公开(公告)号：US09659846B2

公开(公告)日：2017-05-23

申请号：US15046277

申请日：2016-02-17

Applicant: 3D PLUS

Inventor： Alexandre Val ,  Fabrice Soufflet

IPC: H01L23/495 ,  H01L21/48 ,  H01L25/10 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49575 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/49551 ,  H01L23/49555 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/1064

Abstract: A process for manufacturing at least one 3D electronic module each comprises a stack of electronic packages and/or printed wiring boards, wherein a stack is placed on an electrically interconnecting system comprising metal leads each having two ends. The process comprises the following steps: starting with a lead frame that comprises metal leads, folding by about 180° the leads in order to obtain what is referred to as an internal frame portion including the folded ends, which are intended to be molded, the other portion, which is what is referred to as an external portion, including the unfolded exterior ends, the two ends of each lead being intended to emerge from the 3D module on a given face cut along Z; depositing on the leads a metal coating; placing the external portion of the frame between two, an upper and lower, protective elements while leaving the internal portion free, and placing the frame and the protective elements on a carrier; placing each stack equipped each with exterior interconnection tabs so as to superpose the exterior tabs on the internal portion; molding, in a resin, the stack, the exterior tabs and the internal portion and thereby partially covering the upper protective element; cutting the resin and thereby leaving flush conductive sections of the exterior tabs and of the ends of the leads and removing the resin from the upper protective element; metallizing the cut faces; removing the carrier; and removing the protective elements in order to expose the leads of the external portion.

公开(公告)号：US20170091329A1

公开(公告)日：2017-03-30

申请号：US15374236

申请日：2016-12-09

Applicant: 3D PLUS LIMITED

Inventor： Erwin K.M. Lau ,  Wilson Cho ,  Y.k. Ma

IPC: G06F17/30 ,  G06F3/0484 ,  G06F3/0481 ,  G06T19/20

CPC classification number: G06F16/951 ,  G06F3/04815 ,  G06F3/04842 ,  G06F16/9535 ,  G06F16/954 ,  G06T19/20

Abstract: An existing two-dimensional search engine app (“2D Search App”) is transformed into a search engine that can present three-dimensional results (“3D Search App”), allowing the presentation of 3D sites and objects on a mobile device through a mobile App in communication with a central server. The client is capable of performing 3D rendering in accordance with the instructions received from the server. The client also interacts with the server to send and retrieve other data, including requests, instructions and text, images or video. The server is capable of converting 3D models into instructions which can be sent to the client, thereby allowing the client to reproduce the 3D model in the mobile device for viewing. The invention finds application in a wide range of fields, including fashion, retail outlets, and product demonstration and sales.

公开(公告)号：US20160247750A1

公开(公告)日：2016-08-25

申请号：US15046277

申请日：2016-02-17

Applicant: 3D PLUS

Inventor： Alexandre VAL ,  Fabrice SOUFFLET

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/31 ,  H01L21/48

CPC classification number: H01L23/49575 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/49503 ,  H01L23/49551 ,  H01L23/49555 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/1064

Abstract: A process for manufacturing at least one 3D electronic module each comprises a stack of electronic packages and/or printed wiring boards, wherein a stack is placed on an electrically interconnecting system comprising metal leads each having two ends. The process comprises the following steps: starting with a lead frame that comprises metal leads, folding by about 180° the leads in order to obtain what is referred to as an internal frame portion including the folded ends, which are intended to be moulded, the other portion, which is what is referred to as an external portion, including the unfolded exterior ends, the two ends of each lead being intended to emerge from the 3D module on a given face cut along Z; depositing on the leads a metal coating; placing the external portion of the frame between two, an upper and lower, protective elements while leaving the internal portion free, and placing the frame and the protective elements on a carrier; placing each stack equipped each with exterior interconnection tabs so as to superpose the exterior tabs on the internal portion; moulding, in a resin, the stack, the exterior tabs and the internal portion and thereby partially covering the upper protective element; cutting the resin and thereby leaving flush conductive sections of the exterior tabs and of the ends of the leads and removing the resin from the upper protective element; metallizing the cut faces; removing the carrier; and removing the protective elements in order to expose the leads of the external portion.

