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公开(公告)号:JP2004146602A
公开(公告)日:2004-05-20
申请号:JP2002309977
申请日:2002-10-24
Inventor: OGAWA TAKESHI
CPC classification number: G02B6/43 , G02B6/42 , G02B6/4214 , H01L2224/16225 , H01L2924/00014 , H01L2924/15192 , H01L2924/19105 , H05K1/0274 , H05K3/007 , H05K3/4602 , H05K3/4682 , H05K3/4694 , H05K2201/09972 , H05K2203/016 , H05K2203/061 , H01L2224/0401
Abstract: PROBLEM TO BE SOLVED: To provide a hybrid circuit board realizing high speed high capacity transmission of information signal by making possible to transmit both electrical signal and optical signal. SOLUTION: The hybrid circuit board comprises a base board part 3 where a wiring layer 11 is formed on an insulating board 10 by print wiring process, a fine wiring circuit part 4 where a fine electric wiring layer 14 is formed on the wiring layer 11 by semiconductor process, and an optical wiring circuit part 5 provided at least with a pair of optical elements 8 where an optical waveguide 9 having input/output parts 9a and 9b of optical signal is formed at the end part and light receiving/emitting parts are disposed oppositely to the input/output parts in order to deliver/receive an optical signal. The fine wiring circuit part 4 and the optical wiring circuit part 5 are mounted on the base board part 3. COPYRIGHT: (C)2004,JPO
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公开(公告)号:JP2003101222A
公开(公告)日:2003-04-04
申请号:JP2001289997
申请日:2001-09-21
Applicant: SONY CORP
Inventor: OGAWA TAKESHI
IPC: H05K3/38 , H01L23/12 , H01L23/14 , H01L23/31 , H01L23/367 , H01L23/498 , H01L23/538 , H01L25/00 , H01L25/16 , H05K1/16 , H05K3/06 , H05K3/46 , H01L23/522
Abstract: PROBLEM TO BE SOLVED: To form a passive element having high performance in a thin film circuit substrate unit. SOLUTION: The thin film circuit substrate unit comprises a base substrate section 2, and a circuit section 3 having insulating layers 11, 16 and pattern wirings 14, 17 formed on a build-up forming surface 2a, a power receiving electrode 21 formed on a first insulating layer 11, and a passive element electrically connected to the electrode 21 in such a manner that the circuit section 3 has a substrate titanium film and a substrate film laminated to cover the electrode 21 and the respective passive elements, and a substrate layer 23 and a substrate titanium layer 22 formed by etching the substrate film and the substrate titanium film of a region having no metal film formed with a metal film as a first pattern wiring 14 formed on the substrate film as a mask. Thus, the substrate titanium film as the substrate titanium layer 22 prevents the electrode 21 and the respective passive elements from being corroded by the etching liquid to form the passive elements each having high performance.
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3.
公开(公告)号:JP2002365457A
公开(公告)日:2002-12-18
申请号:JP2001170725
申请日:2001-06-06
Applicant: SONY CORP
Inventor: OGAWA TAKESHI
Abstract: PROBLEM TO BE SOLVED: To provide an optical waveguide having a structure which can effectively protect a mirror for optical path conversion formed at an end in a longitudinal direction, and to provide a method for manufacturing the same, and an optical signal transmission device. SOLUTION: The optical waveguide 25 including a core layer 12, clad layers 13, 14a and a sealing wall 14b, and a board 11 completely interrupt a space 41a faced by the mirror 31a for optical path conversion from outside air. In the same way, The optical waveguide 25 including the core layer 12, the clad layers 13, 14a, and the sealing wall 14c, and the board 11 completely interrupt a space 41b faced by the mirror 31b for optical path conversion from outside air. Accordingly, a stain, dust, a flaw, etc., to the mirrors 31a, 31b for optical path conversion are effectively avoided.
