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    Semiconductor module and its manufacturing method
    41.
    发明专利
    Semiconductor module and its manufacturing method 有权
    半导体模块及其制造方法

    公开(公告)号：JP2009038259A

    公开(公告)日：2009-02-19

    申请号：JP2007202250

    申请日：2007-08-02

    Applicant: Sony Corp ,  ソニー株式会社

    Inventor： OGAWA TAKESHI ,  NAKAYAMA HIROKAZU ,  MIYAZAKI HIROHITO ,  TAKESHIMA NAMIKO

    IPC: H01L25/00

    Abstract: PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor module in which two or more different kinds of devices can be integrated and passive components can be incorporated and which can be made compact and thin, and to provide a method for manufacturing the semiconductor module at high yield.
    SOLUTION: The semiconductor module 10 comprises a multilayered wiring layer 23 composed by forming a plurality of wiring layers 13 in an insulating layer 14, a semiconductor chip 11 provided on at least one main surface of the multilayered wiring layer 23 and a sealing material 15 for covering the semiconductor chip 11, and the sealing material 15 is provided on both main surfaces of the multilayered wiring layer 23 respectively.
    COPYRIGHT: (C)2009,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种高度可靠的半导体模块，其中可以集成两种或更多种不同类型的器件，并且可以结合无源部件，并且可以将其制造得紧凑和薄，并且提供一种用于制造 半导体模块高产量。 解决方案：半导体模块10包括通过在绝缘层14中形成多个布线层13而形成的多层布线层23，设置在多层布线层23的至少一个主表面上的半导体芯片11和密封 用于覆盖半导体芯片11的材料15和密封材料15分别设置在多层布线层23的两个主表面上。 版权所有（C）2009，JPO＆INPIT

    Process for manufacturing three-dimensional semiconductor package
    42.
    发明专利
    Process for manufacturing three-dimensional semiconductor package 有权
    制造三维半导体封装的工艺

    公开(公告)号：JP2007287802A

    公开(公告)日：2007-11-01

    申请号：JP2006111215

    申请日：2006-04-13

    Applicant: Sony Corp ,  ソニー株式会社

    Inventor： OGAWA TAKESHI ,  NAKAYAMA HIROKAZU ,  MIYAZAKI HIROHITO ,  TAKESHIMA NAMIKO

    IPC: H01L23/12 ,  H01L23/52 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18

    CPC classification number: H01L24/82 ,  H01L21/568 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24 ,  H01L2224/73267 ,  H01L2924/01322 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: PROBLEM TO BE SOLVED: To provide a process for manufacturing a three-dimensional semiconductor package mounting various semiconductor devices including a general-purpose device three-dimensionally, while shortening the interconnection between respective semiconductor devices and attaining scaling-down or densification by a simple process with high precision. SOLUTION: A step is carried out for burying a semiconductor device 8, a first interconnection layer 9 and a conductive post 10 in a sealing resin layer 11 on a first dummy substrate 2, and making them thin by polishing; a unit wafer layer substrate 4 is produced by a step for forming a second interconnection layer 12 on a surface 34 from which the first dummy substrate 2 is stripped, after a second dummy substrate 3 is bonded; and then the unit wafer layers 5 are laminated sequentially from which the second dummy substrate 3 is stripped. COPYRIGHT: (C)2008,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种三维半导体封装的制造工艺，其三维地安装包括通用器件的各种半导体器件，同时缩短各个半导体器件之间的互连，并通过以下方式实现缩小或致密化 一个高精度的简单过程。 解决方案：进行第一虚拟衬底2上的密封树脂层11中的半导体器件8，第一互连层9和导电柱10的埋入并通过抛光使其变薄的步骤; 在第二虚拟衬底3被接合之后，通过在第一虚拟衬底2被剥离的表面34上形成第二互连层12的步骤来制造单位晶片层衬底4; 然后依次层叠单位晶片层5，从而剥离第二虚设基板3。 版权所有（C）2008，JPO＆INPIT

    Manufacturing method of hybrid module
    44.
    发明专利
    Manufacturing method of hybrid module 审中-公开
    混合模块的制造方法

