公开(公告)号：US5275330A

公开(公告)日：1994-01-04

申请号：US46052

申请日：1993-04-12

Applicant: Phillip D. Isaacs ,  Gregg A. Knotts ,  Miles F. Swain ,  Burton A. Towne

Inventor： Phillip D. Isaacs ,  Gregg A. Knotts ,  Miles F. Swain ,  Burton A. Towne

IPC: B23K1/00 ,  H01L21/60 ,  H05K1/11 ,  H05K3/34 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46

CPC classification number: H01L24/81 ,  B23K1/0016 ,  H05K1/112 ,  H05K3/3436 ,  H05K3/3484 ,  B23K2201/42 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2201/09572 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0455 ,  H05K3/429 ,  Y02P70/613

Abstract: A technique for filling hollow, plated-through-hole vias in multi-layer printed circuit substrates with solder and then joining the solder filled via with a solder ball on a solder ball connectable electronic module is disclosed. The filling of the vias is accomplished by depositing solder paste on one end of the hollow via and reflowing the solder particles within the solder paste to at least partially fill the PTH via. The depositing of the solder paste and the reflowing operations may be repeated until such time as the via is substantially completely filled with solid solder. The importance of the prefilling of the vias with solder is that the reflowing operation of solder balls or solder paste when joining the multi-layer printed circuit board to the electronic module, will prevent undue wicking or pulling of molten solder from the electrical connection into the PTH via, thereby preventing the formation of solder starved or unreliable electrical connections.

Abstract translation: 公开了一种用于在具有焊料的多层印刷电路基板中填充中空的通孔通孔，然后将焊料填充的通孔与焊球接合在可焊锡可连接的电子模块上的技术。 通孔的填充是通过在中空通孔的一端上沉积焊膏并将焊锡膏中的焊料颗粒回流到至少部分地填充PTH通孔来实现的。 可以重复焊膏的沉积和回流操作，直到通孔基本上完全充满固体焊料的时间为止。 用焊料预通孔的重要性在于，当将多层印刷电路板接合到电子模块时，焊球或焊膏的回流操作将防止熔融焊料从电连接进入到 PTH通孔，从而防止形成焊料不足或不可靠的电连接。

公开(公告)号：US5102028A

公开(公告)日：1992-04-07

申请号：US725415

申请日：1991-07-01

Applicant: Andrew Z. Glovatsky ,  Robert J. Lynch ,  James G. Motto, Jr. ,  Steve A. Repchak ,  Jean M. Vittone ,  Lawrence R. Yetter

Inventor： Andrew Z. Glovatsky ,  Robert J. Lynch ,  James G. Motto, Jr. ,  Steve A. Repchak ,  Jean M. Vittone ,  Lawrence R. Yetter

IPC: B23K1/00 ,  B23K1/015 ,  B23K1/018 ,  H05K13/04

CPC classification number: H05K13/0465 ,  B23K1/0016 ,  B23K1/015 ,  B23K1/018 ,  B23K2201/42

Abstract: A localized soldering station is described that uses the vapor phase reflow principle. A container has of a medium selected because of the temperature at which it changes to a vapor. A heated conduit maintains the vapor state while conveying the vapor to a work location where a module with a part to be removed or attached by solder connections is supported. A transparent, quartz nozzle confines the vapor to the part and its solder connections and is positioned accurately by a unit that includes a guide light. Vapor will lose its latent heat of vaporization upon contact with the part and its solder connections, causing the solder to reflow and change back to a liquid, which is collected for reuse. When in a standby or ready condition, vapor is conveyed up through a shutoff valve through cooling fins where it changes back to a liquid and returns to the container, avoiding loss.

Abstract translation: 描述了使用气相回流原理的局部焊接站。 容器具有选择的介质，因为其变化到蒸气的温度。 一个加热的导管保持蒸汽状态，同时将蒸气输送到一个工作位置，在那里一个模块具有要被去除或通过焊接连接附着的部件。 透明的石英喷嘴将蒸气限制在零件上及其焊接连接处，并通过包括引导灯的单元精确定位。 蒸汽将在与零件及其焊料连接接触时失去其蒸发潜热，导致焊料回流并返回到液体中，液体被收集以供再利用。 当处于待机状态或就绪状态时，蒸汽通过冷却片向上通过截止阀向上传送，在此处，蒸汽变回液体并返回容器，避免损失。

