公开(公告)号：EP1254249A4

公开(公告)日：2005-07-06

申请号：EP00986549

申请日：2000-12-19

Applicant: PENN STATE RES FOUND

Inventor： FONASH STEPHEN J ,  BAE SANGHOON ,  HAYES DANIEL J ,  CUIFFI JOSEPH

IPC: G01N27/62 ,  B81B3/00 ,  B81C1/00 ,  C12Q1/02 ,  C12Q1/68 ,  C23C16/24 ,  C23C16/511 ,  G01N1/28 ,  G01N21/17 ,  G01N27/447 ,  G01N30/04 ,  G01N33/48 ,  G01N33/543 ,  G01N33/552 ,  G01N33/68 ,  C12Q1/00 ,  G01N15/06 ,  G01N21/29 ,  G01N21/41 ,  G01N21/47 ,  G01N27/00 ,  G01N33/00 ,  G01N33/53 ,  G01N33/567

CPC classification number: C23C16/511 ,  B81B2201/0214 ,  B81C1/0038 ,  B81C2201/0176 ,  C23C16/24 ,  G01N21/17 ,  G01N27/44717 ,  Y10T436/119163 ,  Y10T436/25 ,  Y10T436/2575

Abstract: The present invention is directed to the use of deposited thin films for chemical or biological analysis. The invention further relates to the use of these thin films in separation adherence and detection of chemical of biological samples. Applications of these thin films include desorption-ionization mass spectroscopy, electrical contacts for organic thin films and molecules, optical coupling of light energy for analysis, biological materials manipulation, chromatographic separation, head space adsorbance media, media for atomic molecular adsorbance or attachment, and substrates for cell attachment.

公开(公告)号：KR100509873B1

公开(公告)日：2005-08-25

申请号：KR1019997010392

申请日：1998-04-17

Applicant: 로베르트 보쉬 게엠베하

Inventor： 쉐프트할러마틴 ,  헤인페터 ,  스카파헬무트 ,  문젤호르스트

IPC: G01P15/08

CPC classification number: G01P15/0802 ,  B81B3/0005 ,  B81C1/0096 ,  B81C2201/0176 ,  B81C2201/112 ,  G01P1/023

Abstract: 본 발명은 마이크로미케니컬 부품품을 제조하기 위한 방법에 관한 것이다. 본 발명에 따라서, 가동 소자(4)는 희생층(2)상에 형성된다. 후속 단계에서, 가동 소자(4) 하부의 희생층(2)은 제거되어, 상기 가동 소자(4)가 움직일 수 있다. 희생층(2)이 제거된 후에, 가동 소자(4)의 표면 상에는 보호층(7)이 증착된다. 보호층(7)으로서는 산화실리콘 또는 질화실리콘이 이용될 수 있다.

公开(公告)号：EP3052429A1

公开(公告)日：2016-08-10

申请号：EP14777233.9

申请日：2014-09-15

Applicant: Cavendish Kinetics, Inc.

Inventor： RENAULT, Mickael

IPC: B81C1/00

CPC classification number: B81C1/0038 ,  B81C1/00801 ,  B81C2201/0108 ,  B81C2201/0176 ,  B81C2201/053

Abstract: The present invention generally relates to a method for forming a MEMS device and a MEMS device formed by the method. When forming the MEMS device, sacrificial material is deposited around the switching element within the cavity body. The sacrificial material is eventually removed to free the switching element in the cavity. The switching element has a thin dielectric layer thereover to prevent etchant interaction with the conductive material of the switching element. During fabrication, the dielectric layer is deposited over the sacrificial material. To ensure good adhesion between the dielectric layer and the sacrificial material, a silicon rich silicon oxide layer is deposited onto the sacrificial material before depositing the dielectric layer thereon.