    公开(公告)号：JP2007220792A

    公开(公告)日：2007-08-30

    申请号：JP2006037961

    申请日：2006-02-15

    Applicant: Sony Corp ,  ソニー株式会社

    Inventor： MIYAZAKI HIROHITO ,  OGAWA TAKESHI ,  NAKAYAMA HIROKAZU ,  TAKESHIMA NAMIKO

    IPC: H01L23/52 ,  H01L25/04 ,  H01L25/18

    CPC classification number: H01L21/568 ,  H01L2224/04105 ,  H01L2224/19 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: PROBLEM TO BE SOLVED: To achieve a high function and multifunctionality by reducing the size and thickness, and by high-density mounting as well as to promote manufacturing efficiency and to improve an yield. SOLUTION: A component mounting substrate layer body 3 is made by peeling off a dummy substrate 7 from a component mounting substrate 2, wherein a mount component 13 whose input/output electrode formation plane 17 is nearly flush with the principal plane of a silicon substrate 6 is embedded in a component embedding opening 14 formed in the silicon substrate 6, by a component mounting substrate formation process by a sealing resin layer 15. The component mounting substrate layer body 3 is integrated together with an interconnection layer board 4 having an interconnection layer 23 which is formed very accurately by an interconnection layer board formation process using a dummy substrate 9. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题：通过减小尺寸和厚度以及通过高密度安装以及提高制造效率和提高产量来实现高功能和多功能性。 解决方案：通过从组件安装基板2剥离虚设基板7制成部件安装基板层体3，其中输入/输出电极形成平面17几乎与基板7的主平面齐平的安装部件13 硅基板6通过密封树脂层15的部件安装基板形成工艺嵌入到形成在硅基板6中的部件嵌入开口14中。部件安装基板层体3与具有 互连层23，其通过使用虚设基板9的互连层板形成工艺非常精确地形成。版权所有（C）2007，JPO＆INPIT

    Hybrid module, its manufacturing process and hybrid circuit device
    45.
    发明专利
    Hybrid module, its manufacturing process and hybrid circuit device 有权
    混合模块，其制造工艺和混合电路设备

    公开(公告)号：JP2006270037A

    公开(公告)日：2006-10-05

    申请号：JP2005296735

    申请日：2005-10-11

    Applicant: Sony Corp ,  ソニー株式会社

    Inventor： OGAWA TAKESHI

    IPC: H01L25/16

    CPC classification number: H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/19 ,  H01L2224/24195 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/00 ,  H01L2924/00012

    Abstract: PROBLEM TO BE SOLVED: To mount a large number of packaging components while reducing a thickness and enhancing packaging precision, efficiency or reliability, and to attain high speed high capacity transmission of information signals, and the like, by an electric signal transmission function and an optical signal transmission function. SOLUTION: The hybrid module comprises: a silicon substrate 3 having a plurality of opening 8 for loading components; packaging components 4 including an optical element 4D being loaded in the component loading openings 8 and secured by a sealing resin layer 9; and a wiring layer 5 formed on the silicon substrate 3. An optical signal transmission means 5B is provided oppositely to the optical signal I/O section 13 of the optical element 4D. COPYRIGHT: (C)2007,JPO&INPIT

    Abstract translation: 要解决的问题：为了安装大量的包装部件，同时减小厚度并提高包装精度，效率或可靠性，并且通过电信号传输等获得信息信号等的高速大容量传输 功能和光信号传输功能。 解决方案：混合模块包括：具有用于加载部件的多个开口8的硅基板3; 包装部件4，其包括装载在部件装载开口8中并由密封树脂层9固定的光学元件4D; 以及形成在硅基板3上的布线层5.光信号传输装置5B与光学元件4D的光信号I / O部分13相对地设置。 版权所有（C）2007，JPO＆INPIT

    CIRCUIT MODULE AND MANUFACTURING METHOD THEREOF
    47.
    发明专利
    CIRCUIT MODULE AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：JP2003163323A

    公开(公告)日：2003-06-06

    申请号：JP2001361692

    申请日：2001-11-27

    Applicant: SONY CORP

    Inventor： OGAWA TAKESHI

    IPC: H05K3/46 ,  H01L25/04 ,  H01L25/18

    Abstract: PROBLEM TO BE SOLVED: To make fine an interlayer via and a wiring pattern for thinning the whole, and to shorten the wiring length in a semiconductor chip for achieving high-speed processing and improving reliability. SOLUTION: With each of unit wiring layers 8-12, two-step first and second exposure treatment having a different amount of exposure in the corresponding site of a via 13 of an insulating layer 24 made of a photosensitive insulating material, and a circuit pattern 25 and development treatment for removing an exposure site, are made. Then, a conductor layer 28 is formed on the entire surface, and at the same time the conductor layer 28 is polished until the insulation layer 24 is exposed for flattening the surface, thus forming the fine and high-density via 13 and the circuit pattern 25 in the insulation layer 24. COPYRIGHT: (C)2003,JPO

    HIGH-FREQUENCY MODULE DEVICE AND METHOD FOR MANUFACTURING THE SAME
    48.
    发明专利
    HIGH-FREQUENCY MODULE DEVICE AND METHOD FOR MANUFACTURING THE SAME 失效

