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公开(公告)号：KR1020100094828A
公开(公告)日：2010-08-27
申请号：KR1020090013998
申请日：2009-02-19
Applicant: 삼성전자주식회사
IPC: G02F1/1335 , G02F1/1334 , G02F1/13357
CPC classification number: G02F1/133555 , G02F1/133605 , G02F1/133621
Abstract: PURPOSE: A reflection penetration integrated display device for securing outdoor visibility is provided to improve the photonic efficiency about the quantity of the light and secure the outdoor visibility. CONSTITUTION: A light guide plate(130) guides the light coming out from a light source towards a light discharging surface. The light guide plate transmits the external light which is income in the light discharging surface. A color reflection plate(120) prepares in the light discharging surface of the light guide plate. A display panel(200) modulates the light reflected to the color reflector. The display panel forms the image.
Abstract translation: 目的：提供一种用于确保户外可视性的反射穿透集成显示装置，以提高关于光量的光子效率并确保户外可见度。 构成：导光板（130）将从光源出射的光引向排光面。 导光板透射在光放电表面收入的外部光。 彩色反射板（120）准备在导光板的光放出面上。 显示面板（200）对反射到彩色反射体的光进行调制。 显示面板形成图像。
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公开(公告)号：KR1020090014008A
公开(公告)日：2009-02-06
申请号：KR1020070078210
申请日：2007-08-03
Applicant: 삼성전자주식회사
IPC: G02F1/13357 , G02F1/1335
CPC classification number: G02B6/0036 , G02B6/0038 , G02B6/007 , G02B6/0073 , G02F1/167 , G02F2001/133616
Abstract: A front light unit and a flat display device adopted with the front light unit are provided to display an image even without external light by adopting a separate light source, and to be made of an elastic material, thereby realizing a free bending effect. A front light unit(100) comprises as follows. A light source(110) is equipped. A light guide plate(120) guides light emitted from the light source, and has a rear side(122) from which the guided light is emitted and a front side(121) confronting with the rear side. Plural prism shape structures(123) are integratedly disposed on the rear side of the light guide plate, and emit totally reflected light from the front side of the light guide plate. The light guide plate and the prism shape structures are made of transparent and elastic materials.
Abstract translation: 为了通过采用单独的光源即使没有外部光也可以显示图像，并且由弹性材料制成，从而实现自由弯曲效果。 前灯单元（100）包括如下。 配备有光源（110）。 引导板（120）引导从光源发射的光，并且具有从其被发射的引导光的后侧（122）和与后侧相对的前侧（121）。 多个棱镜形状结构（123）整体地设置在导光板的后侧，并从导光板的前侧发射全反射光。 导光板和棱镜形状结构由透明和弹性材料制成。
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公开(公告)号：KR1020050061783A
公开(公告)日：2005-06-23
申请号：KR1020030093209
申请日：2003-12-18
Applicant: 삼성전자주식회사
IPC: H01L21/60
CPC classification number: H01L24/13 , H01L23/13 , H01L24/03 , H01L24/05 , H01L24/16 , H01L24/81 , H01L29/0657 , H01L2224/0401 , H01L2224/05551 , H01L2224/05557 , H01L2224/05559 , H01L2224/05568 , H01L2224/05571 , H01L2224/05578 , H01L2224/05599 , H01L2224/10145 , H01L2224/1147 , H01L2224/13099 , H01L2224/13111 , H01L2224/16 , H01L2224/16237 , H01L2224/16238 , H01L2224/81365 , H01L2224/81385 , H01L2224/81801 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01006 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10157 , H01L2924/15151 , H01L2924/15787 , H01L2924/381 , H05K1/111 , H05K3/3436 , H05K2201/09036 , H05K2201/09045 , H05K2201/10674 , H05K2201/10734 , Y02P70/611 , Y02P70/613 , H01L2224/05552 , H01L2924/00
Abstract: Aflip-chip package for implementing a fine solder ball, and a flip-chip packaging method using the same. The flip-chip package includes a first wafer (100) having a first electrode and a first under bump metal (111,112) (UBM) formed on the first electrode and electrically connected to the first electrode; and second wafer (200) opposing the first wafer and having a second electrode located in a position corresponding to the first electrode, and a second UBM (211,212) formed of the second electrode and electrically connected to the second electrode. The first wafer (100) has a depression formed on one or more areas adjacent to the first UBM (111,112), which depression partly receives a solder ball (133a,134a) that connects the first (111,112) and the second UBMs (211,212) upon flip-chip bonding of the first (100) and second (200) wafers. Since the UBM is formed as an embossing pattern, a fine solder ball can be implemented. Additionally, the reliability of the package can be improved.
