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51.发明专利
公开(公告)号：JP2006144073A
公开(公告)日：2006-06-08
申请号：JP2004335506
申请日：2004-11-19
Applicant: Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , 株式会社大和化成研究所 , 石原薬品株式会社
Inventor： HAGA MASAKI , NISHIKAWA TETSUJI , TANAKA KAORU , INAI SHOYA , OBATA KEIGO , YOSHIMOTO MASAKAZU
IPC: C25D3/60
Abstract: PROBLEM TO BE SOLVED: To effectively prevent the substitute precipitation of silver or copper onto the surface of a tin or tin alloy anode at the time of plating treatment in a lead-free tin-silver based alloy or tin-copper based alloy electroplating bath. SOLUTION: The lead-free tin-silver based alloy or tin-copper based alloy electroplating bath is obtained by adding a nonionic surfactant(s) selected from distyrenated phenol polyalkoxylate whose HLB(Hydrophile-Lypophile Balance) is 7.3 to 15.2, tristyrenated phenol polyalkoxylate whose HLB is 7.0 to 10.4, distyrenated cresol polyalkoxylate whose HLB is 8.2 to 15.0, and a tristyrenated cresol polyalkoxylate whose HLB is 7.7 to 13.9 to a tin-silver based alloy or tin-copper based alloy electroplating bath comprising a stannous salt, a silver or copper salt and various acids. Since the nonionic surfactant(s) with the specified chemical structural species having the prescribed HLB is selectively added, the substitute precipitation of silver or copper onto an anode surface is prevented, and the consumption of silver or copper in the bath is suppressed, thus the composition of the plating bath can be stabilized. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract translation: 要解决的问题：为了有效地防止在无铅锡 - 银基合金或锡 - 铜基合金中电镀处理时锡或铜在锡或锡合金阳极的表面上的替代沉淀 电镀浴
解决方案：通过添加选自其中HLB（亲水亲油平衡平衡）为7.3〜15.2的二苯乙烯化苯酚聚烷氧基化物的非离子表面活性剂，得到无铅锡 - 银基合金或锡 - 铜基合金电镀浴， HLB为7.0〜10.4的三苯乙烯化苯酚聚烷氧基化物，HLB为8.2〜15.0的二苯乙烯化甲醇溶液，HLB为7.7〜13.9的三苯乙烯化甲醇溶液，其含锡亚锡盐或锡 - 铜系合金电镀浴 ，银或铜盐和各种酸。 由于选择性地添加具有规定的HLB的特定化学结构种类的非离子表面活性剂，所以可以防止银或铜在阳极表面上的替代沉淀，并且抑制浴中的银或铜的消耗，因此 镀液的组成可以稳定。 版权所有（C）2006，JPO＆NCIPI
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55.发明专利Reducing agent solution, method of producing metal powder by using the same, and method of forming metal film 有权还原剂溶液，使用该金属粉末的方法生产金属粉末及形成金属膜的方法
公开(公告)号：JP2005042135A
公开(公告)日：2005-02-17
申请号：JP2003200655
申请日：2003-07-23
Applicant: Daiwa Fine Chemicals Co Ltd (Laboratory) , Sumitomo Electric Ind Ltd , 住友電気工業株式会社 , 株式会社大和化成研究所
Inventor： MASHIMA MASATOSHI , SHIMODA KOHEI , KOYAMA KEIJI , OKADA KAZUMASA , OBATA KEIGO , YOSHIMOTO MASAKAZU , NAKAO SEIICHIRO , NAMIKAWA KAZUTOSHI
Abstract: PROBLEM TO BE SOLVED: To provide a reducing agent solution with which metal powder or a metal film capable of exhibiting the satisfactory characteristics of the metal itself to the full can be produced since it does not comprise any halogen, and in which the re-regulation of pH is not needed in the case it is regenerated by electrolytic treatment and is repeatedly used, and to provide methods of forming metal powder and a metallic film using the same.
