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1.发明专利
公开(公告)号：JP2000249812A
公开(公告)日：2000-09-14
申请号：JP5581899
申请日：1999-03-03
Applicant: SONY CORP
Inventor： SAKAKIBARA HIROYUKI , KUBO MINORU , SAITO SHINJI
Abstract: PROBLEM TO BE SOLVED: To easily mold the peripheral face out of the optically effective diameter without depending on the shape of a curved face in the inner region within the optically effective diameter by designing the peripheral face as a smoother aspheric face than the curvature of the inner curved face. SOLUTION: A lens barrel 3 is equipped with a first lens G1, a second lens G2 and a light accepting part 9 having a CCD as optical devices. An aspheric face S1 of the first lens G1 is composed of an aspheric face 28 formed based on a specified aspheric formula and an aspheric face 29 formed based on another different aspheric formula from that of the first aspheric formula and continuous from the aspheric face 28. Namely, the aspheric face 28 is formed in the optically effective area (inner region 1b within the optically effective diameter), while the aspheric face 29 is formed out of the optically effective area (peripheral region 1a out of the optically effective diameter). The curvature of the aspheric face 29 is made smoother than the aspheric face 28.
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公开(公告)号：JP2000138427A
公开(公告)日：2000-05-16
申请号：JP31047898
申请日：1998-10-30
Applicant: SONY CORP
Inventor： KUBO MINORU , KATAYAMA RYOICHI
Abstract: PROBLEM TO BE SOLVED: To surely prevent parts from being arranged around a BGA(ball grid array) mounted on a printed wiring board in a block copy design by implementing confirmation silk printing indicating a parts arrangement inhibiting area around the BGA. SOLUTION: A BGA 1 is arranged on a printed wiring board 2. Ball terminals 3 formed on the bottom face of the BGA 1 are bonded to a land pattern 4 formed on the surface of the board 2 with solder 5. A parts arranging inhibiting area 11 is formed around the BGA 1 on the surface of the board 2 by silk printing. The area 1 is preregistered as the CAD data of the parts surface silk printing of the BGA 1. When the printed wiring board 2 is designed by CAD, therefore, the arrangement of peripheral parts can be designed by avoiding the area 11, because each parts arrangement inhibiting area 11 stored as the CAD data of the used BGA 1 is displayed.
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公开(公告)号：JPH10162409A
公开(公告)日：1998-06-19
申请号：JP32046196
申请日：1996-11-29
Applicant: SONY CORP
Inventor： FUKAZAWA YOSHIO , KAWAKITA SATOSHI , KUBO MINORU , UEDA HIROYUKI
IPC: G11B7/135
Abstract: PROBLEM TO BE SOLVED: To make the recording and reproducing of an information signal satisfactory with respect to plural kinds of optical recording mediums whose thicknesses of transparent substrates are different by changing the numerical aperture of an objective lens as to the luminous flux of one wavelength and the luminous flux of other wavelength with a wavelength selective film. SOLUTION: The aperture for the luminous flux B1 of a first wavelength is the whole surface of a surface part and the luminous flux B1 is converged on the signal recording surface of a first optical disk 101a. The aperture for the luminous flux B2 of a second wavelength is an area where an antireflection film 2 is formed and where is in the surface part and the luminous flux B2 is converged on the signal recording surface of a second optical disk 101b. Since the numerical aperture is changed according to the difference of wavelengths by changing wavelengths of incident luminous fluxes in an objective lens 1, an optimum condition for recording and reproducing the information signal is realized with respect to the plural kinds of optical recording mediums whose thicknesses of transparent substrates are different.