Abstract translation: 一种用于制造至少一个3D电子模块的方法各自包括电子封装和/或印刷线路板堆叠，其中堆叠被放置在电连接系统上，该电互连系统包括各自具有两端的金属引线。 该方法包括以下步骤：从包括金属引线的引线框开始，将引线折叠约180°，以获得包括要成型的包括折叠端部的内部框架部分， 其它部分，其被称为外部部分，包括展开的外端，每个引线的两端旨在从沿着Z切割的给定面上的3D模块露出; 在引线上沉积金属涂层; 将框架的外部部分放置在两个上部和下部保护元件之间，同时使内部部分自由，并将框架和保护元件放置在托架上; 将每个堆叠的每个堆叠设置有外部互连突片，以便将外部突出部叠置在内部部分上; 在树脂中成型，堆叠，外部突片和内部部分，从而部分地覆盖上部保护元件; 切割树脂，从而留下外部突片和引线的端部的平齐的导电部分，并从上保护元件移除树脂; 金属化切割面; 移除载体; 并且去除保护元件以暴露外部部分的引线。

公开(公告)号：TWI700792B

公开(公告)日：2020-08-01

申请号：TW105104963

申请日：2016-02-19

Applicant: 法商3D波拉斯公司 ,  3D PLUS

Inventor： 佛 亞歷山卓 ,  VAL, ALEXANDRE ,  索弗利特 菲比斯 ,  SOUFFLET, FABRICE

IPC: H01L23/48

公开(公告)号：TW201837438A

公开(公告)日：2018-10-16

申请号：TW106144556

申请日：2017-12-19

Applicant: 法商3D波拉斯公司 ,  3D PLUS

Inventor： 甘保特 迪迪爾 ,  GAMBART, DIDIER

IPC: G01J1/02 ,  G01J1/42

Abstract: 本發明關於一種意在被固定到成像裝置的3D成像光電模組，其包括： 　　光電感測器(200)，包括具有晶片(201)的封裝(203)，其電連接到 　　至少一個印刷電路板的堆疊， 　　感測器與堆疊組件在樹脂中被模製，且具有根據Z的面，其具有印刷電路板的電氣互連軌跡。 　　3D成像光電模組包括框架(300)形式的導熱剛性托板，其具有根據X、Y的參考表面，以及： 　　○ 在頂表面(302)上： 　　　　　　參考點(317)，意在使成像裝置相對於參考表面置中及對準， 　　　　　　固定點(316)，意在允許成像裝置的固定，以及 　　○ 內軸承表面(301)，具有感測器的軸承點(313)，其被調整以使晶片相對於參考表面被置中及對準。

Abstract in simplified Chinese: 本发明关于一种意在被固定到成像设备的3D成像光电模块，其包括： 　　光电传感器(200)，包括具有芯片(201)的封装(203)，其电连接到 　　至少一个印刷电路板的堆栈， 　　传感器与堆栈组件在树脂中被模制，且具有根据Z的面，其具有印刷电路板的电气互连轨迹。 　　3D成像光电模块包括框架(300)形式的导热刚性托板，其具有根据X、Y的参考表面，以及： 　　○ 在顶表面(302)上： 　　　　　　参考点(317)，意在使成像设备相对于参考表面置中及对准， 　　　　　　固定点(316)，意在允许成像设备的固定，以及 　　○ 内轴承表面(301)，具有传感器的轴承点(313)，其被调整以使芯片相对于参考表面被置中及对准。

公开(公告)号：TWI591758B

公开(公告)日：2017-07-11

申请号：TW101149589

申请日：2012-12-24

Applicant: 3D波拉斯公司 ,  3D PLUS

Inventor： 佛 克里斯汀 ,  VAL, CHRISTIAN

IPC: H01L21/70 ,  H01L21/66 ,  H01L25/065

CPC classification number: H01L22/14 ,  H01L21/561 ,  H01L21/568 ,  H01L23/50 ,  H01L24/24 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/96 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/24011 ,  H01L2224/24105 ,  H01L2224/24137 ,  H01L2224/24141 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/8385 ,  H01L2224/9202 ,  H01L2224/92144 ,  H01L2224/96 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2924/18162 ,  H05K1/185 ,  H05K3/0052 ,  H05K3/007 ,  H05K3/0097 ,  H05K3/225 ,  H05K3/4688 ,  H05K2201/09981 ,  H05K2201/10674 ,  H05K2203/1327 ,  H01L2224/83 ,  H01L2924/00014

