公开(公告)号：WO2002091057A1

公开(公告)日：2002-11-14

申请号：PCT/US2002/014132

申请日：2002-05-03

Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION

Inventor： SULLIVAN, Jamie ,  GIBSON, John ,  LI, Mingguang ,  VELLA, Eric ,  JOHNSON, Ralph, Thomas

IPC: G02B21/00

CPC classification number: G03F7/70616 ,  G01N21/956 ,  G02B26/10

Abstract: Systems and methods for scanning a beam of light over a specimen are provided. A system may include a pre-scan acousto-optical deflector (AOD) configured to deflect a beam of light (16), a seconds AOD (8) configured as a travelling lens to focus the scanning beam (28), a relay lens (36) and an objective lens (26). The relay lens may be centered on the scan line (30) produced by the second AOD, while the objective lens may be substantially de-centered with respect to the relay lens to produce a telecentric scanning spot with no field tilt. The system may modulate the amplitude of the sound wave in the first AOD to compensate for attenuation in the second AOD. The system may pre-fill one chirp packet (14) in the second AOD while another chirp packet is scanning to substantially reduce a delay between consecutive scans.

Abstract translation: 提供了用于在样本上扫描光束的系统和方法。 系统可以包括被配置为偏转光束（16）的预扫描声光偏转器（AOD），配置为行进透镜的秒AOD（8）以聚焦扫描光束（28），中继透镜 36）和物镜（26）。 中继透镜可以在由第二AOD产生的扫描线（30）上居中，而物镜可以相对于中继透镜基本上为中心，以产生没有场倾斜​​的远心扫描点。 该系统可以调制第一个AOD中的声波的幅度，以补偿第二个AOD中的衰减。 该系统可以预先填充第二个AOD中的一个线性调频组（14），而另一个啁啾分组正在扫描，以显着减少连续扫描之间的延迟。

公开(公告)号：WO2008042903A2

公开(公告)日：2008-04-10

申请号：PCT/US2007/080197

申请日：2007-10-02

Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION ,  RENKEN, Wayne, G. ,  SUN, Mei, H. ,  MASON, Aron, Abramowksi ,  WIESE, Lynn, Karl

Inventor： RENKEN, Wayne, G. ,  SUN, Mei, H. ,  MASON, Aron, Abramowksi ,  WIESE, Lynn, Karl

IPC: B24B37/04

CPC classification number: G01L5/0047 ,  B24B37/04 ,  B24B49/16 ,  G01L1/142 ,  G01L5/008 ,  H01L21/67253

Abstract: At least one pair of capacitively coupled electrodes contained in a structure is used to sense the deflection of a diaphragm in a pressure or force sensor for measuring the pressure or force exerted on the diaphragm. Preferably the structure has properties (such as one or more of the following: dimensions, hardness, area and flexibility) that are substantially the same as those of a real substrate, such as a semiconductor wafer or flat panel display panel. For measuring shear force, at least one shear force sensor is used to measure the shear force on a member, when the member is in contact with and pressed against a polishing or planarization surface and a lateral force is applied between the two surfaces. Preferably the structure and the surface of the structure have properties (such as one or more of the following: dimensions and coefficient of friction) that are substantially the same as those of a real substrate, such as a semiconductor wafer or flat panel display panel.

Abstract translation: 包含在结构中的至少一对电容耦合电极用于感测压力或力传感器中的膜片的偏转，以测量施加在膜片上的压力或力。 优选地，该结构具有与诸如半导体晶片或平板显示面板之类的真实基板的基本相同的性质（例如以下中的一个或多个：尺寸，硬度，面积和柔性）。 为了测量剪切力，当构件接触并压靠抛光或平坦化表面并在两个表面之间施加横向力时，使用至少一个剪切力传感器来测量构件上的剪切力。 优选地，结构和结构的表面具有与真实衬底（诸如半导体晶片或平板显示面板）的结构和表面基本相同的性质（例如以下中的一个或多个：尺寸和摩擦系数）。

公开(公告)号：WO2008003084A2

公开(公告)日：2008-01-03

申请号：PCT/US2007/072515

申请日：2007-06-29

Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION ,  VERMA, Gaurav ,  SU, Bo ,  VOLK, William ,  LEHON, Harold ,  HESS, Carl

Inventor： VERMA, Gaurav ,  SU, Bo ,  VOLK, William ,  LEHON, Harold ,  HESS, Carl

IPC: G06F19/00

CPC classification number: G03F1/84

Abstract: Computer-implemented methods and systems for determining different process windows for a wafer printing process for different reticle designs are provided. One method includes generating simulated images illustrating how each of the different reticle designs will be printed on a wafer at different values of one or more parameters of the wafer printing process. The method also includes detecting defects in each of the different reticle designs using the simulated images. In addition, the method includes determining a process window for the wafer printing process for each of the different reticle designs based on results of the detecting step.

