Abstract:
A vacuum pumping line plasma source is provided. The plasma source includes a body defining a generally cylindrical interior volume extending along a central longitudinal axis. The body has an input port for coupling to an input pumping line, an output port for coupling to an output pumping line, and an interior surface disposed about the generally cylindrical interior volume. The plasma source also includes a supply electrode disposed adjacent to a return electrode, and a barrier dielectric member, a least a portion of which is positioned between the supply electrode and the return electrode. The plasma source further includes a dielectric barrier discharge structure formed from the supply electrode, the return electrode, and the barrier dielectric member. The dielectric barrier discharge structure is adapted to generate a plasma in the generally cylindrical interior volume.
Abstract:
본 발명은 유입구 및 배출구가 형성되며, 내부에 흡착제가 충진되는 플라즈마 방전부; 및 상기 플라즈마 방전부의 내부에 플라즈마를 발생시키는 전극부;를 포함하며, 상기 흡착제는 촉매가 담지되어 있는 것을 특징으로 하는 에틸렌 처리장치에 관한 것이다. 본 발명은 상기 에틸렌 처리장치를 이용하여, (a) 상기 흡착제가 충진된 플라즈마 방전부 내에 에틸렌을 함유한 가스를 주입시키는 단계; (b) 상기 전극부에 전압을 인가하고, 상기 플라즈마 방전부 내에 플라즈마를 발생시켜 주입된 에틸렌을 분해하는 단계; 및 (c) 상기 플라즈마 방전부를 냉각시키는 단계; 를 포함하는 에틸렌 처리방법에 관한 것이다.
Abstract:
Embodiments of the disclosure relate to a remote plasma source for cleaning an exhaust pipe. In one embodiment, an apparatus includes a substrate processing chamber, a pump positioned to evacuate the substrate processing chamber, and an abatement system. The abatement system comprises a plasma gas delivery system positioned between the substrate processing chamber and the pump, the gas delivery system having a first end coupling to the substrate processing chamber and a second end coupling to the pump, a reactor body connected to the gas delivery system through a delivery member, a cleaning gas source connected to the reactor body, and a power source positioned to ionize within the reactor body a cleaning gas from the cleaning gas source. Radicals and species of the cleaning gas react with post-process gases from the substrate processing chamber to convert them into a environmentally and process equipment friendly composition before entering the pump.
Abstract:
Embodiments of the present invention provide a recursive liner system that facilitates providing more uniform flow of gases proximate the surface of a substrate disposed within an apparatus for processing a substrate (e.g., a process chamber). In some embodiments, a recursive liner system may include an outer liner having an outer portion configured to line the walls of a process chamber, a bottom portion extending inward from the outer portion, and a lip extending up from the bottom portion to define a well; and an inner liner having a lower portion configured to be at least partially disposed in the well to define, together with the outer liner, a recursive flow path therebetween.
Abstract:
A plasma reactor comprises a reaction chamber and an inlet head connected to the reaction chamber. The inlet head comprises an open end connected to the reaction chamber, a plasma inlet located opposite to the open end, an inner surface tapering from the open end towards the plasma inlet, and first and second gas inlets each located between the plasma inlet and the open end. A plasma torch injects a plasma stream into the reaction chamber through the plasma inlet, which is shaped to cause the plasma stream to spread outwardly towards the first and second gas inlets. This shaping of the inlet head and the plasma inlet can enable the plasma stream to impinge upon gas streams as they exit from the gas inlets and thereby cause a significant proportion of at least one component of the gas streams to be reacted before the gas streams begin to mix within the chamber.
Abstract:
A plasma apparatus, various components of the plasma apparatus, and an oxygen free and nitrogen free processes for effectively removing photoresist material and post etch residues from a substrate with a carbon and/or hydrogen containing low k dielectric layer(s).
Abstract:
The present invention relates to an ethylene disposal apparatus comprising: a plasma discharge part having an inlet and an outlet and being filled with an adsorbent; and an electrode part for generating plasma inside the plasma discharge part, wherein the adsorbent has a catalyst supported thereon. The present invention relates to an ethylene disposal method using the ethylene disposal apparatus, the method comprising the steps of: (a) injecting ethylene-containing gas into a plasma discharge part filled with the adsorbent; (b) applying voltage to the electrode part and generating plasma in the plasma discharge part, thereby degrading the injected ethylene; and (c) cooling the plasma discharge part.