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公开(公告)号:JP2002164467A
公开(公告)日:2002-06-07
申请号:JP2001024688
申请日:2001-01-31
Applicant: SONY CORP
Inventor: OGAWA TAKESHI , NISHITANI YUJI , OKUHORA AKIHIKO
Abstract: PROBLEM TO BE SOLVED: To contrive miniaturization and a low cost by thinning with high precision and high function. SOLUTION: A peeling layer forming process for forming a peeling layer 6 on a main face flattening a base board 1, an insulation layer forming process for forming insulation layers 7, 9, 16 on the peeling layer 6, a wiring layer forming process for forming wiring layers 8, 11, 14 on the insulation layer 7, and a circuit block body peeling process for peeling a circuit block body 2 comprising each insulation layer and wiring layer through the peeling layer are provided. The circuit block body 2 incorporates film formation elements 12, 13, 17 in the wiring layer, and is mounted on a base board 3 to compose a wiring device. The circuit block body 2 mounts a semiconductor chip 62 on the surface and is mounted on a base board 64 to compose a semiconductor device.
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公开(公告)号:JP2002033562A
公开(公告)日:2002-01-31
申请号:JP2000218197
申请日:2000-07-19
Applicant: SONY CORP
Inventor: OGAWA TAKESHI
Abstract: PROBLEM TO BE SOLVED: To provide an insulating layer and via hole forming method which makes the top surface of an insulating layer smooth when the insulating layer and a via hole are formed on a core substrate, can form a thin-film element etc., in good yield with good reliability and a high degree of freedom, and enables fine via-hole formation, a forming method for a wiring structure, and to provide a pattern material used to implement those methods and its manufacturing method. SOLUTION: A liquid insulating layer material 3 is applied over the surface including an electrode 2 on the substrate 1, and projections 22 formed on the pattern material 21 are pressed against the material 3 from above. After the insulating layer 3 is cured while the projections 22 are made to abut against the electrode 2, the pattern material 21 is peeled off. Consequently, via holes 23 can be formed in the insulating layer 3 at the parts of the projections 22. For the purpose, the surface of the pattern material 21 except the projections 22 are formed smoothly and the projections 22 are formed in a desired shape to desired size to form the insulating layer 3 having the smooth surface and desired via holes 23, so that a reliable product can be manufactured in good yield by forming a thin-film element, etc., by using the method.
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6.
公开(公告)号:JP2001141966A
公开(公告)日:2001-05-25
申请号:JP32562599
申请日:1999-11-16
Applicant: SONY CORP
Inventor: OGAWA TAKESHI , OKUHORA AKIHIKO , KOSEMURA TAKAHIKO , NISHITANI YUJI
Abstract: PROBLEM TO BE SOLVED: To provide a down-sized optical switching device and optical transmitter-receiver permitting bi-directional optical switching and optical transmission by using a single optical transmission path such as optical fiber, and a manufacturing method therefor. SOLUTION: The optical transmitter-receiver 10A is provided with a 1st optical waveguide 12 for transmitting 1st incident optical signal L1 approximately in the incident direction, and a 2nd waveguide 13 for guiding a 2nd optical signal L2 made incident from the different direction of the 1st optical signal L1 in the reverse direction of the 1st optical signal L1. The 1st optical waveguide 12 has an incident plane 121 on which the 1st optical signal L1 is made incident, and an exit plane 122 from which the 1st optical signal L1 is made to exit. The 2nd optical guide 13 is mounted on the incident plane 121 of the 1st optical guide 12.