Abstract translation: 提供了用于确定用于不同掩模版设计的晶片印刷工艺的不同工艺窗口的计算机实现的方法和系统。 一种方法包括产生模拟图像，其示出了在晶片印刷过程的一个或多个参数的不同值下每个不同的标线设计将如何印刷在晶片上。 该方法还包括使用模拟图像检测每个不同标线设计中的缺陷。 此外，该方法包括基于检测步骤的结果确定用于每个不同掩模版设计的晶片印刷处理的处理窗口。

公开(公告)号：WO2007120280A2

公开(公告)日：2007-10-25

申请号：PCT/US2006/061113

申请日：2006-11-20

Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION ,  KULKARNI, Ashok ,  DUFFY, Brian ,  MAAYAH, Kais ,  ROUSE, Gordon

Inventor： KULKARNI, Ashok ,  DUFFY, Brian ,  MAAYAH, Kais ,  ROUSE, Gordon

IPC: G06F17/50

CPC classification number: G01N21/9501 ,  G01N2021/8854 ,  G01R31/31718 ,  G06T7/001 ,  G06T2207/30148 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for determining a position of inspection data in design data space includes aligning data acquired by an inspection system for alignment sites on a wafer with data for predetermined alignment sites. The method also includes determining positions of the alignment sites on the wafer in design data space based on positions of the predetermined alignment sites in the design data space. In addition, the method includes determining a position of inspection data acquired for the wafer by the inspection system in the design data space based on the positions of the alignment sites on the wafer in the design data space. In one embodiment, the position of the inspection data is determined with sub-pixel accuracy.

Abstract translation: 提供了与检测数据结合使用设计数据的各种方法和系统。 用于确定设计数据空间中的检查数据的位置的一种计算机实现的方法包括将由晶片上的对准位置的检查系统获取的数据对准用于预定对准位置的数据。 该方法还包括基于设计数据空间中的预定对准位置的位置，在设计数据空间中确定晶片上的对准位置的位置。 此外，该方法包括基于设计数据空间中的晶片上的对准位置的位置来确定由设计数据空间中的检查系统为晶片获取的检查数据的位置。 在一个实施例中，以子像素精度确定检查数据的位置。

公开(公告)号：WO2007120279A2

公开(公告)日：2007-10-25

申请号：PCT/US2006/061112

申请日：2006-11-20

Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION ,  ZAFAR, Khurram ,  KEKARE, Sagar ,  CHANG, Ellis ,  PARK, Allen ,  ROSE, Peter

Inventor： ZAFAR, Khurram ,  KEKARE, Sagar ,  CHANG, Ellis ,  PARK, Allen ,  ROSE, Peter

IPC: G06F17/50

CPC classification number: G01N21/9501 ,  G01N2021/8854 ,  G01R31/31718 ,  G06T7/001 ,  G06T2207/30148 ,  H01L22/12 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Various methods and systems for utilizing design data in combination with inspection data are provided. One computer-implemented method for binning defects detected on a wafer includes comparing portions of design data proximate positions of the defects in design data space. The method also includes determining if the design data in the portions is at least similar based on results of the comparing step. In addition, the method includes binning the defects in groups such that the portions of the design data proximate the positions of the defects in each of the groups are at least similar. The method further includes storing results of the binning step in a storage medium.