    公开(公告)号：JP2002094247A

    公开(公告)日：2002-03-29

    申请号：JP2000280632

    申请日：2000-09-14

    Applicant: SONY CORP

    Inventor： OKUHORA AKIHIKO ,  OGAWA TAKESHI ,  NAKAYAMA HIROKAZU ,  OYA YOICHI

    IPC: H01L25/00 ,  H01L23/12 ,  H03H3/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/16 ,  H05K3/46 ,  H05K7/20

    Abstract: PROBLEM TO BE SOLVED: To provide a high-frequency module device having high accuracy, advanced function, reduced in height and size of package, and made at reduced cost. SOLUTION: The high-frequency module device has a base board 2 in which a pattern wiring layer 6 is formed on the first main plane 5a of a core base body 5 formed of an organic base material having heat resistance and high-frequency characteristics and in which the uppermost layer is subjected to a planarizing treatment to form a high-frequency device layer forming plane 3, and a high-frequency device layer 4 having a receiving device therein that is formed on the high-frequency device layer forming plane 3 by a thin film technology or a thick film technology and that has a resistance 27 and a capacitor 26 both of which are supplied with power or a signal from the base board 2 side via a dielectric insulating layer 30.

    METHOD FOR FORMING OPTICAL WAVEGUIDE AND METHOD FOR MANUFACTURING OPTICAL TRANSMITTER-RECEIVER
    49.
    发明专利
    METHOD FOR FORMING OPTICAL WAVEGUIDE AND METHOD FOR MANUFACTURING OPTICAL TRANSMITTER-RECEIVER 失效

    公开(公告)号：JP2001272565A

    公开(公告)日：2001-10-05

    申请号：JP2000086976

    申请日：2000-03-27

    Applicant: SONY CORP

    Inventor： OGAWA TAKESHI

    IPC: G02B6/13 ,  G02B6/122 ,  H01L31/0232 ,  H01L31/12 ,  H01S5/022

    Abstract: PROBLEM TO BE SOLVED: To provide a method for forming an optical waveguide by which the optical waveguide having a light reflecting mirror which forms a prescribed inclined angle to the light propagating direction is easily formed by a simple process with excellent reproducibility and a method for manufacturing optical transmitter-receiver. SOLUTION: A forming mold 21 having plural opening parts 21a is arranged on a clad layer 12 formed on a substrate 11. The opening parts 21a of the forming mold 21 are opened in a nearly rectangular parallelepiped shape, and inclined parts 21b, 21c formed so as to incline at a prescribed inclined angle along the light propagating direction are provided at both end parts. After core layer forming material is poured into the opening parts 21a to fill it, core forming material is hardened by irradiating the material with light from the upper side of the substrate 11. Further, the clad layer is formed after the forming mold 21 is removed from the substrate 11. Thus, the light reflecting mirror forming the prescribed inclined angle to the light propagating direction is formed at both end parts of the core layer composing the optical waveguide.

    MANUFACTURE OF OPTICAL WAVEGUIDE, AND MANUFACTURE OF OPTICAL TRANSCEIVER
    50.
    发明专利
    MANUFACTURE OF OPTICAL WAVEGUIDE, AND MANUFACTURE OF OPTICAL TRANSCEIVER 失效

    公开(公告)号：JP2001033646A

    公开(公告)日：2001-02-09

    申请号：JP20850799

    申请日：1999-07-23

    Applicant: SONY CORP

    Inventor： OGAWA TAKESHI

    IPC: G02B6/13 ,  H01L31/0232 ,  H01L33/62 ,  H01L33/00

    Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of optical waveguide to manufacture easily an optical waveguide capable of keeping a high optical propagation characteristic irrespective of the kinds of supporting base substances. SOLUTION: A dummy layer having a pattern in which a solution, in such as a grating shape can infiltrate sufficiently up to a central part, is formed on a transparent substrate 11, and an optical waveguide 16 is formed thereon. Then, the transparent substrate 11 is immersed into an acidic solution. The dummy layer is dissolved to be removed, an area in which the dummy layer has been formed becomes a gap 17, and a clad layer 13 is brought into a condition contacting with one portion of the substrate 11. A multi-layered wiring board 18 is made thereafter to contact closely with the optical waveguide 16 via an adhesive layer 19 comprising a photo-curable resin, then the layer 19 is irradiated with a beam to be cured, and the writing board 18 is fixed to the optical waveguide 16. Further, physical force F is appied to the transparent substrate 11 to separate the substrate 11 from the optical waveguide 16. The waveguide 16 is thereby transferred to the wiring board 18. Since the waveguide 16 contacts partially with the transparent substrate 11, the substrate 11 is separated easily.

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