑基板经由粘合剂层接合的复合基板中产生气泡。 解决方案：（a）制备具有形成在后表面11a上的微小突起和凹陷的压电基片21和热膨胀系数小于压电基片21的热膨胀系数的支撑基片12。 （b）填充层23通过利用滤光片涂覆后表面11a而形成，以填充微型突出部和凹部。 （c）填充层23的表面被镜面加工，使得算术平均粗糙度Ra比（a）中的后表面11a的算术平均粗糙度Ra小。 （d）填充层13的表面13a和支撑基板12的表面经由粘合剂层14接合以形成复合基板20.版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2011254354A

公开(公告)日：2011-12-15

申请号：JP2010127699

申请日：2010-06-03

Applicant: Ngk Insulators Ltd ,  日本碍子株式会社

Inventor： KOBAYASHI HIROKI ,  HORI YUJI ,  IWASAKI YASUNORI

IPC: H03H9/145 ,  H03H9/25

Abstract: PROBLEM TO BE SOLVED: To reduce a noise to a surface acoustic wave when a composite substrate including a piezoelectric substrate and a support substrate joined together with a resin adhesion layer is used as a surface acoustic wave device.SOLUTION: An adhesion layer 13 joining a rear face of a piezoelectric substrate 11 and a support substrate 12 and comprising a resin adhesive composition contains particles comprising a substance having an elastic modulus higher than that of the adhesive composition. Accordingly, a noise to a surface acoustic wave can be reduced when the composite substrate 10 is used as a surface acoustic wave device.

Abstract translation: 要解决的问题：当使用包括与树脂粘附层接合在一起的压电基板和支撑基板的复合基板作为表面声波装置时，将声音降低到表面声波。 解决方案：将压电基板11的后表面和支撑基板12连接并包括树脂粘合剂组合物的粘附层13含有包含弹性模量高于粘合剂组合物的物质的颗粒。 因此，当将复合基板10用作表面声波装置时，可以降低对声表面波的噪声。 版权所有（C）2012，JPO＆INPIT

公开(公告)号：JP2011135535A

公开(公告)日：2011-07-07

申请号：JP2009295653

申请日：2009-12-25

Applicant: Ngk Insulators Ltd ,  日本碍子株式会社

Inventor： KOBAYASHI HIROTOSHI ,  HORI YUJI ,  IWASAKI YASUNORI

IPC: H03H9/25 ,  H01L41/09 ,  H01L41/18 ,  H01L41/187 ,  H01L41/22 ,  H01L41/313 ,  H01L41/337 ,  H03H3/08

Abstract: PROBLEM TO BE SOLVED: To provide a composite substrate in which occurrence of cracking in grinding of a piezoelectric substrate can be suppressed and occurrence of cracking in handling can also be suppressed. SOLUTION: In the composite substrate 10, a piezoelectric substrate 12 capable of propagating an elastic wave and a supporting substrate 14 having a smaller thermal expansion coefficient than that of the piezoelectric substrate 12 are stuck to each other via an organic adhesive layer 16. On a surface of the piezoelectric substrate 12, a groove 18 is formed over the entire circumference on an inner side than the outer circumferential edge. In the groove 18, a longitudinal cross section is approximately V-shaped, and a bottom part of the groove 18 reaches the supporting substrate 14, but since longitudinal cross-sectional shape of the groove 18 becomes gradually thinner from an opening toward the bottom part, the supporting substrate 14 is merely shaved just a little. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 解决的问题：提供能够抑制压电基板的磨削发生发生的复合基板，也可以抑制处理开裂的发生。 解决方案：在复合基板10中，能够传播弹性波的压电基板12和具有比压电基板12的热膨胀系数小的热膨胀系数的支撑基板14通过有机粘合剂层16彼此粘合 在压电基板12的表面上，在比外周边缘更内侧的整个圆周上形成有槽18。 在槽18中，纵向截面为大致V字状，槽18的底部到达支撑基板14，但由于槽18的纵截面形状从开口向底部逐渐变薄 ，支撑基板14只是略微剃光一次。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2011120226A