Abstract translation: 提供了与检测数据结合使用设计数据的各种方法和系统。 用于对在晶片上检测到的缺陷进行合并的计算机实现的方法包括将设计数据的部分靠近设计数据空间中的缺陷的位置进行比较。 该方法还包括基于比较步骤的结果确定部分中的设计数据是否至少相似。 此外，该方法包括将组中的缺陷合并，使得接近每个组中的缺陷位置的设计数据的部分至少相似。 该方法还包括将合并步骤的结果存储在存储介质中。

公开(公告)号：WO2007079344A2

公开(公告)日：2007-07-12

申请号：PCT/US2006/062100

申请日：2006-12-14

Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION ,  LIN, Jason Z. ,  CHU, Xing ,  WU, Kenong ,  MCCAULEY, Sharon

Inventor： LIN, Jason Z. ,  CHU, Xing ,  WU, Kenong ,  MCCAULEY, Sharon

IPC: G06K9/00

CPC classification number: G06T7/001 ,  G01N21/9501 ,  G01N21/95607 ,  G01N2021/8854 ,  G06T2207/30148

Abstract: Methods and systems for binning defects detected on a specimen are provided. One method includes comparing a test image to reference images. The test image includes an image of one or more patterned features formed on the specimen proximate to a defect detected on the specimen. The reference images include images of one or more patterned features associated with different regions of interest within a device being formed on the specimen. If the one or more patterned features of the test image match the one or more patterned features of one of the reference images, the method includes assigning the defect to a bin corresponding to the region of interest associated with the reference image.

Abstract translation: 提供了在样本上检测到的合并缺陷的方法和系统。 一种方法包括将测试图像与参考图像进行比较。 测试图像包括形成在样本上的接近于在样本上检测到的缺陷的一个或多个图案特征的图像。 参考图像包括在形成在样本上的装置内的与感兴趣的不同区域相关联的一个或多个图案特征的图像。 如果测试图像的一个或多个图案特征与参考图像之一的一个或多个图案特征匹配，则该方法包括将缺陷分配给对应于与参考图像相关联的感兴趣区域的区域。

公开(公告)号：WO2007061704A2

公开(公告)日：2007-05-31

申请号：PCT/US2006/044259

申请日：2006-11-13

Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION ,  ADEL, Michael ,  FROMMER, Aviv

Inventor： ADEL, Michael ,  FROMMER, Aviv

IPC: G01B11/24

CPC classification number: G01N21/956 ,  G01N2021/213 ,  G03F7/70633

Abstract: A method and tool for conducting NIR overlay metrology is disclosed. Such methods involve generating a filtered illumination beam including NIR radiation and directing that illumination beam onto an overlay target to produce an optical signal that is detected and used to generate overlay metrology measurements. The method is particularly suited to substrate applications having layers of opaque material that are transmissive in the NIR range (e.g., amorphous carbon) and where NTR imaging is used to obtain overlay measurements. A tool implementation includes a means for generating a filtered illumination beam extending into the NIR range and a detector for receiving NIR signal from an NIR illuminated target and a computer for processing the signal data to obtain overlay metrology measurements.

Abstract translation: 公开了一种用于进行NIR重叠测量的方法和工具。 这种方法涉及产生包括NIR辐射的滤波照明光束并将该照明光束引导到覆盖目标上以产生被检测并用于产生覆盖度量测量的光信号。 该方法特别适用于具有在NIR范围（例如无定形碳）中透射的不透明材料层的衬底应用，并且其中使用NTR成像来获得覆盖测量。 工具实现包括用于产生延伸到NIR范围内的滤波照明光束的装置和用于从NIR照明目标接收NIR信号的检测器和用于处理信号数据以获得覆盖度量测量的计算机。

公开(公告)号：WO2007019118A2

公开(公告)日：2007-02-15

申请号：PCT/US2006/029807

申请日：2006-08-01

Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION ,  ZYWNO, Marek ,  MANKOS, Marian ,  HESS, Harald ,  LEVI, Shem-Tov

Inventor： ZYWNO, Marek ,  MANKOS, Marian ,  HESS, Harald ,  LEVI, Shem-Tov

IPC: G01N23/00

CPC classification number: H01J37/304 ,  B82Y10/00 ,  B82Y40/00 ,  H01J37/3174 ,  H01J2237/2817 ,  H01J2237/31766

Abstract: Systems, control subsystems, and methods for projecting an electron beam onto a specimen are provided. One system includes a stage configured to move the specimen with a non-uniform velocity. The system also includes a projection subsystem configured to project the electron beam onto the specimen while the stage is moving the specimen at the non-uniform velocity. In addition, the system includes a control subsystem configured to alter one or more characteristics of the electron beam while the projection subsystem is projecting the electron beam onto the specimen based on the non-uniform velocity. One method includes moving the specimen with a non-uniform velocity and projecting the electron beam onto the specimen during movement of the specimen. In addition, the method includes altering one or more characteristics of the electron beam during projection of the electron beam onto the specimen based on the non-uniform velocity.

