Abstract:
기판 위에 금속층을 증착하고 패터닝하여 n+ 오믹 접촉층을 형성하고, 오믹 접촉층 위에 n+ a-Si 층을 형성한다. 다음, n+ a-Si 층 위에 진성 a-Si 층을 형성하고, 진성 a-Si 층 상부에 B 2 H x + 형태의 이온을 주입하여 진성 a-Si 층 위에 p+ a-Si 층을 형성한다. 다음, p+ a-Si 층 위에 ITO를 증착하고 어닐링하여 p+ 오믹 접촉층을 형성한다. 다음, 기판 위에 질화 규소와 같은 절연 물질로 이루어진 보호막을 형성하고, n+ 오믹 접촉층을 노출시키는 접촉 구멍과 p+ 오믹 접촉층을 노출시키는 접촉 구멍을 형성한다. 다음, 보호막 위에 접촉 구멍을 통해 n+ 오믹 접촉층 및 p+ 오믹 접촉층과 각각 연결되는 데이터 패드와 바이어스 배선을 형성한다. 여기서, p+ a-Si 층을 형성할 때 화학 기상 증착법을 사용하지 않고 이온 주입법을 사용하므로 화학 기상 증착 장비의 오염을 방지하여 유지 보수가 간편해진다. 또한, 이온 주입 시 a-Si 층에 주입되는 이온은 B 2 H x 인데, H 원소도 함께 주입되므로 이후 어닐링 공정에서 a-Si 막 내의 결점을 보완하여 막질이 향상된다. PIN 다이오드, 화학 기상 증착법, 이온 주입
Abstract:
PURPOSE: A pixel circuit and a method for manufacturing the same are provided to achieve improved yield rate by arranging a gate line without increasing the area of the circuit part of the pixel. CONSTITUTION: A pixel circuit comprises a gate electrode shielding film(210) and a gate line shielding film(210a) formed on a transparent substrate(200); a first insulating film(220) for exposing a certain part of the gate line shielding film; a poly silicon pattern(230) formed on the first insulating film disposed on the gate electrode shielding film; a second insulating film(240) formed on the resultant structure including the poly silicon pattern, wherein the second insulating film exposes the part of the gate line shielding film exposed by the first insulating film; a gate electrode(260) formed on the second insulating film; a shielding film contact portion(250a) formed in the region exposed by the first and second insulating films; and a gate line(260a) formed on the shielding film contact portion.
Abstract:
PURPOSE: A contact portion of a semiconductor device and a manufacturing method thereof, and a TFT(Thin Film Transistor) array substrate having the same contact portion for a display apparatus and a manufacturing method of the TFT array panel are provided to be capable of improving the profile of the contact portion by removing an under-cut structure. CONSTITUTION: The first wiring(200) is formed on an upper portion of a substrate(100). A lower layer(310) is formed on the first wiring(200). A photoresist layer pattern(320) is formed on the lower layer(310) by using photosensitive organic material. A contact hole(330) is formed in the lower layer by etching the lower layer using the photoresist layer pattern as an etching mask in order to expose the first wiring. At this time, an under-cut structure is generated under the photoresist layer pattern(320). The edge portion of the lower layer(310) is exposed by partially removing the photoresist layer pattern(320) using an ashing process, so that the under-cut structure is simultaneously removed. The second wiring is formed on the resultant structure and connected with the first wiring(200) through the contact hole(330).
Abstract:
PURPOSE: A thin film transistor substrate using low dielectric constant and a method for manufacturing the same are provided to realize high aperture ratio by solving the problem of parasitic capacity, thereby reducing time required for a process. CONSTITUTION: Gate wiring is formed on an insulating substrate. A gate insulating film(30) is formed on the gate lines. Data wiring crosses the gate wiring on the first insulating film. A plurality of thin film transistors are connected with the gate lines and the data lines. A passivation film(70) composed of an a-Si:C:O film or an a-Si:C:F film which is a low dielectric constant CVD film, is formed on the data wiring, having contact holes(76,78) exposing drain electrodes(66) and data pads(68).
Abstract:
PURPOSE: A TFT(Thin Film Transistor) substrate for an LCD device is provided to form a protection layer with an inorganic insulating layer having a lower dielectric constant, thereby improving an opening ratio even when a data line is overlapped with a pixel electrode. CONSTITUTION: Gate wires include the gate line(21) and the gate electrode(22) formed on a substrate. A gate insulating layer(30) covers the gate wires. A semiconductor layer is formed on the gate insulating layer. A data wire includes a data line(61), a source electrode(62), and a drain electrode(63). A protection layer(70) has the first contact hole showing the drain electrode. A pixel electrode(80) is connected to the drain electrode through the first contact hole. A dielectric ratio of the protection layer is composed of an inorganic insulating layer below 3.5.