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41.
公开(公告)号:EP3925306A1
公开(公告)日:2021-12-22
申请号:EP20810069.3
申请日:2020-05-19
Applicant: Samsung Electronics Co., Ltd.
Inventor: LEE, Soomin , KIM, Junsuk , KIM, Jihwan , LEE, Kyunghoon , HONG, Chungwan , KIM, Hyejeong , LEE, Sangho
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公开(公告)号:EP3818775A1
公开(公告)日:2021-05-12
申请号:EP19888833.1
申请日:2019-11-11
Applicant: Samsung Electronics Co., Ltd.
Inventor: KIM, Jihwan , KIM, Junsuk , LEE, Taeseop , CHA, Jiyoung , KIM, Hyejeong , LEE, Sangho , HWANG, Sunmin
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43.
公开(公告)号:EP3720240A1
公开(公告)日:2020-10-07
申请号:EP20168022.0
申请日:2020-04-03
Applicant: Samsung Electronics Co., Ltd.
Inventor: KIM, Junsuk , LEE, Sangho , LEE, Jangbok , CHUNG, Wonsuk , KIM, Sohmann , LEE, Byunggil , KIM, Seonmi , BAIK, Jongmin , LEE, Kyunghoon , LEE, Jookwan , PARK, Suyoung , HWANG, Sunmin
Abstract: An electronic device includes a communication processor including a first communication circuitry, a second communication circuitry , and a temperature measurement sensor. The electronic device further includes an application processor that receives information via the second communication circuitry and determines whether to request the communication processor change modes. The communication processor receives a signal to change modes, release an RRC connection, and control the second communication circuitry to enter a sleep state.
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公开(公告)号:EP4434177A1
公开(公告)日:2024-09-25
申请号:EP23743485.7
申请日:2023-01-19
Applicant: Samsung Electronics Co., Ltd.
Inventor: LEE, Sangho , KIM, Suhwook , PARK, Seungil , PARK, Yosub , SEO, Bongsung , JANG, Hyeondeok
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公开(公告)号:EP4397091A1
公开(公告)日:2024-07-10
申请号:EP22904706.3
申请日:2022-12-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: SEO, Bongsung , KIM, Suhwook , PARK, Seungil , LEE, Sangho
CPC classification number: H04W52/325 , H04W52/24 , H04W52/146
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公开(公告)号:EP4318805A1
公开(公告)日:2024-02-07
申请号:EP22842478.4
申请日:2022-07-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: LEE, Juneseok , BAEK, Kwanghyun , HA, Dohyuk , PARK, Jungho , LEE, Sangho , LEE, Youngju , LEE, Wuseong
Abstract: The disclosure relates to a 5th Generation (5G) or pre-5G communication system for supporting a data transfer rate higher than that of a post-4th Generation (4G) communication system such as Long Term Evolution (LTE). According to embodiments of the disclosure, a radio unit (RU) module includes a first printed circuit board (PCB) on which a plurality of antenna elements are disposed; a second PCB on which a radio frequency integrated circuit (RFIC) is disposed; and a third PCB configured to electrically connect each of the plurality of antenna elements disposed on the first PCB and the RFIC disposed on the second PCB, wherein the size of the third PCB is smaller than the size of the first PCB and greater than the size of the second PCB, a first surface of the third PCB is coupled to a first surface of the first PCB through a grid array, and positions of feeding ports on the first surface of the third PCB correspond to positions in which ports of the plurality of antenna elements are disposed on a second surface opposite the first surface of the first PCB.
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公开(公告)号:EP4303924A1
公开(公告)日:2024-01-10
申请号:EP22784761.3
申请日:2022-02-14
Applicant: Samsung Electronics Co., Ltd.
Inventor: LEE, Sangho , KIM, Kihyun , PARK, Sangyong , BAEK, Kwanghyun , BAEK, Seungjae
IPC: H01L23/64 , H01L23/492 , H01L23/485 , H01L23/528 , H01L23/00
Abstract: A package device includes a substrate, a plurality of upper lands disposed on one surface of the substrate, a plurality of upper solder balls disposed on the plurality of upper lands, a die connected to the plurality of upper solder balls, a plurality of lower lands disposed on the other surface of the substrate, a plurality of lower solder balls disposed on some of the plurality of lower lands, and a capacitor connected to the lower lands on which the lower solder balls are not disposed among the plurality of lower lands, provided on an opposite side of the die, and including a height greater than the height of the lower solder ball.
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公开(公告)号:EP4268783A1
公开(公告)日:2023-11-01
申请号:EP22870151.2
申请日:2022-08-11
Applicant: Samsung Electronics Co., Ltd.
Inventor: ROH, Segon , KANG, Wanku , LEE, Sangho , LEE, Ho , HAN, Seungil
Abstract: According to various example embodiments, a motion assistance device may include a proximal support configured to be worn on a proximal part of a user, a distal support configured to be worn on a distal part of the user, a driving assembly which is connected to the proximal support and configured to generate power, and a driving frame configured to transmit the force from the driving assembly to the distal support. The driving assembly may include a housing which is connected to the proximal support, an actuator including a stator which is fixed to the housing and has a ring shape and a rotor which is located inside the stator and rotatable relative to the stator, a speed reducer which is inserted inside the rotor and includes an input end which is connected to an output end of the actuator, and a supporting part configured to support the speed reducer and connected detachably to the housing.
In addition, various example embodiments may be possible.-
公开(公告)号:EP3942753A1
公开(公告)日:2022-01-26
申请号:EP20790607.4
申请日:2020-04-17
Applicant: Samsung Electronics Co., Ltd.
Inventor: KIM, Jihwan , KIM, Junsuk , CHUNG, Wonsuk , KIM, Hyejeong , LEE, Sangho , KIM, Minjung
IPC: H04L12/725 , H04L12/721 , H04L12/851 , H04L12/813
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公开(公告)号:EP3887927A1
公开(公告)日:2021-10-06
申请号:EP20747989.0
申请日:2020-01-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: HONG, Yeona , KIM, Kibeom , OH, Youngmin , LEE, Sangho , SONG, Gajin
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