-
公开(公告)号：US20180233634A1
公开(公告)日：2018-08-16
申请号：US15944328
申请日：2018-04-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Matthias Sabathil , Alexander Linkov , Britta Göötz , Georg Dirscherl
CPC classification number: H01L33/504 , H01L25/167 , H01L25/50 , H01L31/143 , H01L31/173 , H01L33/005 , H01L33/44 , H01L33/508 , H01L33/54 , H01L33/56 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0091
Abstract: A method of producing a light-emitting arrangement includes providing a carrier including a top side, attaching a multitude of first conversion elements on the top side of the carrier, wherein the first conversion elements are arranged in a lateral direction spaced apart from one another, attaching an encapsulation on the top side of the carrier, wherein the encapsulation covers the carrier and the first conversion elements at least sectionally, removing the encapsulation in regions between the first conversion elements, and attaching optoelectronic semiconductor chips between the first conversion elements.
-
公开(公告)号：US20180182926A1
公开(公告)日：2018-06-28
申请号：US15738427
申请日：2016-07-12
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Markus Maute , Lutz Höppel , Jürgen Moosburger , Thomas Schwarz , Matthias Sabathil , Ralph Wirth , Alexander Linkov , Johannes Baur
CPC classification number: H01L33/46 , H01L33/20 , H01L33/24 , H01L33/30 , H01L33/382 , H01L33/385 , H01L33/405 , H01L33/60 , H01L33/62 , H01L2933/0083 , H01L2933/0091
Abstract: A component includes a carrier and a semiconductor body arranged on the carrier, wherein the semiconductor body has an active layer arranged between the first and second semiconductor layers and is configured to generate, during operation of the component, an electromagnetic radiation that can be coupled out from the component through a first main surface, the first main surface of the component has an electrical contact layer configured to electrically contact a first semiconductor layer and in a plan view the carrier covers the first main surface in places, and in direct vicinity of the electrical contact layer the component includes a shielding structure configured to prevent electromagnetic radiation generated by the active layer from impinging onto the contact layer.
-
公开(公告)号：US09978734B2
公开(公告)日：2018-05-22
申请号：US15114118
申请日：2015-01-26
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Matthias Sabathil , Alexander Linkov , Britta Göötz , Georg Dirscherl
CPC classification number: H01L33/504 , H01L25/167 , H01L25/50 , H01L31/143 , H01L31/173 , H01L33/005 , H01L33/44 , H01L33/508 , H01L33/54 , H01L33/56 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0091
Abstract: A light-emitting arrangement includes a radiation-emitting semiconductor chip that, during operation, emits primary radiation at least from a main emission surface, a first conversion element that absorbs part of the primary radiation and emits secondary radiation, and a deflection element that causes a direction change for part of the primary radiation, wherein the first conversion element is arranged in a lateral direction next to the radiation-emitting semiconductor chip, the deflection element guides part of the primary radiation onto the first conversion element, and the light-emitting arrangement, in operation, emits mixed light including the primary radiation and the secondary radiation.
-
公开(公告)号：US20170323872A1
公开(公告)日：2017-11-09
申请号：US15523812
申请日：2015-11-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Frank Singer , Jürgen Moosburger , Matthias Sabathil , Matthias Sperl , Björn Hoxhold
CPC classification number: H01L25/167 , H01L21/565 , H01L23/291 , H01L23/296 , H01L23/3171 , H01L23/3185 , H01L33/20 , H01L33/382 , H01L33/385 , H01L33/387 , H01L33/405 , H01L33/44 , H01L33/46 , H01L33/486 , H01L33/502 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2933/0025 , H01L2933/0041 , H01L2933/005 , H01L2933/0066
Abstract: An optoelectronic component includes a composite body including a molded body; and an optoelectronic semiconductor chip embedded into the molded body, wherein an electrically conductive through contact extends from a top side of the composite body to an underside of the composite body through the molded body, a top side of the optoelectronic semiconductor chip is at least partly not covered by the molded body, the chip includes a first electrical contact on its top side, a first top side metallization is arranged on the top side of the composite body and electrically conductively connects the first electrical contact to the through contact, the optoelectronic component includes an upper insulation layer extending over the first top side metallization, and the optoelectronic component includes a second top side metallization arranged above the upper insulation layer and electrically insulated with respect to the first top side metallization by the upper insulation layer.
