POLYAMIDE RESIN COMPOSITION
    41.
    发明专利

    公开(公告)号:JPH0376753A

    公开(公告)日:1991-04-02

    申请号:JP21215789

    申请日:1989-08-17

    Abstract: PURPOSE:To obtain the title composition which does not corrode coexistent metals, such as copper (alloy), in a high temperature environment and has excellent heat resistance by incorporating a copper halide, an alkali metal halide, and a specified imidazole compound each in a specified amount into a polyamide resin. CONSTITUTION:The title composition is prepared by mixing 100 pts.wt. polyamide resin (e.g. polyhexamethyleneadipamide) with 0.001-1 pt.wt. copper halide (e.g. CuI), 0.01-5 pts.wt. alkali metal halide (e.g. KI), and 0.005-5 pts.wt. imidazole compound selected from compounds of formulas I to VIII [wherein R1 to R8 are each H, phenyl, benzyl, alkyl, nitro, vinyl, tolyl, (alkyl)amino, carboxyl (except N-substituted carboxyl), hydroxyl, alkoxy, aryl, phenoxy or halogen].

    FLUORINE-CONTAINING AROMATIC POLYESTER

    公开(公告)号:JPS6272720A

    公开(公告)日:1987-04-03

    申请号:JP21228185

    申请日:1985-09-27

    Abstract: PURPOSE:A polyester, having a specific structural formula and melting point within a specific range and specific polymerization degree or above and meltable at a low temperature with improved flame retardance and chemical, abrasion and burning resistance. CONSTITUTION:A polyester having the formula (n is >=100), 230-350 deg.C melting point and >=100 polymerization degree. The above-mentioned polyester is produced by acetylating, e.g. 4-hydroxy-2,3,5,6-tetrafluorobenzoic acid with acetic anhydride to form 4-acetoxy-2,3,5,6-tetrafluorobenzoic acid or an oligomer thereof, deacetylating and polycondensing the resultant product.

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