SOLUTION: The reducing agent solution comprises the ions of transition metal for reducing the ions of metal in a reaction system so as to be precipitated and methansulfonate ions, and is substantially free from halogen. As for the method of producing metal powder, the ions of metal are reduced by the reducing action of the ions of transition metal in a reaction system of a liquid phase including the reducing agent solution so as to be precipitated. As for the method of forming a metal film, in a state where the object to be plated is dipped into a reaction system including the reducing agent solution, the ions of metal are reduced by the reducing action of the ions of transition metal so as to be precipitated over the surface of the object to be plated.
COPYRIGHT: (C)2005,JPO&NCIPIAbstract translation: 待解决的问题：提供一种还原剂溶液，由于它不包含任何卤素，因此可以制备能够充分显示出金属本身的令人满意的特性的金属粉末或金属膜的还原剂溶液，其中 在通过电解处理再生并重复使用时，不需要重新调节pH，并且提供使用其形成金属粉末和金属膜的方法。 解决方案：还原剂溶液包含过渡金属的离子，用于还原反应体系中的金属离子以沉淀和甲磺酸根离子，并且基本上不含卤素。 对于金属粉末的制造方法，通过在包含还原剂溶液的液相的反应体系中的过渡金属的离子的还原作用使金属的离子析出而析出。 对于形成金属膜的方法，在将待镀物体浸入包括还原剂溶液的反应体系的状态下，通过过渡金属的离子的还原作用使金属的离子减少，从而 沉淀在待镀物体的表面上。 版权所有（C）2005，JPO＆NCIPI
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Patent Agency Ranking
公开(公告)号：JP2004327687A
公开(公告)日：2004-11-18
申请号：JP2003119869
申请日：2003-04-24
Applicant: Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
Inventor： OKUHAMA YOSHIAKI , OBATA KEIGO , YOSHIMOTO MASAKAZU , KIN TOUKEN
Abstract: PROBLEM TO BE SOLVED: To provide a low-cost sheeted material for preventing electromagnetic interference which meets the demands of public in the effects of sufficiently shielding electromagnetic waves, in particular, magnetic field waves in a frequency domain of lower than 10MHz, and ensures shielding effects in a comparatively low frequency band attained not only by reflecting but also by absorbing electromagnetic waves. SOLUTION: The sheeted material for preventing electromagnetic interference is provided, in which at least one layer (layer A) of a soft magnetic metal film comprising microcrystal whose particle size is less than 100nm as observed by a transmission microscope, is formed by wet plating. A metal film layer (layer B) of better conductivity than that of the soft magnetic film is formed above or (and) below the layer A by wet plating to obtain a layer structure of two or more layers. COPYRIGHT: (C)2005,JPO&NCIPI
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公开(公告)号：JP2004244719A
公开(公告)日：2004-09-02
申请号：JP2003432338
申请日：2003-12-26
Applicant: Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , Mitsubishi Materials Corp , 三菱マテリアル株式会社 , 株式会社大和化成研究所 , 石原薬品株式会社