公开(公告)日：2011-06-16

申请号：JP2010240415

申请日：2010-10-27

Applicant: Ngk Insulators Ltd ,  日本碍子株式会社

Inventor： KOBAYASHI HIROTOSHI ,  HORI YUJI ,  IWASAKI YASUNORI

IPC: H03H9/145 ,  H01L41/09 ,  H01L41/18 ,  H01L41/22 ,  H01L41/313 ,  H01L41/338 ,  H03H3/08

Abstract: PROBLEM TO BE SOLVED: To further suppress occurrence of trouble caused by heating, in an elastic-wave device composed, by sticking a piezoelectric substrate onto a support substrate via an adhesive layer. SOLUTION: The elastic-wave device 30 includes the piezoelectric substrate 42 formed with electrodes; the support substrate 44; and the adhesive layer 46 for sticking the piezoelectric substrate 42 to the support substrate 44, wherein a swollen part 43 is formed on the piezoelectric substrate 42 to be formed into a projecting shape from the piezoelectric substrate 42 side toward the support substrate 44 side. The elastic-wave device 30 is formed with bent parts 48 on the support substrate 44, and is formed so as to have the outer peripheries from a surface 41 of the piezoelectric substrate 42 reduce, toward the bent parts 48 of the support substrate 44 and to set the sizes of the outer peripheries equal to one another from the bent parts 48 toward the back face 45. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：通过经由粘合剂层将压电基板粘贴到支撑基板上而构成的弹性波装置中，为了进一步抑制加热引起的故障的发生。 解决方案：弹性波装置30包括形成有电极的压电基板42; 支撑基板44; 以及用于将压电基板42粘贴到支撑基板44的粘合层46，其中在压电基板42上形成有从压电基板42侧朝向支撑基板44侧形成为突出形状的膨胀部43。 弹性波装置30在支撑基板44上形成有弯曲部48，并且形成为使压电基板42的表面41的外周朝向支撑基板44的弯曲部48减小， 将外周的尺寸从弯曲部48朝向背面45彼此相等。版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2011071967A

公开(公告)日：2011-04-07

申请号：JP2010185765

申请日：2010-08-23

Applicant: Ngk Insulators Ltd ,  日本碍子株式会社

Inventor： HORI YUJI ,  KOBAYASHI HIROTOSHI ,  IWASAKI YASUNORI

IPC: H03H3/08 ,  H03H9/145

CPC classification number: H03H9/02574 ,  H01L21/6836 ,  H01L2221/6834 ,  H01L2221/68359 ,  H03H3/02

Abstract: PROBLEM TO BE SOLVED: To further reduce restrictions in a manufacturing process, with respect to a composite substrate structured by bonding a first substrate with a second substrate through an adhesion layer.
SOLUTION: A method for manufacturing a composite substrate 10 includes: a formation step of forming a structural element portion 31 on a front surface of a first substrate 12; a grinding step of fixing the first substrate 12 and grinding a back surface 13 of the first substrate 12; and a sticking step of sticking a second substrate 14 to the ground back surface 13 with an adhesion layer 16 composed of an adhesive. In such a manner, before forming the adhesion layer 16, the handling properties of which are affected by heating, and before grinding the first substrate, the strength of which is decreased by grinding, a process of forming the structural element portion 31, including a heating step, is performed. Furthermore, a piezoelectric substrate may be used as the first substrate 12, and a supporting substrate which supports the piezoelectric substrate may also be used as the second substrate 14. An electrode 18 for an acoustic wave device may also be formed on the front surface 11 of the first substrate 12 as the structural element portion 31.
COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：为了进一步减少制造过程中的限制，关于通过粘合层将第一基板与第二基板结合而构成的复合基板。 ＆lt; P＆gt;解决方案：复合基板10的制造方法包括：在第一基板12的前表面上形成结构元件部31的形成工序; 固定第一基板12并研磨第一基板12的背面13的研磨步骤; 以及利用由粘合剂构成的粘合层16将第二基板14粘贴到背面13的粘贴工序。 以这种方式，在形成粘合层16之前，其处理性能受加热影响，并且在研磨第一基板之前，其强度通过研磨而降低，形成结构元件部分31的工艺包括 加热步骤。 此外，可以使用压电基板作为第一基板12，并且还可以使用支撑压电基板的支撑基板作为第二基板14.还可以在前表面11上形成用于声波装置的电极18 作为结构元件部分31的第一基板12。版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2010232725A