Abstract translation: 用于实现精细焊球的微片芯片封装以及使用其的倒装芯片封装方法。 倒装芯片封装包括：第一晶片（100），具有形成在第一电极上并与第一电极电连接的第一电极和第一下凸块金属（111,112）（UBM）; 和与所述第一晶片相对并且具有位于对应于所述第一电极的位置的第二电极的第二晶片（200）和由所述第二电极形成并电连接到所述第二电极的第二UBM（211,212）。 第一晶片（100）具有形成在与第一UBM（111,112）相邻的一个或多个区域上的凹陷部，该凹陷部分地接收连接第一（111,112）和第二UBM（211,212）的焊球（133a，134a） 在第一（100）和第二（200）晶圆的倒装芯片接合时。 由于UBM形成为压花图案，因此可以实现精细的焊球。 此外，可以提高包装的可靠性。
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54.发明公开멀티프로토콜 레이블 스위칭 도메인에서 전송 지연 측정장치 및 방법 无效用于在多媒体标签交换域中测量传输延迟的装置和方法，特别是用于测量在多媒体标签交换域的边界上定位的两个开关路由器之间的两个不同的波段的传输延迟时间
公开(公告)号：KR1020050006442A
公开(公告)日：2005-01-17
申请号：KR1020030046242
申请日：2003-07-09
Applicant: 삼성전자주식회사
Inventor： 송훈
IPC: H04L12/26 , H04L12/723 , H04L12/771
CPC classification number: H04L43/0852 , H04L45/50 , H04L47/196 , H04L49/25
Abstract: PURPOSE: An apparatus and a method for measuring a transmission delay in an MPLS(MultiProtocol Label Switching) domain are provided to measure a transmission delay time with respect to generated/deleted/changed LSP(Label Switched Path) and CR-LSP(Constraint Based-LSP) by using a probe packet. CONSTITUTION: An operator terminal(100) generates a transmission delay measurement request with respect to one specific path of different LSP paths set between two switch routers positioned at a boundary of an MPLS domain, and receives and displays a response to the request on a screen. An MAS(Maintenance and Administration System)(101) receives the transmission delay measurement request, generates a request data unit including information for discriminating the specific path and transmits it to a packet processor(103), and calculates the transmission delay time with respect to the specific path and transmits it to the operator terminal(100) when a response data unit with respect to the request data unit is received. The packet processor(103) converts the data unit received from the MAS(101) into an IP packet and transfers it to a forwarding engine(107-2), and converts an IP packet received from the forwarding engine(107-2) into a data unit of an application part and transfers it to the MAS(101). A label mapping table(108) stores MPLS label values with respect to LSP paths. The forwarding engine(107-2) reads an MPLS label value with respect to one specific path, MPLS-encapsulates the IP packet received from the packet processor(103), and transfers a probe packet to the other switch router. When the forwarding engine(107-2) receives a response packet with respect to the probe packet from the other switch router, it MPLS-decapsulates the response packet and transfers an IP packet to the packet processor(103).
Abstract translation: 目的：提供一种用于测量MPLS（多协议标签交换）域中的传输延迟的装置和方法，用于测量关于生成/删除/改变的LSP（标签交换路径）和CR-LSP（基于约束的）的传输延迟时间 -LSP）。 构成：运营商终端（100）针对位于MPLS域的边界的两个交换路由器之间的不同LSP路径的特定路径生成传输延迟测量请求，并且在屏幕上接收并显示对请求的响应 。 MAS（维护和管理系统）（101）接收传输延迟测量请求，产生包括用于识别特定路径的信息的请求数据单元并将其发送到分组处理器（103），并且计算相对于 当接收到关于请求数据单元的响应数据单元时，该特定路径并将其发送到操作员终端（100）。 分组处理器（103）将从MAS（101）接收的数据单元转换为IP分组，并将其传送到转发引擎（107-2），并将从转发引擎（107-2）接收的IP分组转换为 应用部分的数据单元并将其传送到MAS（101）。 标签映射表（108）存储关于LSP路径的MPLS标签值。 转发引擎（107-2）针对一个特定路径读取MPLS标签值，MPLS封装从分组处理器（103）接收的IP分组，并将探测分组传送到另一个交换机路由器。 当所述转发引擎（107-2）接收到来自所述其他交换机路由器的所述探测分组的响应分组时，对所述响应分组进行MPLS解封装，并向所述分组处理器（103）传送IP分组。