公开(公告)号：US5007369A

公开(公告)日：1991-04-16

申请号：US402224

申请日：1989-09-01

Applicant: Gilbert V. Morris

Inventor： Gilbert V. Morris

IPC: B23K1/08 ,  B23K3/06 ,  H05K3/34 ,  H05K3/22

CPC classification number: B23K3/0653 ,  B23K1/085 ,  B23K3/0676 ,  H05K3/3468 ,  B23K2201/42 ,  H05K2203/044 ,  H05K2203/0776 ,  H05K2203/081 ,  H05K2203/1509

Abstract: Apparatus for soldering, leveling and cooling printed circuit panels including a preheater, a fluxer, and soldering, leveling and cooling stations. The cooperation of the soldering, leveling and cooling stations provides for efficient processing of printed circuit panels. The soldering station, which includes a solder immersion chamber through which the panels are conveyed, provides an oil coating on the solder to minimize formation of dross. Automatic replenishment of oil through use of suitable flux on the panels to be soldered provide continuous cleaning of the soldering system to permit extended operation. A cooling table transports the soldered panels on a cushion of air to prevent marring.

Abstract translation: 用于焊接，调平和冷却印刷电路板的装置，包括预热器，焊剂和焊接，流平和冷却站。 焊接，调平和冷却站的合作为印刷电路板的高效处理提供了便利。 包括焊盘浸入室的焊接站，其中输送面板，在焊料上提供油涂层以最小化浮渣的形成。 通过在要焊接的面板上使用合适的焊剂自动补充油，可以连续清洁焊接系统，以便延长操作。 冷却台将焊接板运送到空气垫上以防止损坏。

公开(公告)号：US4981249A

公开(公告)日：1991-01-01

申请号：US400605

申请日：1989-08-30

Applicant: Yasuji Kawashima ,  Kazuo Nishibori ,  Yasuhiro Morita ,  Sachiho Hayama

Inventor： Yasuji Kawashima ,  Kazuo Nishibori ,  Yasuhiro Morita ,  Sachiho Hayama

IPC: B23K3/06

CPC classification number: B23K3/0653 ,  B23K2201/42

Abstract: An automatic jet soldering apparatus comprising: a solder bath for holding molten solder therein; a nozzle body having an open top and an open bottom through which the molten solder rises from the solder bath; a punched panel having numerous holes and disposed inside of the nozzle body in such a way to be opened and closed; and a jet source connected to the lower part of the nozzle body, the molten solder rising upward through the nozzle body via the open bottom and the open top of the nozzle body by means of jet power from the jet source. The soldering apparatus further comprises a back rectifying plate mounted on the rear portion of the top opening of the nozzle body, the sloping angle of the back rectifying plate being adjustable, thereby attaining an easy removal of solder residues from the punched panel and achieving a zero relative speed between a printed circuit board and the solder flow velocity, so that the reliability of soldering can be enhanced.

Abstract translation: 一种自动喷射焊接装置，包括：用于在其中保持熔融焊料的焊料槽; 喷嘴体，其具有开口顶部和开口底部，熔融焊料通过该顶部焊料从焊料槽上升; 具有多个孔的穿孔板，以打开和关闭的方式设置在喷嘴体的内部; 以及连接到喷嘴主体的下部的喷射源，熔融焊料通过来自喷射源的喷射动力，经由打开的底部和喷嘴体的开口顶部通过喷嘴主体向上升起。 焊接装置还包括安装在喷嘴主体的顶部开口的后部上的后整流板，后整流板的倾斜角度是可调节的，从而可以容易地从冲孔板去除焊料残留物并实现零点 印刷电路板之间的相对速度和焊料流动速度，从而可以提高焊接的可靠性。

公开(公告)号：US4972989A

公开(公告)日：1990-11-27

申请号：US428575

申请日：1989-10-30

Applicant: Brian J. Black ,  Lisa M. Leding

Inventor： Brian J. Black ,  Lisa M. Leding

IPC: B23K1/00 ,  B23K1/20 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K3/3426 ,  B23K1/0008 ,  B23K1/20 ,  H05K3/341 ,  B23K2201/42 ,  H05K2201/10166 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/1084 ,  H05K2201/10962 ,  H05K2201/10969 ,  H05K3/4015 ,  Y02P70/613

Abstract: A method of joining surface mount components includes screen printing a single layer of solder paste or other adhesive onto a substrate, positioning a component with a planar lead with a hole through the planar lead over the solder and mounting a second component over the hole in the first lead. The assembly is heated or otherwise processed until the solder or adhesive flows by capillary action through the hole and into the space between the components such that it forms solder joint between the stacked components.