公开(公告)日：2010-10-14

申请号：JP2009075048

申请日：2009-03-25

Applicant: Ngk Insulators Ltd ,  日本碍子株式会社

Inventor： KOBAYASHI HIROTOSHI ,  HORI YUJI ,  IWASAKI YASUNORI

IPC: H03H9/25 ,  H01L21/02 ,  H01L41/09 ,  H01L41/18 ,  H01L41/187 ,  H01L41/22 ,  H01L41/313

CPC classification number: H03H9/02015 ,  H03H3/02 ,  H03H9/02574 ,  Y10T29/42

Abstract: PROBLEM TO BE SOLVED: To provide a composite substrate which is used for an elastic wave device and includes superior heat resistance. SOLUTION: In the composite substrate 10, a piezoelectric substrate 12 which can propagate an elastic wave and a support substrate 14 which a smaller thermal expansion coefficient than the piezoelectric substrate 12 are bonded to each other. The in-plane maximum thermal strain amount which is the largest thermal strain amount in the plane of the composite substrate 10 includes a minimum value and a maximum value when the piezoelectric substrate 12 and the support substrate 14 are relatively rotated 0 to 360°, and the piezoelectric substrate 12 and the support substrate 14 are bonded to each other so that the in-plane maximum thermal strain amount includes the minimum value or a value in the vicinity thereof. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 解决的问题：提供一种用于弹性波装置并且具有优异的耐热性的复合基板。 解决方案：在复合衬底10中，能够传播弹性波的压电衬底12和比压电衬底12更小的热膨胀系数的支撑衬底14彼此结合。 复合基板10的平面中最大的热应变量的面内最大热应变量包括当压电基板12和支撑基板14相对旋转0至360°时的最小值和最大值，以及 压电基板12和支撑基板14彼此接合，使得面内最大热应变量包括最小值或其附近的值。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2010171955A

公开(公告)日：2010-08-05

申请号：JP2009287867

申请日：2009-12-18

Applicant: Ngk Insulators Ltd ,  日本碍子株式会社

Inventor： SUZUKI KENJI ,  IWASAKI YASUNORI ,  YOSHINO TAKASHI

IPC: H03H3/08 ,  H03H9/145

CPC classification number: H03H9/0585 ,  H01L41/313 ,  H01L41/337

Abstract: PROBLEM TO BE SOLVED: To prevent the chipping of an edge of the piezoelectric substrate when the surface of the piezoelectric substrate is treated with abrasive grains for a composite substrate in which a piezoelectric substrate is bonded to a supporting substrate with an organic adhesive layer interposed therebetween. SOLUTION: A method for manufacturing a composite substrate comprises the steps of: preparing a supporting substrate and a piezoelectric substrate; forming a laminated substrate by bonding a surface of the supporting substrate to the backside of the piezoelectric substrate with an organic adhesive layer interposed therebetween; grinding a peripheral surface of the laminated substrate so that a peripheral surface of the piezoelectric substrate, a peripheral surface of the organic adhesive layer, and a peripheral surface of the supporting substrate on the side of the organic adhesive layer are made flush with each other; and polishing the surface of the piezoelectric substrate to reduce the thickness and to perform mirror polishing of the surface. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：为了防止压电基板的表面用用于复合基板的磨料颗粒处理压电基板的边缘时，其中压电基板通过有机粘合剂结合到支撑基板上 层之间。 解决方案：一种制造复合衬底的方法，包括以下步骤：制备支撑衬底和压电衬底; 通过将支撑基板的表面与压电基板的背面接合而形成层压基板，其间插入有机粘合剂层; 研磨层叠基板的周面，使得压电基板的周面，有机粘合层的外周面和支撑基板的有机粘合层一侧的外周面彼此齐平; 并且抛光压电基板的表面以减小厚度并对表面进行镜面抛光。 版权所有（C）2010，JPO＆INPIT