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公开(公告)号:JP2000356720A
公开(公告)日:2000-12-26
申请号:JP16984299
申请日:1999-06-16
Applicant: SONY CORP , SONY CHEMICALS
Inventor: OGAWA TAKESHI , HAYASHI KOZABURO , IKAGAWA YASUKO
Abstract: PROBLEM TO BE SOLVED: To provide a material for optical waveguide having high polymerizability and excellent solvent resistance, and to provide an optical waveguide utilizing it and a method for manufacturing it. SOLUTION: Materials for optical waveguide constituting organic material layers 11a, 12a are activated and converted into a cladding part 11 and a core part 12 respectively when the materials are irradiated with energy beam. The materials for an optical waveguide contain an oxetane compound, an oxirane compound and a cation polymerization initiator. Because the oxetane compound has an oxetane ring, it has an excellent repetitive reactivity in a chain reaction. Thereby the materials exhibit high polymerizability in a chain reaction so as to produce polymers with large mechanical strength and excellent solvent resistance. Refractive indices of the core part 12 and the cladding parts 11, 13 are controlled because an oxetane compound and an oxirane compound are excellently compatible with each other and refractive indices of respective compounds are reflected in the refractive index of a hardened mixture.
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8.
公开(公告)号:JP2000298221A
公开(公告)日:2000-10-24
申请号:JP10819999
申请日:1999-04-15
Applicant: SONY CORP
Inventor: OGAWA TAKESHI
Abstract: PROBLEM TO BE SOLVED: To provide a method for the production of an optical waveguide by which an optical waveguide having a light-reflecting mirror at a prescribed inclination angle with respect to the propagation direction of light can be easily formed with good reproducibility, and to provide a method for the production of an optical transmitting and receiving device. SOLUTION: A photomask 25 with a light-shielding film 24 is positioned on a photosetting resin layer 12'. The light-shielding film 24 has openings 24b and inclined faces 24b. The region of the inclined face 24b acts as a gray scale region, which transmits light in the quantity according to the thickness of the light-shielding film 24 which changes gradually. Then by irradiating the mask with light L1, in the region directly under the inclined faces 24b, the light reaches the resin layer 12' while the quantity of the transmitted light is controlled according to the thickness of the light-shielding film 24. Therefore, when the non-hardened part of the resin layer 12' is dissolved and removed, light- reflecting mirrors are formed on both ends of the optical waveguide cores, with the mirrors consisting of inclined faces which make an almost 45 angle with the surface of the transparent substrate 11.
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9.
公开(公告)号:JP2000227524A
公开(公告)日:2000-08-15
申请号:JP2925899
申请日:1999-02-05
Applicant: SONY CORP
Inventor: OGAWA TAKESHI
Abstract: PROBLEM TO BE SOLVED: To provide the optical waveguide device and optical transmission and reception device which enables two-way communication by propagating light signals bidirectionally by using an optical waveguide formed on a substrate and their manufacture. SOLUTION: In an optical waveguide 15 at least nearby its one end side (side A), a grooved cut part 31a having border surfaces 16a and 17a is provided crossing a light propagation direction. Received signal which is propagated in the optical waveguide 15 from the other end side (side B) is reflected internally by the border surface 16a and exits from the flank of the optical waveguide 15. Transmitted light which is made incident on the end surface 18a on the side A of the optical waveguide 15 is transmitted through the border surface 17a and made incident on the border surface 16a. Even the optical waveguide formed on the substrate is able to send and receive light signals in two directions and the density of optical wiring can be made high.
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公开(公告)号:JP2000047273A
公开(公告)日:2000-02-18
申请号:JP21774898
申请日:1998-07-31
Applicant: SONY CORP
Inventor: OGAWA TAKESHI
Abstract: PROBLEM TO BE SOLVED: To provide a small and light-weighted optical waveguide type light- deflector having a large deflection angle with low power consumption, and to provide an optical pickup device and an optical recording and reproducing device capable of broadening a frequency band of a tracking servo. SOLUTION: This optical waveguide type light-deflector 18 has a substrate 1, an optical waveguide 4 which is formed on the substrate 1 and has an air gap part 6 in the neighborhood of the tip part across the substrate 1, and a pair of electrodes 5a, 5b placed on the faces opposed to the substrate 1 and the optical waveguide 4 interposing the air gap part 6 in-between, and not only a voltage difference is applied across the pair of electrodes 5a, 5b but also a generated electrostatic force displaces a light-emitting surface 4a made up on the tip part, and deflects the light outgoing from the light-emitting surface, for example, in the tracking direction of an optical record medium.
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