公开(公告)号：EP2739561A1

公开(公告)日：2014-06-11

申请号：EP12759289.7

申请日：2012-08-03

Applicant: Robert Bosch GmbH

Inventor： FEYH, Ando ,  CLASSEN, Johannes

IPC: B81B3/00

CPC classification number: B81B3/0086 ,  B81B3/0008 ,  B81C2201/0169 ,  B81C2201/017 ,  B81C2201/0176

Abstract: In one embodiment, a method of forming a MEMS device includes providing a substrate, forming a sacrificial layer above the substrate layer, forming a silicon based working portion on the sacrificial layer, releasing the silicon based working portion from the sacrificial layer such that the working portion includes at least one exposed outer surface, forming a first layer of silicide forming metal on the at least one exposed outer surface of the silicon based working portion, and forming a first silicide layer with the first layer of silicide forming metal.

公开(公告)号：EP1634328A4

公开(公告)日：2011-07-06

申请号：EP04785661

申请日：2004-03-30

Applicant: BOSCH GMBH ROBERT

Inventor： PARTRIDGE AARON ,  LUTZ MARKUS ,  KRONMUELLER SILVIA

IPC: B81C1/00 ,  H01L20060101 ,  H01L21/44 ,  H01L23/28 ,  H01L23/48 ,  H01L23/52 ,  H01L27/14 ,  H01L29/40 ,  H01L29/82 ,  H01L29/84

CPC classification number: B81C1/00261 ,  B81B2207/015 ,  B81C1/00333 ,  B81C2201/0176 ,  B81C2203/0136 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：EP1633673A4

公开(公告)日：2011-07-06

申请号：EP04785662

申请日：2004-03-30

Applicant: BOSCH GMBH ROBERT

Inventor： PARTRIDGE AARON ,  LUTZ MARKUS ,  KRONMUELLER SILVIA

IPC: H01L21/00 ,  B81B7/00 ,  B81C1/00

CPC classification number: B81C1/00301 ,  B81B2207/015 ,  B81B2207/095 ,  B81C2201/0176 ,  B81C2203/0136

公开(公告)号：EP1254249A1

公开(公告)日：2002-11-06

申请号：EP00986549.4

申请日：2000-12-19

Applicant: THE PENN STATE RESEARCH FOUNDATION

Inventor： FONASH, Stephen, J. ,  BAE, Sanghoon ,  HAYES, Daniel, J. ,  CUIFFI, Joseph

IPC: C12Q1/00 ,  G01N33/53 ,  G01N33/567 ,  G01N15/06 ,  G01N33/00 ,  G01N33/48 ,  G01N27/00 ,  G01N21/29 ,  G01N21/41 ,  G01N21/47

CPC classification number: C23C16/511 ,  B81B2201/0214 ,  B81C1/0038 ,  B81C2201/0176 ,  C23C16/24 ,  G01N21/17 ,  G01N27/44717 ,  Y10T436/119163 ,  Y10T436/25 ,  Y10T436/2575

Abstract: The present invention is directed to the use of deposited thin films for chemical or biological analysis. The invention further relates to the use of these thin films in separation adherence and detection of chemical of biological samples. Applications of these thin films include desorption-ionization mass spectroscopy, electrical contacts for organic thin films and molecules, optical coupling of light energy for analysis, biological materials manipulation, chromatographic separation, head space adsorbance media, media for atomic molecular adsorbance or attachment, and substrates for cell attachment.

公开(公告)号：EP3214037A1

公开(公告)日：2017-09-06

申请号：EP15762910.6

申请日：2015-04-15

Applicant: BOE Technology Group Co., Ltd.

Inventor： JI, Chunyan ,  YANG, Tian

IPC: B81C1/00 ,  H01L41/00

CPC classification number: B81B3/0021 ,  B81B2203/0109 ,  B81B2203/0127 ,  B81C1/00142 ,  B81C1/00158 ,  B81C2201/013 ,  B81C2201/0176 ,  B81C2201/0181 ,  C23C14/0605 ,  C23C14/0617 ,  C23C14/14 ,  C23C14/34 ,  F24S25/30 ,  F24S25/636 ,  F24S2025/016 ,  F24S2025/801 ,  F24S2025/807 ,  G01F1/56 ,  G01J1/42 ,  H02S20/00 ,  Y02E10/47 ,  Y02E10/50

