公开(公告)号：JP2001296812A

公开(公告)日：2001-10-26

申请号：JP2000113852

申请日：2000-04-14

Applicant: SONY CORP

Inventor： KOTAKE RYOTA ,  MATSUDA YOSHINARI

IPC: G02F1/1339 ,  G09F9/00

Abstract: PROBLEM TO BE SOLVED: To diminish the non-display segments of a display panel and to prevent the deterioration of display quality by eliminating the influence of adhesives on pixel segments. SOLUTION: The peripheral edges of at least one panel of the display surface panel 3 and end-sealing panel 7 of the plane display device 1 constituted by inserting multiple display pixels 2, 2, etc., between the display surface panel and the end-sealing panel 7 are provided with dike-like projecting parts 13, 13, etc., projecting toward the other panel side, and the adhesives 10 are applied on the outer side of the projecting parts, by which the display surface panel and the end-sealing panel are bonded to each other.

公开(公告)号：JP2001257284A

公开(公告)日：2001-09-21

申请号：JP2000073967

申请日：2000-03-13

Applicant: SONY CORP

Inventor： MATSUDA YOSHINARI ,  GOTO HIDEO

IPC: H01L23/12

Abstract: PROBLEM TO BE SOLVED: To provide a printed circuit board which can improve the productivity of a relay substrate and can prolong the life of a means for cutting out a boundary between adjacent printed patterns, by efficiently cutting out the boundary between the adjacent patterns. SOLUTION: A printed circuit board 1 has plurality of printed patterns arranged to be relay substrates 3 having a plurality of terminals 15 therearound. The relay substrates 3 are obtained by cutting off the adjacent printed patterns at their boundary C. A first linkage pattern 9 is provided at the boundary C of the adjacent printed patterns for connecting the terminals 15 opposed to each other with the boundary C disposed Therein, and a second linkage pattern 13 is provided as transversing the boundary C of the adjacent printed patterns for connecting the first linkage patterns 9 together.

公开(公告)号：JP2001022293A

公开(公告)日：2001-01-26

申请号：JP19327799

申请日：1999-07-07

Applicant: SONY CORP

Inventor： SUZUKI YOSHIO ,  MIYASAKA SATOSHI ,  KOTAKE RYOTA ,  MATSUDA YOSHINARI

IPC: G09F9/30 ,  G09F9/00 ,  H01L51/50 ,  H05B33/04 ,  H05B33/12 ,  H05B33/14

Abstract: PROBLEM TO BE SOLVED: To seal display material and electrodes without allowing a undisplayed part existing on the boundary of adjacent planar display elements at the time of arranging the planar display elements in plural sheets and constituting a picture. SOLUTION: The display material and the electrodes 3 are interposed between a first transparent substrate 2 which is positioned at the display surface side and a second substrate 4 which is positioned at the back face side, grooves exist at the boundary of the mutual side faces of the substrates 2, 4, the grooves are filled with adhesive 7, and films 9 for sealing the display material and the electrodes 3 are formed so as to cover the adhesive 7 at the side face sides of the substrates 2, 4, where the distance x2 from the picture element PX which is positioned endmost on substrate surfaces of the substrates 2, 4 to the surface of the film 9 becomes approx. one half of a gap (g) between the picture elements.

公开(公告)号：JP2000206908A

公开(公告)日：2000-07-28

申请号：JP761199

申请日：1999-01-14

Applicant: SONY CORP

Inventor： MATSUDA YOSHINARI ,  SUZUKI YOSHIO ,  KOTAKE RYOTA ,  ASAI NOBUTOSHI

IPC: G09F9/30 ,  G09F9/40 ,  H01L25/16 ,  H05B33/12 ,  H05B33/26 ,  H05K3/36

Abstract: PROBLEM TO BE SOLVED: To provide a video device capable of displaying a large-sized video having no gap and capable of thinning the whole of the device and to provide a production method therefor. SOLUTION: Relating to this device, anode electrodes 13 and cathode electrodes 15 of an EL video display plate 11 and copper wiring lines 23 of a flexible printed wiring board 21 are electrically connected with bumps 25 and the EL video display plate 11 and the flexible printed wiring board 21 are stuck with an adhesive layer 17. As a result, exclusive areas for electrically connecting the anode electrodes 13, the cathode electrodes 15 and driving circuits are unnecessitated for the EL video display plate 11, and the thickness of the whole of the EL video display plate 11 and the flexible printed wiring board 21 becomes thin.

