Abstract:
PROBLEM TO BE SOLVED: To realize preventing disturbance of a nonvolatile cell to which drain voltage of a selection cell is applied, with a method being suitable for low voltage operation. SOLUTION: The device has an operation circuit 9 for injecting electron injection and a non-selection word line bias circuit 9A as a function of a peripheral circuit. The operation circuit 9 controls operation injecting high energy electron charges to a local part of its lamination insulation film for data writing or erasing of a selected memory transistor to be operated. The non-selection word line bias circuit 9A applies the prescribed voltage to a non-selection memory transistor whose drain region is connected electrically to a drain region of the selected memory transistor through a nonvolatile word line in the direction where voltage between a drain and a gate is relaxed in injecting electron charges. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a memory of a discrete trap type where the required variation width of threshold voltage is secured even when dropping operation voltage, by improving charge retention characteristic and improving charge storage density. SOLUTION: A charge storage film is formed between a channel forming area and a gate electrode (WL), and comprises a charge storage means made discrete within a plane facing the channel forming area and in the direction of a film thickness. The charge storage film has a first insulating film 23 having a large number of micro-conductive particles 22 becoming a first charge storage means buried inside, and a second insulating film 24 which comprises a carrier trap becoming a second charge storage means and which is formed on the first insulating film 23 e.g. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a nonvolatile semiconductor memory of a structure enabling highly sensitive read operation at a lower voltage, and also to provide a method of the reading. SOLUTION: A gate insulating film GD is formed of a bottom insulating film BTM, a charge accumulating film CHS, and a top insulating film TOP sequentially from the lower side. The bottom insulating film BTM includes a nitride silicon oxide film SiON immediately under the charge accumulating film CHS. Bit information stored at a local area in the side of the sub-source line SSL of a memory transistor and bit information accumulated at a local area in the side of sub-bit line are read independently by a so-called reverse read method. Because of the existence of SiON, an incubation time is controlled, and thereby the film thickness controllability of the charge accumulating film CHS is improved. Moreover, since a threshold voltage under an erasing condition is lowered, low voltage operation and operation reliability can be improved in combination with the highly sensitive read operation. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To securely read data at a high speed in a nonvolatile semiconductor memory device having a non-conductive trap gate. SOLUTION: Source/drain regions of cell transistor Mi and an adjacent cell transistor Mi-1 or Mi+1 are electrically connected in common by a column line SDLi or SDLi+1. Column selecting means (P/B1-P/B9)apply reference voltage (0V) to a selected column line, and set read-out voltage states (BL) to the other column lines. Data D of a plurality of bits are read simultaneously from a plurality of column lines being adjacent the column line to which the reference voltage (0V) is applied, but, at the time, since a current is not made to flow in a cell transistor (e.g. M3, M7) not to be read and not connected to the column line to which the reference voltage (0V) is applied, the data D can be surely read at high speed. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To structure a memory transistor having a charge storage means suitable when made fine. SOLUTION: This device has a first conductive semiconductor substrate SUB, a gate insulating film, and a gate electrode WL formed on the semiconductor substrate. The device is internally provided with the charge storage means and has a second conductive source area S and a drain area D formed on the surface area of the semiconductor substrate on one side and the other side of the gate electrode WL in the width direction. A source contact plug SC is formed on one terminal of the source area S orthogonal in the width direction of its gate electrode WL. A bit contact plug BC is formed on the other terminal of the drain area D orthogonal in the width direction of its gate electrode. A source line SL is electrically connected to the source contact plug SC, and a bit line BL is electrically connected to the bit contact plug BC. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing using conditions decided based on a parameter by newly proposing changing guidelines (parameter) of manufacturing conditions effective to improve a charge injection speed. SOLUTION: The method for manufacturing a nonvolatile semiconductor memory device comprises a step of forming a gate dielectric film having a plurality of dielectric films BTM, CS, and TOP including a charge storage film CS on a surface of a semiconductor CH formed with a channel. The method further comprises a step of forming the film CS having a step of deciding a lower limit value of an Si-H bond surface density in the storage film necessary to perform a desired charge injection speed under predetermined bias condition, a step of deciding a film forming condition (e.g. a gas flow ratio) in which the Si-H bond surface density becomes a lower limit value or more, and a step of forming the film CS according to decided film forming conditions.
Abstract:
PROBLEM TO BE SOLVED: To reduce the time of for the overall write operation cycle, including reading and erasure, and enhance affinity with a CMOS process for facilitating realization of a low-cost memory hybrid system LSI. SOLUTION: The memory has channel-sharing MIS transistors and memory transistors, having a gate dielectric film GD1 composed of a plurality of laminated dielectrics, including charge-storing means dispersed therein. At writing, hot electrons HE generated near the boundary of the MIS transistor and the memory transistor are injected into the gate dielectric film GD1 from the source S side thereof (Fig. 8A). At erasing, hot holes HH1, HH2 generated at the drain D side are injected in a distribution region of electrons stored in the gate dielectric film GD1 from the drain D side (Fig. 8B). COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To correct program disturbance characteristics of a nonvolatile semiconductor memory containing charge storage means which are discrete on a plane. SOLUTION: Gate electrodes of a plurality of memory elements M are connected with a plurality of word lines WL. The source or drain region is connected with common lines, such as bit lines BL or source lines SL that cross word lines WL, from which they are electrically insulated. When writing, there are provided a write inhibit voltage supply means 20 that supplies a reverse bias voltage to the source or the drain region of a memory element M21 connected with a selective word line WL1 via a common line BL2 and/or SL2, so that the region is reverse biased with respect to the channel formed region and a non-selective word line bias means 22 that supply reverse bias voltage to the channel formed region to the non-selective word line WL2.
Abstract:
PROBLEM TO BE SOLVED: To reduce the data writing speed and voltage while maintaining and improving the charge holding characteristic. SOLUTION: A gate insulating film 6 interposed between a channel forming region 1a and a gate electrode 8 is formed by laminating a tunnel film 10, an intermediate film 12, and a top film 14 in this order from the bottom. The top film 14 is formed by laminating a plurality of insulating films (e.g. 14a and 14b), and the lowermost film 14a thereof is an oxide film. The intermediate film 12 is a silicon nitride film, etc., and the film thickness thereof is not larger than 5 nm. The tunnel film 10 may have a construction comprising an oxidized nitride film besides an oxide film. A transition layer with intermediate composition is interposed between the intermediate film 12 and the top film 14. Alternatively, there is a high concentration deep charge trap having a trap level greater than 2.0 eV near the interface between both of them.
Abstract:
PROBLEM TO BE SOLVED: To improve travelling property and durability of a recording medium for information recording and reproducing by bringing a needle electrode into contact with a charge accumulating layer, by holding an amphiphilic compd. having a specified compsn. on the contact face with the needle electrode. SOLUTION: This recording medium 10 consists of a substrate 11 and a charge accumulating layer 13 having electron or hole traps. Recording or reproducing of information is performed by bringing a needle electrode into contact with the layer 13. In this recording medium, at least the contact surface with the needle electrode contains amphiphilic compd. expressed by formula I or formula II. In formula I and formula II, R, R', R" are hydrophobic groups selected from CH3 (CH2 )m -CH3 (CH2 )m C6 H4 -(CH2 )n , CF3 (CF2 )m -(CH2 )p . A, A' are hydrophilic groups selected from Si(OR )3 SiCl3 , Ti(OR )3 , COOH, OH, NH2 , and R , R are CH3 or C2 H5 .