Abstract translation: 接合表面安装部件的方法包括将单层焊膏或其它粘合剂丝网印刷到基底上，将具有孔的平面引线的部件通过平面引线定位在焊料上，并将第二部件安装在孔的上方 第一个领先。 组件被加热或以其它方式加工直到焊料或粘合剂通过毛细管作用流过孔并进入部件之间的空间，使得其在堆叠部件之间形成焊接接头。

公开(公告)号：US4869418A

公开(公告)日：1989-09-26

申请号：US269137

申请日：1988-11-09

Applicant: John P. Simpson ,  Gary L. Newman ,  James M. Larnerd ,  Alan J. Emerick

Inventor： John P. Simpson ,  Gary L. Newman ,  James M. Larnerd ,  Alan J. Emerick

IPC: B23K1/08 ,  H05K3/34

CPC classification number: B23K1/08 ,  B23K2201/42 ,  H05K3/3468

Abstract: A method and apparatus for producing flush solder fill over recessed pins and over passage holes in circuitized substrates. A substrate carrying rack is immersed in a vessel of molten solder after it has been similarly immersed in a flux bath. While in the molten solder, the rack is vigorously agitated. The rack is then withdrawn from the molten solder and is pivoted upwardly while positioned over the molten solder. Simultaneously, an anvil is rotated from a home position to an impact position at precisely the correct moment. With the solder still molten on the substrate surfaces, the rack is then permitted to descend and is positively biased to strike the anvil thereby dislodging any excess molten solder. A unique supporting arrangement for the rack insures that only a minimum of mass acutally impacts against the anvil while insuring the effectiveness of the operation. Each cantilevered arm from which a rack is suspended is temporarily supported during the impacting operation after which the support member is withdrawn. Also, a solder pot of unique design and operation is provided to assure rapid, complete heating of substrates while eliminating contamination thereof by dross and oxides.

Abstract translation: 一种用于在凹陷销上产生冲洗焊料的方法和装置，以及在电路化基板中的通孔上。 在将基底承载架类似地浸入焊剂熔池中之后，将其浸入熔融焊料的容器中。 在熔融焊料中，架被剧烈搅动。 然后将架子从熔融焊料中取出，并且在定位在熔融焊料上方的同时向上枢转。 同时，在正确的时刻，砧座从起始位置旋转到冲击位置。 由于焊料仍然在基板表面上熔化，则允许齿条下降并且被正向偏压以撞击砧座，从而移除任何多余的熔融焊料。 机架的独特配套安排确保在确保操作的有效性的同时，只有最小的质量对砧座产生严重的影响。 在冲击操作期间暂时支撑悬挂架的每个悬臂，支撑构件被抽出之后。 此外，提供独特的设计和操作的焊料罐，以确保快速，完全地加热基板，同时消除浮渣和氧化物的污染。

公开(公告)号：US4773583A

公开(公告)日：1988-09-27

申请号：US940418

申请日：1986-12-11

Applicant: Ginya Ishii ,  Yoshihiro Miyano

Inventor： Ginya Ishii ,  Yoshihiro Miyano

IPC: B23K1/08 ,  B23K3/06 ,  H05K3/34

CPC classification number: B23K3/0653 ,  B23K2201/42

Abstract: A soldering device wherein the article to be soldered is moved into contact with molten solder which flows in the direction counter to the direction of movement of said article is characterized by including a nozzle for flowing said molten solder and a flow path of a channel shape provided contiguous thereto for circulating said molten solder flowed out of said nozzle, said flow path having side-wall plates which are vertically adjustable.

Abstract translation: 一种焊接装置，其中待焊接的物品与与所述制品的运动方向相反的方向流动的熔融焊料移动，其特征在于包括用于使所述熔融焊料流动的喷嘴和提供的通道形状的流动路径 用于循环从所述喷嘴流出的所述熔融焊料，所述流动路径具有可垂直调节的侧壁板。

公开(公告)号：US4759491A

公开(公告)日：1988-07-26

申请号：US50359

申请日：1987-05-18

Applicant: John R. Fisher

Inventor： John R. Fisher

IPC: B23K3/06 ,  H01L21/00 ,  H05K3/34 ,  H05K7/10 ,  B23K1/20 ,  B23K3/00 ,  B23K31/02

CPC classification number: H01L21/67138 ,  B23K3/06 ,  H05K3/3426 ,  H05K3/3478 ,  H05K7/1023 ,  B23K2201/42 ,  H05K2201/10689 ,  H05K2201/10984 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/041 ,  Y02P70/613