公开(公告)号：US20210335755A1

公开(公告)日：2021-10-28

申请号：US17240789

申请日：2021-04-26

Applicant: 3D PLUS

Inventor： Christian VAL

IPC: H01L25/065 ,  H01L23/48 ,  H01L21/768 ,  H01L25/00

Abstract: The field of the invention is that of producing 3D electronic modules, compatible with components operating beyond 1 GHz. The invention relates to a 3D electronic module featuring an interconnection between a horizontal conductor and a vertical conductor to which it is connected exhibits, in a vertical plane, a non-zero curvature. It also relates to the associated production process.

公开(公告)号：US10930178B2

公开(公告)日：2021-02-23

申请号：US16704458

申请日：2019-12-05

Applicant: SOLUTION 3D PLUS INC.

Inventor： Michel Cournoyer

IPC: G09F3/02 ,  F16B1/00

Abstract: A system for sorting hardware pieces having first and second characteristics. The system comprises: a chart displaying first values associated with the first characteristic, each first value associated to a unique first graphical combination comprising a first-characteristic background motif and a first-characteristic indicium overlaid thereon; and second values associated with the second characteristic, each second value associated to a unique second graphical combination comprising a second-characteristic background motif and a second-characteristic indicium overlaid thereon; an identification label indicative of the first and second characteristics and comprising: a first section covered with a first graphical composition comprising the first graphical combination; and a second section covered with a second graphical composition comprising the second graphical combination; and a container affixed with the identification label for containing the hardware piece corresponding to the first and second characteristics.

公开(公告)号：US20160381799A1

公开(公告)日：2016-12-29

申请号：US15190837

申请日：2016-06-23

Applicant: 3D PLUS

Inventor： Christian VAL

IPC: H05K1/18 ,  H05K1/14

CPC classification number: H05K1/18 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5387 ,  H01L23/5389 ,  H01L23/66 ,  H01L24/00 ,  H01L25/105 ,  H05K1/147 ,  H05K1/189

Abstract: A 3D electronic module comprises: two electrically tested electronic packages, each comprising at least one encapsulated chip and output balls on a single face of the package, referred to as the main face; two flexible circuits that are mechanically connected to one another, each being associated with a package, and which are positioned between the two packages, each flexible circuit comprising: on one face, first electrical interconnect pads facing the output balls of the associated package; at its end, a portion that is folded over a lateral face of the associated package; second electrical interconnect pads on the opposite face of this folded portion.

Abstract translation: 3D电子模块包括：两个经电测试的电子封装，每个包括至少一个封装的芯片和在封装的单个面上的输出球，被称为主面; 两个彼此机械连接的柔性电路，每个柔性电路彼此机械连接，每个柔性电路与封装相关联，并且它们位于两个封装之间，每个柔性电路包括：在一个面上，面向相关封装的输出球的第一电互连焊盘; 在其端部处折叠在相关包装的侧面上的部分; 在该折叠部分的相对面上的第二电互连焊盘。

公开(公告)号：US20230130364A1

公开(公告)日：2023-04-27

申请号：US17970478

申请日：2022-10-20

Applicant: 3D PLUS

Inventor： Cédric COLONNA

IPC: H01F27/28 ,  H01F27/29

Abstract: An innovative planar transformer structure, the transformer includes a primary circuit comprising a primary winding of N1 turns; a secondary circuit comprising a secondary winding of N2 turns; a printed circuit board of layers superposed on one another, forming an aperture defining a perimeter; vias disposed at the centre of the primary and secondary windings on the perimeter of the aperture, the N1 and N2 turns being each disposed on a layer, according to any alternation between the N1 and N2 turns, each of the N1 and N2 turns being wound, partially around vias in forming a circular arc per layer; the circular arc of a layer being distinctly oriented with respect to the circular arcs of the other layers.