Abstract:
Exemplary embodiments are directed to wirelessly charging a chargeable device. A device may include a receiver configured to receive a stored power status from an embeddable, chargeable device. The device may further include a transmitter configured to wirelessly transmit power to charge the embeddable, chargeable device based on the stored power status.
Abstract:
Systems, methods and apparatus are disclosed for a dual mode wireless power receiver. In accordance with on aspect, an apparatus for receiving wireless power is provided. The apparatus includes a first coil configured to wirelessly receive power from a first transmitter configured to generate a first alternating magnetic field having a first frequency. The apparatus further includes a second coil configured to wirelessly receive power from a second transmitter configured to generate a second alternating magnetic field having a second frequency higher than the first frequency. The second coil is positioned to enclose the first coil. A first coupling factor between the first coil and a coil of the first transmitter is higher than a second coupling factor between the second coil and a coil of the second transmitter when the first and second coils are positioned within respective charging regions of the first and second transmitters.
Abstract:
Systems and methods for converting voltages between different voltage levels in a receiver are disclosed. In an aspect, a wireless power receiver apparatus for charging a chargeable device is provided. The apparatus includes a plurality of receive antennas disposed on a cover of the chargeable device, wherein at least one of the plurality of receive antennas is configured to wirelessly receive power according to a wireless charging protocol different from at least one other of the plurality of receive antennas. The apparatus includes a switching circuit disposed on the cover and configured to receive the wireless power from at least one of the plurality of receive antennas and selectively provide a respective voltage from a corresponding one of the plurality of receive antennas across an output configured to be connected to an input of the chargeable device.
Abstract:
On embodiment of a device with a noise adaptive power supply includes a noise adaptation unit configured to receive a noise adaptation signal. The noise adaptation unit can provide processing, such as digital filter processing to reduce the effect of power supply noise. In one embodiment, a feedback signal is used to adjust the output voltage of the power supply. The noise adaptation signal can be similar to the feedback signal. The noise adaptation unit can provide the processing in response to the noise adaptation signal.
Abstract:
Exemplary embodiments are directed to a power controller. A method may include comparing a summation voltage comprising a sum of an amplified error voltage and a reference voltage with an estimated voltage to generate a comparator output signal. The method may also include generating a gate drive signal from the comparator output signal and filtering a signal coupled to a power stage to generate the estimated voltage.
Abstract:
A circuit converts an input voltage to an output voltage. The circuit includes a first stage voltage converter that receives the input voltage and converts the input voltage. The first stage voltage converter includes a first buck converter having a double rail output: a first rail at a high intermediate voltage and a second rail at a low intermediate voltage. The circuit also includes a second stage voltage converter that receives the output rails and produces the output voltage.
Abstract:
Certain aspects of the present disclosure provide a semiconductor device. One example semiconductor device generally includes a semiconductor region, an insulative layer, a first terminal, and a first non-insulative region coupled to the first terminal, the insulative layer being disposed between the first non-insulative region and the semiconductor region. In certain aspects, the insulative layer is disposed adjacent to a first side of the semiconductor region. In certain aspects, the semiconductor device also includes a second terminal, and a first silicide layer coupled to the second terminal and disposed adjacent to a second side of the semiconductor region, the first side and the second side being opposite sides of the semiconductor region.
Abstract:
Certain aspects of the present disclosure provide semiconductor variable capacitors. One example semiconductor variable capacitor generally includes a semiconductor region, an insulative layer, and a first non-insulative region, the insulative layer being disposed between the semiconductor region and the first non- insulative region. In certain aspects, the semiconductor variable capacitor may also include a second non-insulative region disposed adjacent to the semiconductor region, and a third non-insulative region disposed adjacent to the semiconductor region, the second non-insulative region and the third non-insulative region having different doping types. In certain aspects, the semiconductor variable capacitor may also include an implant region disposed between the semiconductor region and the insulative layer. The implant region may be used to adjust the flat-band voltage of the semiconductor variable capacitor.