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公开(公告)号：JPH09232741A
公开(公告)日：1997-09-05
申请号：JP6183996
申请日：1996-02-23
Applicant: SONY CORP
Inventor： MATSUDA YOSHINARI , KUBO MINORU , MORITA KOJI
Abstract: PROBLEM TO BE SOLVED: To prevent the generation of a soldering defect of a QFP due to the formation of a bridge between electrode lands by a method wherein two sheets of dry film-shaped solder resists are exposed and developed to form solder dams of a specified thickness or thicker in desired positions on the desired surface out of the surfaces of the solder resists. SOLUTION: Two sheets of photosensitive solder resists 6a and 6b consisting of the same material are superposed on a printed circuit board 7 to paste the resists to the board 7 and an exposure and a developing are perfomed on the resists. Thereby, solder dams of a thickness of 100 to 200μm are made to complete. At this time, a creamy solder is made a hole-filling printing in recessed parts 9, which are generated due to a difference between the thicknesses of the dams 8 and electrode lands 2, for obtaining a good soldered bonding. Then, after the hole-filling printing is made, terminals of a terminal pitch of 0.5mm of a QFP are mounted on the prescribed electrode lands 2. After the terminals are mounted, a creamy solder is preheated and thereafter, the creamy solder is heated. As the flow of the creamy solder to the adjacent electrode lands 2 is blocked by the solder dams 8, such trouble that a bridge is formed between the lands is not generated.
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公开(公告)号：JPH07235063A
公开(公告)日：1995-09-05
申请号：JP4788794
申请日：1994-02-22
Applicant: SONY CORP
Inventor： KUBO MINORU
Abstract: PURPOSE:To reduce the number of parts and to reduce the space by guiding an optical pickup with a guide projecting part and energizing with a pressing part when the optical pickup is fed in the direction of feeding. CONSTITUTION:Linear motors 14, 16 are provided with fixed parts 14a, 16a respectively, and this device is constituted so that movable parts 14b, 16b are movable for the fixed parts 14a, 16a by supplying power. In such a feeding device for the optical pickup, by controlling the linear motors 14, 16, the optical pickup 20 together with a carriage 22 are tracked or sought for an optical disk along the arrow X direction. At this time, the carriage 22 is fed precisely in the direction of the arrow X making the main guide 10 side a reference of movement while being pressed to the main guide 10 side by the preload from the sub-guide 12 side.
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Patent Agency Ranking
公开(公告)号：JP2001010826A
公开(公告)日：2001-01-16
申请号：JP17574899
申请日：1999-06-22
Applicant: SONY CORP
Inventor： KUBO MINORU , SAKAKIBARA HIROYUKI
Abstract: PROBLEM TO BE SOLVED: To provide a lens molding method capable of readily and surely centering a small-sized lightweight glass material to mold a microminiature lens in a molding mold and carrying out a proper lens pressing operation. SOLUTION: A glass material is placed between an upper mold and a lower mold to carry out a glass pressing operation. The Glass material 110 is arranged on the lower molding mold 100 and an antistatic air is sent from above to the mold. The antistatic air is operated by feeding air from an air supply nozzle 120 arranged above the glass material 110, setting a pin 130 for antistaticity at its supply opening 120A and feeding ion discharged from the pin 130 for antistaticity by air from the supply opening 120A to the glass material 110. The antistatic air is sprayed on the glass material 110 to carry out removal of electricity and centering. After the removal of electricity and centering of the Glass material 110 are carried out, the air supply nozzle 120 and the pin 130 for antistaticity are retreated from the top of the molding mold 100, the upper mold is arranged and press molding is performed.
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公开(公告)号：JPH10160906A
公开(公告)日：1998-06-19
申请号：JP32045896
申请日：1996-11-29
Applicant: SONY CORP
Inventor： KAWAKITA SATOSHI , FUKAZAWA YOSHIO , KUBO MINORU , UEDA HIROYUKI
IPC: G11B7/135 , G02B1/11 , G02B1/113 , G02B3/00 , G11B7/1374 , G11B11/10 , G11B11/105
Abstract: PROBLEM TO BE SOLVED: To make the best display of a reflection preventive effect by changing film thickness in a center part of a surface part of a reflection preventive film from the thickness of the peripheral part according to an incident angle of luminous flux for the surface part. SOLUTION: The reflection preventive films are formed on the surface part 1a and a rear surface part 1b of a lens 1 consisting of nitric material and transparent synthetic resin material. The film thickness are different from each other among the reflection preventive film formed on an incident first area A1 being the area of the central part of the surface part 1a, the reflection preventive film formed on an incident surface second area B1 being the circular area of the peripheral part of this incident surface first area A1 and the reflection preventive film formed on an incident surface third area C1 being the circular area ranging from the outer edge of this incident surface second area B1 to the peripheral part of the lens surface. Further, related to the rear surface part 1b also, the film thickness are different from each other. The differences in the film thickness in every area of these reflection preventive films are decided according to the incident angle (outgoing angle) shown by θ of the luminous flux for the lens surface in the area.