Inventor： MASUDA AKIHIRO , OBINATA MASAYOSHI , OBATA KEIGO , YOSHIMOTO MASAKAZU , TSUJI SEIKI , UCHIDA MAMORU , ORI KEIJI , SAKAEGAWA MASAHIRO
Abstract: PROBLEM TO BE SOLVED: To improve the reflow property and film appearance of a tin or tin alloy film. SOLUTION: The aliphatic sulfonic acid plating bath for tin and tin alloy contains (a) a soluble salt composed of a stannous salt and any of the salts of the metals selected from copper, bismuth, silver, indium, zinc, nickel, etc., and (b) aliphatic sulfonic acid composed of alkane sulfonic acid and alkanol sulfonic acid, in which the aliphatic sulfonic acid (b) precludes sulfur compounds as impurities exclusive of the sulfonic acid (a compound having a sulfur atom on the way of oxidation within the molecule and a compound having a sulfur atom and chlorine atom in combination within the molecule) or reduces such compounds down to a slight concentration. Examples of impurities that affect plating characteristics include dimethyl disulfide, methane thiosulfonic acid S-methyl and α-chlorodimethyl sulfone. COPYRIGHT: (C)2004,JPO&NCIPI
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公开(公告)号：JP2020124847A
公开(公告)日：2020-08-20
申请号：JP2019018389
申请日：2019-02-05
Applicant: 日泉化学株式会社 , 株式会社大和化成研究所
Abstract: 【課題】鋳鉄部品に対しても防錆効果を示し、シート製膜時の生産性に優れる多層シートを提供すること。さらに、多層シートを熱成形してなる、鋳鉄部品に対しても防錆効果を示す、トレイを提供すること。 【解決手段】層(I)および層(II)を有する多層シートであって、 該層(I)は、マスターバッチ(A)0.1〜60重量%と、エチレン系樹脂(B)40〜99.9重量%とを含み(ここで、該マスターバッチ(A)と、該エチレン系樹脂(B)の量は、該マスターバッチ(A)と該エチレン系樹脂(B)との合計量に対する量である。)、 該層(II)は、プロピレン系樹脂(C)を含む、 前記多層シートを提供する。ここで、該マスターバッチ(A)は、TG−DTA測定において300℃での重量変化率が0.5〜2.0重量%である防錆剤を含み、 該プロピレン系樹脂(C)の融点は、100〜150℃であり、 該エチレン系樹脂(B)の融点は、該プロピレン系樹脂(C)の融点よりも低いことを特徴とする。 【選択図】なし
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公开(公告)号：JPWO2014020981A1
公开(公告)日：2016-07-21
申请号：JP2014528031
申请日：2013-05-30
Applicant: 株式会社大和化成研究所
Inventor： 洋平 細川 , 洋平 細川 , 朋美 秦 , 朋美 秦 , 尚子 米 , 尚子 米 , 宗史 門川 , 宗史 門川 , 裕二 重国 , 裕二 重国 , 北村 慎悟 , 慎悟 北村 , 吉本 雅一 , 雅一 吉本
IPC: C25D3/46
CPC classification number: C25D3/46 , B32B15/018 , C25D9/02 , C25D11/38 , Y10T428/12896
Abstract: シアン化合物を用いずに、幅広い電流密度範囲において半光沢〜光沢めっき外観が得られる電気銀めっき浴及びそれらを用いためっき方法を提供すること。(A)少なくとも1種の可溶性銀化合物と(B)少なくとも1種の安息香酸誘導体又は該誘導体の塩と(C)少なくとも1種の酸及び/又は錯化剤とを含む水溶液である電気銀めっき液であって、前記安息香酸誘導体が下記の一般式Iで表される該めっき液。(ただし、mは、1、2、3、4、又は5であり、Raは、カルボキシル基であり、Rbは、それぞれ独立して、アルデヒド基、カルボキシル基、アミノ基、水酸基又はスルホン酸基から選択され、Rcは、それぞれ独立して、水素又は任意の置換基であり、Ra、又はRbとベンゼン環との結合間に酸素又はCH2が1以上挿入されてもよい。)
Abstract translation: 不使用氰化物，电镀法半光亮镀层外观使用电镀银浴和其导致宽电流密度范围内提供。 （A）至少一种可溶性银化合物和（B）的苯甲酸衍生物的至少一种盐或衍生物（C），其电镀银是含有至少一种酸和/或配位剂的水溶液 液体，镀覆溶液，其特征在于苯甲酸衍生物由以下式I表示。 （式中，m为1,2，3,4或5，R a是羧基，R b各自独立地，醛基，羧基，氨基，羟基或磺酸基 是选定的，Rc各独立地是氢或任何取代基中，R a，或R b和氧或CH 2苯环之间粘接可以插入1个或多个。）
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