Abstract: A controlled amount of a solder is applied to the tip (18) of each lead (14) of a multi-lead component (10) by first placing a solder sphere (30) in each of a plurality of cavities (24) arranged in a baseplate (22) in the same pattern as the tips of the leads. Thereafter, the tips of the leads of the component are placed in contact with the solder spheres while, at the same time, at least a pair of leads are each engaged by a separate one of a pair of alignment pins (32) rising upwardly from the baseplate. The alignment pins serve to constrain the lateral movement of the component, thereby maintaining the leads thereof in alignment with the solder spheres when the solder spheres are reflowed to bond to the tips of the leads.

Abstract translation: 通过首先在多个空腔（24）中的每一个中放置焊球（30）将受控量的焊料施加到多引线部件（10）的每个引线（14）的尖端（18） 一个基板（22）与引线的尖端相同的图案。 此后，部件的引线的尖端被放置成与焊球接触，同时，至少一对引线分别由一对对准销（32）中的一个引导件从 底板。 对准销用于约束部件的横向运动，从而当焊球重新流动以结合到引线的尖端时，使引线保持与焊球对准。

公开(公告)号：US4752027A

公开(公告)日：1988-06-21

申请号：US17112

申请日：1987-02-20

Applicant: Stephen J. Gschwend

Inventor： Stephen J. Gschwend

IPC: B23K3/06 ,  H05K3/34 ,  B23K31/02

CPC classification number: B23K3/06 ,  H05K3/3457 ,  H05K3/3489 ,  B23K2201/42 ,  H05K2203/0143 ,  H05K2203/0278 ,  H05K2203/043 ,  H05K2203/0485

Abstract: A method and apparatus for preparing printed circuit boards having flattened solder bumps for the mounting of surface mount components is provided. Using well-known techniques, solder paste is screen-printed onto printed circuit boards and reflowed and cleaned to form discrete solder bumps. Using roller machines, the peaks of the solder bumps are flattened and adhesive solder flux is applied to the flattened tops of the solder bumps. The adhesive solder flux holds the surface mount components in position after placement and during vapor phase reflow.

Abstract translation: 提供了一种用于制备具有用于安装表面安装部件的扁平焊料凸块的印刷电路板的方法和装置。 使用众所周知的技术，将焊膏丝网印刷到印刷电路板上并回流和清洁以形成分立的焊料凸块。 使用滚筒机器，焊料凸点的峰值变平，并且粘合剂焊剂被施加到焊料凸块的扁平顶部。 粘合剂焊剂在放置后和气相回流期间将表面安装部件保持在适当的位置。

公开(公告)号：US4681250A

公开(公告)日：1987-07-21

申请号：US891932

申请日：1986-07-30

Applicant: Gerard G. Derrico

Inventor： Gerard G. Derrico

IPC: B23K1/015 ,  B23K3/06 ,  H05K3/34 ,  B23K1/08

CPC classification number: B23K3/0653 ,  B23K1/015 ,  B23K2201/42

Abstract: A machine for soldering a work product. Work product is conveyed through the machine and an applicator directs an extended liquid stream against the conveyed work product. The applicator is rotatable about a horizontal axis and a rotatable manifold assembly delivers liquid to the applicator and the manifold assembly is rotatable about an axis parallel to the axis of the applicator means and is rotated by a bell crank which is supported for rotation about the axis of the manifold assembly and a link member which is pivotally connected between the bell crank and the applicator with the points of interconnection defining with the axes of rotation of the applicator and the manifold assembly a parallelogram so that rotation of the bell crank will rotate the applicator means.

Abstract translation: 用于焊接工作产品的机器。 工作产品通过机器输送，并且施加器将延伸的液体流引导到被输送的工件上。 施加器可围绕水平轴线旋转，并且可旋转的歧管组件将液体输送到施加器，并且歧管组件可绕平行于施用器装置的轴线的轴线旋转，并且通过支撑用于围绕轴线旋转的钟形曲柄旋转 并且枢转地连接在所述钟形曲柄和所述施加器之间的连接构件，所述互连点限定了所述施用器和所述歧管组件的旋转轴线为平行四边形，使得所述钟形曲柄的旋转将旋转所述施加器 手段。