-
公开(公告)号：US09691682B2
公开(公告)日：2017-06-27
申请号：US14413748
申请日：2013-07-16
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Matthias Sabathil , Stefan Illek , Thomas Schwarz
IPC: H01L31/0232 , H01L23/373 , H01L33/64 , H01L31/024
CPC classification number: H01L23/3731 , H01L31/024 , H01L33/56 , H01L33/62 , H01L33/641 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48464 , H01L2924/181 , H01L2933/0075 , H01L2924/00014 , H01L2924/00012
Abstract: An optoelectronic semiconductor component includes an optoelectronic thin-film chip; and a thermally conductive and electrically insulating element, wherein both the thin-film chip and the element are embedded in a molded body, a top surface of the thin-film chip and a bottom surface of the element are not covered by the molded body, the top surface of the thin-film chip is approximately flush with a top surface of the molded body, the bottom surface of the element is approximately flush with a bottom surface of the molded body, the molded body includes a first embedded conductor structure and a second embedded conductor structure, and the first conductor structure and the second conductor structure extends to the bottom surface of the molded body.
-
Patent Agency Ranking
46.发明申请公开(公告)号：US20160351550A1
公开(公告)日：2016-12-01
申请号：US15114118
申请日：2015-01-26
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Matthias Sabathil , Alexander Linkov , Britta Göötz , Georg Dirscherl
IPC: H01L25/16 , H01L31/173 , H01L25/00 , H01L33/50 , H01L33/56
CPC classification number: H01L33/504 , H01L25/167 , H01L25/50 , H01L31/143 , H01L31/173 , H01L33/005 , H01L33/44 , H01L33/508 , H01L33/54 , H01L33/56 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0091
Abstract: A light-emitting arrangement includes a radiation-emitting semiconductor chip that, during operation, emits primary radiation at least from a main emission surface, a first conversion element that absorbs part of the primary radiation and emits secondary radiation, and a deflection element that causes a direction change for part of the primary radiation, wherein the first conversion element is arranged in a lateral direction next to the radiation-emitting semiconductor chip, the deflection element guides part of the primary radiation onto the first conversion element, and the light-emitting arrangement, in operation, emits mixed light including the primary radiation and the secondary radiation.
Abstract translation: 发光装置包括发射半导体芯片，其在操作期间至少从主发射表面发射初级辐射，吸收主辐射的一部分并发射次级辐射的第一转换元件以及导致 对于一次辐射的一部分的方向改变，其中第一转换元件沿着与发射辐射的半导体芯片相邻的横向方向布置，偏转元件将主辐射的一部分引导到第一转换元件上，并且发光 在操作中的布置发射包括初级辐射和次级辐射的混合光。
-
47.发明申请公开(公告)号：US20160300820A1
公开(公告)日：2016-10-13
申请号：US15100559
申请日：2015-01-13
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Matthias Sabathil , Frank Singer , Roland Hüttinger
IPC: H01L25/075 , H01L33/50 , H01L33/00 , H01L33/56
CPC classification number: H01L25/0753 , F21K9/90 , F21Y2103/10 , F21Y2115/10 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/97 , H01L33/0095 , H01L33/502 , H01L33/56 , H01L33/58 , H01L2224/291 , H01L2224/2919 , H01L2224/32227 , H01L2224/83801 , H01L2224/83851 , H01L2224/97 , H01L2924/15159 , H01L2933/0041 , H01L2933/005 , H01L2933/0091 , H01L2924/014 , H01L2924/00014 , H01L2924/0781 , H01L2224/83
Abstract: A method for producing optoelectronic semiconductor components and an optoelectronic semiconductor component are disclosed. In an embodiment the method includes: A) creating a blank by pultrusion from a glass melt, B) shaping the blank into a billet-shaped optical element with a longitudinal axis, the optical element having a mounting side and a light outlet side, C) producing conductor tracks on the mounting side, D) mounting a plurality of optoelectronic semiconductor chips on the mounting side of the optical element and connecting them to the conductor tracks and E) separating the optical element into the optoelectronic semiconductor components, wherein each optoelectronic semiconductor component comprises at least two of the semiconductor chips, and wherein at least steps A) to D) are performed in the stated sequence.