Abstract: The present invention relates to the field of sensor manufacturing technology, particularly disloses a method for manufacturing a micro-sensor body, compriseing the steps of S1: applying a wet colloidal material on a substrate to form a colloidal layer, and covering a layer of one-dimensional nanowire film on the surface of the colloidal layer to form a sensor embryo; S2: drying the colloidal layer of the sensor embryo to an extent that the colloidal layer cracks into a plurality of colloidal islands, a portion of the one-dimensional nanowire film contracting into a contraction diaphragm adhered to the surface of the colloidal islands while the other portion of the one-dimensional nanowire film being stretched into a connection structure connected between the adjacent contraction diaphragms. By the method for manufacturing a micro-sensor body of the present invention, the contraction diaphragms and connection structures formed by stretching the one-dimensional nanowire film are connected stably, which enhances the stability of the sensor devices; and the cracking manner renders it easy to obtain a large-scale of sensor bodies with connection structure arrays in stable suspension.

Abstract translation: 传感器制造技术领域本发明涉及传感器制造技术领域，特别涉及制造微传感器主体的方法，其包括以下步骤：S1：在基底上施加湿胶体材料以形成胶体层，并且覆盖一层 - 在胶体层的表面上形成三维纳米线膜以形成传感器胚胎; S2：将传感器胚胎的胶体层干燥至胶体层裂开成多个胶体岛的程度，一维纳米线膜的一部分收缩成粘附到胶体岛表面的收缩隔膜，而另一个 一维纳米线膜的一部分被拉伸成连接在相邻收缩隔膜之间的连接结构。 通过本发明的微传感器体的制造方法，通过拉伸一维纳米线膜形成的收缩隔膜和连接结构稳定连接，提高了传感器器件的稳定性; 开裂方式使得连接结构阵列在稳定悬浮状态下获得大规模的传感器主体变得容易。

公开(公告)号：EP1258035A4

公开(公告)日：2008-12-24

申请号：EP01905118

申请日：2001-01-29

Applicant: ANALOG DEVICES INC

Inventor： MARTIN JOHN R

IPC: H01L21/31 ,  H01L21/316 ,  B81B3/00 ,  B81C1/00 ,  H01L21/00 ,  H01L21/312 ,  H01L21/469

CPC classification number: H01L21/3122 ,  B81B3/0005 ,  B81C1/0096 ,  B81C2201/0176 ,  B81C2201/112 ,  H01L21/02126 ,  H01L21/02216 ,  H01L21/02263 ,  H01L24/05 ,  H01L24/45 ,  H01L2224/05624 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48624 ,  H01L2224/73265 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014

Abstract: This invention disclosed a process for forming durable anti-stiction surfaces on micromachined structures while they are still in wafer form (i.e., before they are separated into discrete devices for assembly into packages). This process involves the vapor deposition of a material to create a low stiction surface. It also discloses chemicals which are effective in imparting an anti-stiction property to the chip. These include polyphenylsiloxanes, silanol terminated phenylsiloxanes and similar materials.

公开(公告)号：EP1254249B1

公开(公告)日：2007-06-20

申请号：EP00986549.4

申请日：2000-12-19

Applicant: THE PENN STATE RESEARCH FOUNDATION

Inventor： FONASH, Stephen, J. ,  BAE, Sanghoon ,  HAYES, Daniel, J. ,  CUIFFI, Joseph

IPC: C12Q1/00 ,  G01N33/53 ,  G01N33/567 ,  G01N15/06 ,  G01N33/00 ,  G01N33/48 ,  G01N27/00 ,  G01N21/29 ,  G01N21/41 ,  G01N21/47 ,  G01N33/552 ,  G01N33/68

CPC classification number: C23C16/511 ,  B81B2201/0214 ,  B81C1/0038 ,  B81C2201/0176 ,  C23C16/24 ,  G01N21/17 ,  G01N27/44717 ,  Y10T436/119163 ,  Y10T436/25 ,  Y10T436/2575

Abstract: The present invention is directed to the use of deposited thin films for chemical or biological analysis. The invention further relates to the use of these thin films in separation adherence and detection of chemical of biological samples. Applications of these thin films include desorption-ionization mass spectroscopy, electrical contacts for organic thin films and molecules, optical coupling of light energy for analysis, biological materials manipulation, chromatographic separation, head space adsorbance media, media for atomic molecular adsorbance or attachment, and substrates for cell attachment.