公开(公告)号：US20010005531A1

公开(公告)日：2001-06-28

申请号：US09770201

申请日：2001-01-29

Inventor： Kazufumi Ogawa

IPC: B05D003/10 ,  C09D001/02 ,  B05D003/04 ,  B05D003/02

CPC classification number: B82Y30/00 ,  B05D1/185 ,  B82Y40/00 ,  C03C17/30 ,  C09D4/00 ,  C08G77/04

Abstract: The methods of forming a chemically adsorbed film by contacting a substrate with a solution mixture containing an alkoxysilane surface active agent, a non-aqueous solvent and a silanol-condensing catalyst to form a film covalently bonded to the substrate via siloxane bonds. These methods do not generate hydrochloric acid gas in forming the films and allow practical reaction rates.

公开(公告)号：US20010002273A1

公开(公告)日：2001-05-31

申请号：US09191634

申请日：1998-11-13

Inventor： VIKRAM JOSHI ,  NARAYAN SOLAYAPPAN ,  WALTER HARTNER ,  GUNTHER SCHINDLER

IPC: B05D003/02 ,  B05D003/04

CPC classification number: H01L27/11502 ,  H01L27/11507 ,  H01L28/55

Abstract: An integrated circuit is formed containing a metal-oxide ferroelectric thin film. An inert-gas recovery anneal is conducted to reverse the degradation of ferroelectric properties caused by hydrogen. The inert-gas recovery anneal is conducted in an unreactive gas atmosphere at a temperature range from 300null to 1000null C. for a time period from one minute to two hours. Preferably, the metal-oxide thin film comprises layered superlattice material. Preferably, the layered superlattice material comprises strontium bismuth tantalate or strontium bismuth tantalum niobate. If the integrated circuit manufacture includes a forming-gas anneal, then the inert-gas recovery anneal is performed after the forming-gas anneal, preferably at or near the same temperature and for the same time duration as the forming-gas anneal. The inert-gas recovery anneal obviates oxygen-recovery annealing, and it allows continued use of conventional hydrogen-rich plasma processes and forming-gas anneals without the risk of permanent damage to the ferroelectric thin film. The unreactive gas atmosphere can contain a pure unreactive gas or a mixture of unreactive gases. The unreactive gas can be any relatively unreactive gas, such as nitrogen or argon.

Abstract translation: 形成含有金属氧化物铁电体薄膜的集成电路。 进行惰性气体回收退火以逆转由氢引起的铁电性能的降低。 惰性气体回收退火在300〜1000℃的无反应气体气氛中进行1分钟〜2小时。 优选地，金属氧化物薄膜包括层状超晶格材料。 优选地，层状超晶格材料包括铋铋钽酸锶或铌酸铋钽酸铋。 如果集成电路制造包括成形气体退火，则惰性气体回收退火在成形气体退火之后进行，优选在与成形气体退火相同或接近相同的温度和相同的持续时间。 惰性气体回收退火避免了氧回收退火，并且允许继续使用常规富氢等离子体工艺和形成气体退火，而不会对铁电薄膜造成永久性损坏的风险。 非活性气体气氛可以含有纯的非反应性气体或非反应性气体的混合物。 非反应性气体可以是任何相对不反应的气体，例如氮气或氩气。

公开(公告)号：US20040241326A1

公开(公告)日：2004-12-02

申请号：US10466024

申请日：2003-07-10

Inventor： Jeong-Su Yu ,  Jong-Sung Park ,  Du-Hyun Shin ,  Kum-Suek Seo

IPC: B05D003/10 ,  B05D003/04

CPC classification number: B08B1/02 ,  G02F1/133784

Abstract: The present invention provides a rubbing device including a base roller assembly that suspends and otherwise supports a base film to convey the same in one direction; a rubbing roller assembly that suspends and otherwise supports a rubbing cloth, and that moves the rubbing cloth in a direction opposite a conveying direction of the base film to thereby realize a rubbing treatment by contact between the rubbing cloth and the base film; and a rotating apparatus provided under the rubbing roller assembly and that rotates the entire rubbing roller assembly to a particular angle within the range of 0-180null in the clockwise or counterclockwise direction with respect to the conveying direction of the base film.

Abstract translation: 本发明提供了一种摩擦装置，其包括：底部辊组件，其悬挂或以其他方式支撑基膜以在一个方向上输送基底膜; 摩擦辊组件，其悬挂或以其他方式支撑摩擦布，并使摩擦布沿与基膜的输送方向相反的方向移动，从而通过摩擦布与基膜之间的接触实现摩擦处理; 以及旋转装置，设置在摩擦辊组件的下方，并且使整个摩擦辊组件相对于基膜的输送方向在顺时针或逆时针方向上以0-180°的范围旋转特定的角度。