Abstract translation: 提供了将电子束投射到试样上的系统，控制子系统和方法。 一个系统包括配置成以不均匀的速度移动样本的台。 该系统还包括一个投影子系统，配置成将电子束投射到样本上，同时舞台以不均匀的速度移动样本。 另外，该系统包括控制子系统，该控制子系统被配置为改变电子束的一个或多个特性，同时投影子系统基于非均匀速度将电子束投影到样本上。 一种方法包括以不均匀的速度移动样品并在样品移动期间将电子束投射到样品上。 另外，该方法包括在基于非均匀速度将电子束投影到样本上时改变电子束的一个或多个特性。

公开(公告)号：WO2006127434A2

公开(公告)日：2006-11-30

申请号：PCT/US2006/019381

申请日：2006-05-19

Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION ,  CHUANG, Yung-ho ,  SHAFER, David ,  ARMSTRONG, J., Joseph

Inventor： CHUANG, Yung-ho ,  SHAFER, David ,  ARMSTRONG, J., Joseph

IPC: G02B21/02

CPC classification number: G02B27/0025 ,  G01N21/8806 ,  G02B21/02

Abstract: A system and method for inspection is disclosed. The design generally employs as many as four design principles, including employing at least one lens from a relatively low dispersion glass, at least one additional lens from an additional material different from the relatively low dispersion glass, generally matching the relatively low dispersion properties of the relatively low dispersion glass. The design also may include at least one further lens from a further material different from and exhibiting a significantly different dispersion power from the relatively low dispersion glass and the additional material. Finally, the design may include lenses positioned to insert a significant amount of color within the objective, a gap, and additional lenses, the gap and additional lenses serving to cancel the color inserted.

Abstract translation: 公开了一种用于检查的系统和方法。 该设计通常采用多达四个设计原理，包括使用来自相对低色散玻璃的至少一个透镜，来自不同于相对低色散玻璃的附加材料的至少一个附加透镜，通常匹配相对低色散玻璃的相对低的色散特性 相对低的分散玻璃。 该设计还可以包括来自与相对低的分散玻璃和附加材料不同并表现出显着不同的色散功率的另外材料的至少一个另外的透镜。 最后，设计可以包括定位成在物镜内插入大量颜色的透镜，间隙和附加透镜，间隙和附加透镜用于抵消所插入的颜色。

公开(公告)号：WO2006121843A2

公开(公告)日：2006-11-16

申请号：PCT/US2006/017385

申请日：2006-05-05

Applicant: KLA-TENCOR TECHNOLOGIES CORPORATION ,  VELIDANDLA, Vamsi ,  SOMANCHI, Anoop ,  SOETARMAN, Ronny ,  MEEKS, Steven, W.

Inventor： VELIDANDLA, Vamsi ,  SOMANCHI, Anoop ,  SOETARMAN, Ronny ,  MEEKS, Steven, W.

IPC: G01N21/88

CPC classification number: G01N21/94 ,  G01B11/303 ,  G01B11/306 ,  G01N21/21 ,  G01N21/211 ,  G01N21/55 ,  G01N21/9501 ,  G01N21/9503 ,  G01N2021/556 ,  H01L22/12

Abstract: In one embodiment, a system (110) to inspect an edge region of a wafer (122), comprises a surface analyzer assembly comprising a radiation targeting assembly that targets a radiation beam onto a surface of the wafer (122); a reflected radiation collection assembly to collect radiation reflected from a surface of the wafer (122); means for rotating the surface analyzer assembly about an edge surface (126) of the wafer (122); and means for detecting one or more defects in the edge region of the wafer.

Abstract translation: 在一个实施例中，检查晶片（122）的边缘区域的系统（110）包括表面分析器组件，其包括将辐射束对准在晶片（122）的表面上的辐射瞄准组件; 用于收集从晶片（122）的表面反射的辐射的反射辐射收集组件; 用于使表面分析器组件围绕晶片（122）的边缘表面（126）旋转的装置; 以及用于检测晶片边缘区域中的一个或多个缺陷的装置。