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公开(公告)号：JPH10142404A
公开(公告)日：1998-05-29
申请号：JP30993396
申请日：1996-11-07
Applicant: SONY CORP
Inventor： KUBO MINORU , UEDA HIROYUKI , KAWAKITA SATOSHI , FUKAZAWA YOSHIO
Abstract: PROBLEM TO BE SOLVED: To accurately attach a multilens for an optical pickup made of glass to a lens holder and to reduce a manufacturing cost of the multilens. SOLUTION: Planes parallel to an optical axis X-X of the multilens 1 for the optical pickup made of glass form two planes (a first reference flank 4 and a second reference flank 5) which are respectively parallel to or orthogonally intersecting with a cylindrical generatrix 6 of a cylindrical surface 2 being a front surface of the lens. On one surface of a planar glass preform material, projecting lines 16 having cylindrical surfaces and stretching in cylindrical generatrix directions are formed by pressing. On another surface at a part opposed to the projecting line 16, plural spherical recessed parts 17 having recessed spherical surfaces are formed along the cylindrical generatrix directions and then respective spherical recessed parts are cut as a unit.
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公开(公告)号：JPH10112580A
公开(公告)日：1998-04-28
申请号：JP26644696
申请日：1996-10-08
Applicant: SONY CORP
Inventor： MATSUDA YOSHINARI , KUBO MINORU , TOMIZUKA KENICHI , MORITA KOJI
IPC: H05K3/34
Abstract: PROBLEM TO BE SOLVED: To form each barrier made of solder resists between the respective adjacent electrode lands of a printed circuit board of an electronic part by superimposing in the form of two layers a photosensitive dry-film-form solder resist on an ordinary liquid resist provided on its main body of the board, in order to prevent solder-bridge faults generated between SMD electrodes, such as the ones of a flat package IC with terminal pitch not larger than about 0.65mm and generated between parts, in the soldering processes of the electronic part. SOLUTION: Forming each thin film made of a photosensitive liquid solder resist 4a of one of either an alkali developing type or a water soluble type on the single surface of a board main body 2 of a printed circuit board 1 by printing, exposing and developing, a photosensitive dry-film-form solder resist 4b of either one of an alkali developing type or water soluble type is stuck further thereon to form each of the thick films made of the resist 4b by exposing and developing. Thereby, each two-layer structure barrier 4 made of the solder resists 4a, 4b is formed progressively in the position surrounding each copper foil electrode 3 on the board main body 2.
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公开(公告)号：JPH09181424A
公开(公告)日：1997-07-11
申请号：JP33340695
申请日：1995-12-21
Applicant: SONY CORP
Inventor： MATSUDA YOSHINARI , KUBO MINORU
IPC: H05K3/28
Abstract: PROBLEM TO BE SOLVED: To suppress terminals from being short-circuited with solder even if the terminal pitch is reduced, thereby enabling the high-density package. SOLUTION: A resin layer 4 having a solder resist is formed to cover terminals 3 of an electronic component 1, except end parts 3b to be electrically connected to a wiring circuit pattern. It will surface to form this layer 4 on at least the back face of each terminal 3, facing at the circuit pattern, except its end 3b. The terminal 3 are laid on lands 6 of the wiring circuit pattern of a printed wiring board 5 and soldered to the lands 6 with solder 7.
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