公开(公告)号：US20040234777A1

公开(公告)日：2004-11-25

申请号：US10805527

申请日：2004-03-22

Inventor： John Grunwald

IPC: B05D003/04 ,  B32B009/04

CPC classification number: C23C18/1865 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1658 ,  C23C18/1879 ,  C23C18/1889 ,  C23C18/208 ,  C23C18/40 ,  C23C18/44 ,  H05K3/181 ,  Y10T428/31605 ,  Y10T428/31678

Abstract: An article of manufacture produced by a method for electroless plating a metallic layer on the surface of a non-metallic substrate. The method comprises (a) exposing the non-metallic substrate to a solution comprising non-precious metal ions so as to obtain a non-metallic substrate covered with a layer of non-precious metal ions; and (b) exposing the covered non-metallic substrate obtained in step (a) to a reducing solution comprising a reducing agent capable of reducing the metal ions that cover the substrate from their oxidation state in step (a) to a lower oxidation state, preferably to zero valence state. In a preferred embodiment, metallization is accomplished by inducing precipitation of metal, e.g. copper, on the surface to be metallized (this effect also being referred to as nullplate-outnull), via decomposition of the electroless solution. The inventive process contrasts with the prior art, wherein electroless copper deposition is predominantly initiated or triggered through a Pc-bearing layer. Preferably, the non-precious metal ions used in step (a) are copper or nickel ions, whereas the plated metal is copper. The non-metallic substrate is made of insulating materials, for example organic polymers, silicon-containing materials, glass-epoxy composites and the like. The reducing agent is selected from a group consisting of borane compounds, e.g. dimethylamino borane (DMAB) and alkali metal or alkaline earth metal borohydrides.

Abstract translation: 通过非金属基板表面上的金属层的无电镀方法制造的制品。 该方法包括：（a）将非金属基底暴露于包含非贵金属离子的溶液中，以获得被非贵金属离子层覆盖的非金属基底; 和（b）将步骤（a）中获得的被覆非金属底物曝光于还原溶液中，所述还原溶液包含还原剂，所述还原剂能够将在步骤（a）中将覆盖所述基材的金属离子从其氧化态降低到较低的氧化态， 优选为零价态。 在优选的实施方案中，金属化是通过诱导金属沉淀来实现的。 通过化学溶液的分解，待金属化表面上的铜（该效果也称为“平板电镀”）。 本发明的方法与现有技术不同，其中化学镀铜沉积主要通过Pc承载层引发或触发。 优选地，步骤（a）中使用的非贵金属离子是铜或镍离子，而镀金属是铜。 非金属基材由绝缘材料制成，例如有机聚合物，含硅材料，玻璃 - 环氧复合材料等。 还原剂选自由硼烷化合物组成的组，例如 二甲基氨基硼烷（DMAB）和碱金属或碱土金属硼氢化物。

公开(公告)号：US20040219298A1

公开(公告)日：2004-11-04

申请号：US10769778

申请日：2004-02-03

Inventor： Akira Fukunaga ,  Haruko Ono ,  Hiroaki Inoue ,  Shohei Shima

IPC: B05D003/04 ,  B05D003/10 ,  H01L021/4763

CPC classification number: H01L21/02068 ,  C23C18/1608 ,  C23C18/1635 ,  C23C18/1675 ,  C23C18/1676 ,  C23C18/1689 ,  C23C18/1692 ,  C23C18/1803 ,  C23C18/1831 ,  C23C18/32 ,  C23C18/50 ,  H01L21/02074 ,  H01L21/02087 ,  H01L21/288 ,  H01L21/32115 ,  H01L21/3212 ,  H01L21/7684 ,  H01L21/76843 ,  H01L21/76849 ,  H01L21/76874

Abstract: The present invention provides a substrate processing method and a substrate processing apparatus which has reproducibility over a surface of a substrate such as a semiconductor wafer and between substrates and can manufacture semiconductor devices or the like with a high yield. According to the present invention, a substrate processing method of forming a protective film selectively on bottom surfaces and side surfaces or exposed surfaces of embedded interconnects formed in a surface of a substrate is characterized by performing a pre-plating process on the substrate, carrying out electroless plating on the surface of the substrate after the pre-plating process to form the protective film selectively on the bottom surfaces and the side surfaces or the exposed surfaces of the interconnects, and bringing the substrate into a dry state after the electroless plating.

Abstract translation: 本发明提供一种在诸如半导体晶片的基板的表面和基板之间具有再现性的基板处理方法和基板处理装置，并且可以以高产率制造半导体器件等。 根据本发明，在基板的表面形成的嵌入式互连件的底面和侧面或露出面上选择性地形成保护膜的基板处理方法的特征在于，在基板上进行预镀工序，进行 在预镀工艺之后，在基板的表面上进行化学镀，以在互连的底面和侧面或露出面上选择性地形成保护膜，并且在化学镀后使基板处于干燥状态。

公开(公告)号：US20040131781A1

公开(公告)日：2004-07-08

申请号：US10732273

申请日：2003-12-11

Applicant: FUJI PHOTO FILM CO., LTD.