Abstract translation: 公开了一种用于制造光电子半导体部件和光电半导体部件的方法。 在一个实施方案中，该方法包括：A）通过拉挤成型从玻璃熔体产生坯料，B）将坯料成型为具有纵向轴线的坯形光学元件，所述光学元件具有安装侧和光出口侧，C ）在安装侧产生导体轨道，D）将多个光电子半导体芯片安装在光学元件的安装侧并将它们连接到导体轨道，以及E）将光学元件分离成光电子半导体部件，其中每个光电子半导体 组件包括至少两个半导体芯片，并且其中至少步骤A）至D）以所述顺序执行。
-
公开(公告)号：US20150295141A1
公开(公告)日：2015-10-15
申请号：US14441458
申请日：2013-11-04
Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
Inventor： Thomas Schwarz , Matthias Sabathil
CPC classification number: H01L33/483 , H01L25/0753 , H01L33/486 , H01L33/60 , H01L33/62 , H01L33/64 , H01L33/642 , H01L2224/48091 , H01L2224/73265 , H05K1/021 , H05K2201/09745 , H05K2201/10106 , H05K2201/2054 , H01L2924/00014
Abstract: In at least one embodiment, the optoelectronic semiconductor component contains at least one chip support having electrical contact devices and also at least one optoelectronic semiconductor chip that is set up to produce radiation and that is mechanically and electrically mounted on the chip support. A component support is attached to the chip support. The semiconductor chip is situated in a recess in the component support. The component support is electrically insulated from the chip support and from the semiconductor chip. The component support is formed from a metal or from a metal alloy. On a top that is remote from the chip support, the component support is provided with a reflective coating.
Abstract translation: 在至少一个实施例中，光电子半导体部件包含至少一个具有电接触器件的芯片支架，并且还包括至少一个光电子半导体芯片，该光电半导体芯片设置成产生辐射并且机械地和电气地安装在芯片支撑件上。 组件支持附加到芯片支持。 半导体芯片位于部件支撑件的凹部中。 元件支撑件与芯片支撑件和半导体芯片电绝缘。 部件支撑由金属或金属合金形成。 在远离芯片支架的顶部，元件支撑件提供反射涂层。
-
公开(公告)号：US20150137162A1
公开(公告)日：2015-05-21
申请号：US14413670
申请日：2013-07-18
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Matthias Sabathil , Stefan Illek , Thomas Schwarz
CPC classification number: H01L33/486 , H01L25/0753 , H01L33/507 , H01L33/52 , H01L33/54 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0066 , H01L2924/00
Abstract: An optoelectronic semiconductor component has a volume-emitting sapphire flip-chip with an upper side and a lower side. This optoelectronic semiconductor component is embedded in an optically transparent mold body with an upper side and a lower side.
Abstract translation: 光电子半导体元件具有上侧和下侧的体积发射蓝宝石倒装芯片。 该光电子半导体部件嵌入具有上侧和下侧的光学透明模具体中。
-
50.发明授权公开(公告)号：US11152423B2
公开(公告)日：2021-10-19
申请号：US16098283
申请日：2017-05-11
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Peter Brick , Matthias Sabathil , Frank Singer , Thomas Schwarz
IPC: H01L27/15 , H01L25/075 , H01L33/58 , H01L33/08 , H01L33/62
Abstract: An optical assembly and a display device are disclosed. In an embodiment an optical assembly includes a common carrier, a plurality of first chip groups, each first chip group comprising at least two similar luminescence diode chips, a plurality of second chip groups, each second chip group comprising at least two similar luminescence diode chips, wherein the first and second chip groups are arranged planar along a regular grid of first unit cells on a main surface of the common carrier and an optical element arranged downstream of the first and second chip groups with respect to a main radiation direction, wherein the luminescence diode chips of the different chip groups are configured to emit electromagnetic radiation of different wavelength characteristics.
-
-
-
-
-
-
-
-
-
Search Results
64
records
(took 0.041 seconds)