公开(公告)号：JP2000173781A

公开(公告)日：2000-06-23

申请号：JP35033598

申请日：1998-12-09

Applicant: SONY CORP

Inventor： SUZUKI YOSHIO ,  KOTAKE RYOTA ,  MATSUDA YOSHINARI ,  ASAI NOBUTOSHI ,  TAGAMI SHIGEKATSU

IPC: H05B33/10 ,  H01L27/32 ,  H01L51/50 ,  H01L51/52 ,  H05B33/12 ,  H05B33/14 ,  H05B33/26

Abstract: PROBLEM TO BE SOLVED: To improve yield by removing a SiO2 insulating film from an organic electroluminescent element, and thereby simplifying the manufacturing process of an organic electroluminescent display device. SOLUTION: This organic electroluminescent display device 1 comprises a large number of organic electroluminescent elements, having organic layers 6, 6, etc., formed on multiple transparent first electrodes 4, 4, etc., arrayed in a band-like form, and second electrodes 5, 5, etc., opposite to the first electrodes, and each of the second electrodes 5, 5, etc., is so formed independently of the other secondary electrodes as to set its size smaller than the width of the first electrodes, and the second electrodes are connected with one another in a direction perpendicular to the lengthwise direction of the first electrodes.

公开(公告)号：JP2000100577A

公开(公告)日：2000-04-07

申请号：JP27173898

申请日：1998-09-25

Applicant: SONY CORP

Inventor： ASAI NOBUTOSHI ,  MATSUDA YOSHINARI ,  KOTAKE RYOTA ,  SUZUKI YOSHIO

IPC: H05B33/06 ,  H01J1/62 ,  H01J63/04 ,  H01L27/32 ,  H01L51/50 ,  H01L51/52 ,  H05B33/10 ,  H05B33/12 ,  H05B33/14 ,  H05B33/26

Abstract: PROBLEM TO BE SOLVED: To provide an optical element and its manufacturing method capable of arranging image panels in a plane shape with no gap as a display and preventing an existing film face from being damaged when an organic layer is formed. SOLUTION: Metal bumps 13 are provided in a non-picture element region on transparent electrodes 12 formed into a stripe shape on a glass substrate 11, and the metal bumps 13 are guided on the back face of an organic EL element. When an organic layer is formed, the metal bumps 13 serve as a deposition mask to prevent the contact of the mask with an existing film face, and the metal bumps 13 are connected to mounted parts 30 on the back face of the organic EL element together with metal electrodes 15.

公开(公告)号：JPH09232741A

公开(公告)日：1997-09-05

申请号：JP6183996

申请日：1996-02-23

Applicant: SONY CORP

Inventor： MATSUDA YOSHINARI ,  KUBO MINORU ,  MORITA KOJI

IPC: H05K3/28 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To prevent the generation of a soldering defect of a QFP due to the formation of a bridge between electrode lands by a method wherein two sheets of dry film-shaped solder resists are exposed and developed to form solder dams of a specified thickness or thicker in desired positions on the desired surface out of the surfaces of the solder resists. SOLUTION: Two sheets of photosensitive solder resists 6a and 6b consisting of the same material are superposed on a printed circuit board 7 to paste the resists to the board 7 and an exposure and a developing are perfomed on the resists. Thereby, solder dams of a thickness of 100 to 200μm are made to complete. At this time, a creamy solder is made a hole-filling printing in recessed parts 9, which are generated due to a difference between the thicknesses of the dams 8 and electrode lands 2, for obtaining a good soldered bonding. Then, after the hole-filling printing is made, terminals of a terminal pitch of 0.5mm of a QFP are mounted on the prescribed electrode lands 2. After the terminals are mounted, a creamy solder is preheated and thereafter, the creamy solder is heated. As the flow of the creamy solder to the adjacent electrode lands 2 is blocked by the solder dams 8, such trouble that a bridge is formed between the lands is not generated.

公开(公告)号：JPH0637417A

公开(公告)日：1994-02-10

申请号：JP19634792

申请日：1992-06-30

Applicant: SONY CORP

Inventor： MATSUDA YOSHINARI

IPC: H05K1/11 ,  H05K1/18 ,  H05K3/22 ,  H05K3/40

Abstract: PURPOSE:To provide a part for electric conduction capable of being mounted on a double-sided substrate with high accuracy and high density and capable of relaxing stress to a soldering section due to thermal expansion and contraction in the thickness direction of the double-sided substrate. CONSTITUTION:A part 10 for electric conduction has a sucking surface 12 for a suction by a mounting machine. The part 10 for electric conduction has spring structure 19 for moving a lead terminal electrode 14 inserted into a via hole 42 in the thickness direction of a double-sided substrate 40.