Inventor： Toshihiro Mandai ,  Mikio Tomaru ,  Norio Shibata

IPC: B05D003/04 ,  B05D003/12 ,  B05C001/00 ,  B05D003/00

CPC classification number: B05C11/1039 ,  B05C5/0254 ,  B05C5/0258 ,  B05D1/26 ,  G03C1/74 ,  G11B5/842

Abstract: The coating apparatus and method enable the coating liquid having been scraped-off to be reused without doing any one of the fluid adjusting treatment and the filtering treatment, while maintaining the features of the scraping-off type of extrusion coater, which is suitable for obtaining a uniform and extremely thin coating film. The coating head is provided with two slits: a coating slit and a recovering slit, and the excessive coating liquid having been discharged through the coating slit and applied to the web is scraped-off and recovered through the recovering slit.

Abstract translation: 涂布装置和方法使得可以在不进行任何一种流体调节处理和过滤处理的情况下重复使用被刮除的涂布液，同时保持适于获得的刮涂式挤出涂布机的特征 均匀且极薄的涂膜。 涂布头设置有两个狭缝：涂层狭缝和回收狭缝，并且通过涂布狭缝排出并施加到幅材上的过量涂布液被刮掉并通过回收缝隙回收。

公开(公告)号：US20040096587A1

公开(公告)日：2004-05-20

申请号：US10704840

申请日：2003-11-10

Inventor： Sankar Sambasivan ,  Scott A. Barnett ,  Ilwon Kim ,  John Rechner

IPC: B05D003/04

CPC classification number: H01L39/2461 ,  C23C8/02 ,  C30B23/02 ,  C30B29/22 ,  C30B29/225 ,  C30B29/38 ,  C30B33/005

Abstract: The present invention relates to oxides on suitable substrates, as converted from nitride precursors.

公开(公告)号：US20040092782A1

公开(公告)日：2004-05-13

申请号：US10289731

申请日：2002-11-07

Inventor： W. James Catallo

IPC: B05D003/04

CPC classification number: C10G1/065 ,  B27K3/46 ,  C10G1/04 ,  C22B7/006 ,  Y02P10/234

Abstract: An environmentally-friendly method is disclosed for transforming preserved wood, for example creosote-treated or CCA-treated wood with supercritical water. The product of treating weathered creosote-treated wood is a mixture that is similar to fresh creosote. The novel system is akin to a closed-loop system for recovering and rejuvenating creosote. In another aspect of the invention, acidic supercritical water is used to extract copper, chromium, and arsenic from CCA-treated wood, or more generally, to extract metals from an organic matrix.

Abstract translation: 公开了一种环境友好的方法，用于转化腌制木材，例如用超临界水进行杂酚油处理或经CCA处理的木材。 处理风化的杂酚油处理木材的产品是与新鲜杂酚油相似的混合物。 这个新系统类似于一个闭环系统，用于恢复和振兴杂酚油。 在本发明的另一方面，使用酸性超临界水从CCA处理的木材中提取铜，铬和砷，或更通常地从有机基质中提取金属。

公开(公告)号：US20040033316A1

公开(公告)日：2004-02-19

申请号：US10641422

申请日：2003-08-15

Inventor： Ruben G. Carbonell ,  Joseph M. DeSimone ,  Brian J. Novick

IPC: B05D003/04 ,  B05D001/18

CPC classification number: D06B1/08 ,  B05D1/18 ,  B05D2401/90 ,  D06B3/10 ,  D06B19/00 ,  D06M23/00 ,  D06M23/10 ,  D06M23/105

Abstract: A method of coating a substrate comprises immersing a surface portion of a substrate in a first phase comprising carbon dioxide and a coating component comprising a polymeric precursor; then withdrawing the substrate from the first phase into a distinct second phase so that the coating component is deposited on the surface portion; and then subjecting the substrate to conditions sufficient to polymerize the polymeric precursor and form a polymerized coating.

Abstract translation: 涂覆基材的方法包括将基材的表面部分浸入包含二氧化碳的第一相和包含聚合物前体的涂料组分; 然后将衬底从第一相中提取到不同的第二相中，使得涂层组分沉积在表面部分上; 然后使基底经受足以使聚合物前体聚合并形成聚合涂层的条件。

公开(公告)号：US20030185607A1

公开(公告)日：2003-10-02

申请号：US10343426

申请日：2003-05-27

Inventor： Gerd Goldman ,  Frank Keidel ,  Peter Segerer ,  G?uuml;nter Rosenstock

IPC: G03G015/20 ,  B05D003/10 ,  B05D003/04 ,  G03G013/20

CPC classification number: G03G11/00 ,  G03G15/2096

Abstract: A device and method for fixing a tone image on a support material (22) uses solvent vapour. A directed stream (34) containing solvent vapour is produced, this stream being directed at a section of the support material (22) using a nozzle device (36).

Abstract translation: 用于将色调图像固定在支撑材料（22）上的装置和方法使用溶剂蒸汽。 产生含有溶剂蒸气的定向流（34），该流体使用喷嘴装置（36）引导到支撑材料（22）的一部分。