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公开(公告)号：KR100374812B1
公开(公告)日：2003-03-03
申请号：KR1019990048591
申请日：1999-11-04
Applicant: 삼성전자주식회사
IPC: B81B7/00
CPC classification number: G01C19/574
Abstract: 두개의 공진판을 가진 마이크로 자이로스코프에 관해 기술된다. 마이크로 자이로 스코프는: 기판과; 상기 기판 상에 소정 높이로 상호 대향되게 설치되는 제1프레임과 제2프레임과; 상기 기판에 대해 상기 제1프레임과 제2프레임을 지지하는 복수의 앵커부와; 상기 제1, 제2프레임의 사이에 위치하며, 상호 소정거리 이격되어 있는 제1공진판과, 제2공진판; 상기 제1공진판과 제2공진판과 물리적으로 연결되며, 일측의 공진판의 움직임에 의해 타측의 공진판을 구속하되, 일측 공진판의 제1방향의 움직임에 의해 동작되어 타측 공진판을 상기 제1방향의 반대인 제2방향으로 동작시키는 매칭링크수단을; 구비한다. 본 발명의 마이크로 자이로스코프는 매칭링크부에 의한 자기공진매칭구조에 의해 공진판 간의 공진 주파수차를 제거하기 때문에, 공정 오차의 허용범위가 크고 그리고 제작하기 용이하며, 공진구조물의 신뢰성 및 선형성이 높고, 드라이빙 빔과 센싱빔의 분리에 의해 모드커플링을 방지할 수 있고, 따라서 센싱 감도를 높일 수 있다.
Abstract translation: 提供具有两个谐振板的微陀螺仪。 微陀螺仪包括衬底（1）; 设置在所述基板上以具有预定高度的第一和第二框架（11,12），所述第一和第二框架彼此面对; 多个锚定件（3），所述锚定件相对于所述衬底支撑所述第一和第二框架; 设置在所述第一框架和所述第二框架之间的第一谐振板和第二谐振板，所述第一谐振板和所述第二谐振板以预定距离彼此分离; 以及连接到第一和第二谐振板的匹配链接单元（40），使得它将一个谐振板的运动链接到另一个谐振板的运动，使得匹配链接单元通过一个谐振板的运动 然后沿与第一方向相反的第二方向移动另一个谐振板。 在微陀螺仪中，两个谐振板（21,22）的谐振频率之间的差异通过由匹配链路实现的自谐振匹配结构消除，从而允许过程误差的范围较大，并且微陀螺仪可以 很容易制造。 此外，谐振结构的可靠性和线性得到改善。 由于驱动光束（33）和感测光束（7）是分开设计的，所以可以防止模式耦合，从而增加了感测灵敏度。 ＆lt;图像＆GT;
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Patent Agency Ranking
公开(公告)号：KR1020010045332A
公开(公告)日：2001-06-05
申请号：KR1019990048592
申请日：1999-11-04
Applicant: 삼성전자주식회사
IPC: H01L23/58
CPC classification number: B81C1/00293 , G01C19/5769 , G01P1/02 , G01P15/0802
Abstract: PURPOSE: A method for manufacturing a structure of a micro electro-mechanical system(MEMS) capable of wafer-level vacuum packaging is provided to prevent a sensor or actuator from being unstable during an operation by residual stress by using a single crystalline silicon as a structure layer, and to form a resonating structure having a high Q factor by forming a sufficiently thick structure for a heavy structure. CONSTITUTION: A multilayered structure including a signal line is stacked on the first wafer(100). The second wafer(900) is adhered to the stacked multilayered structure. The first wafer is polished by a predetermined thickness. A micro electro-mechanical system(MEMS) structure located inside a vacuum region and a pad(6) located outside the vacuum region are formed on the first wafer, connected to the signal line. A structure corresponding to the vacuum region of the MEMS structure is formed on the third wafer. The polishing surface of the first wafer and the third wafer are connected in vacuum surroundings.
Abstract translation: 目的：提供一种用于制造能够进行晶片级真空包装的微机电系统（MEMS）的结构的方法，以防止传感器或致动器在通过使用单晶硅作为残余应力的操作期间不稳定 并且通过形成足够厚的重结构结构来形成具有高Q因子的谐振结构。 构成：包括信号线的多层结构堆叠在第一晶片（100）上。 第二晶片（900）被粘附到堆叠的多层结构。 第一晶片被抛光预定厚度。 位于真空区域内的微电子机械系统（MEMS）结构和位于真空区域外部的衬垫（6）形成在连接到信号线的第一晶片上。 对应于MEMS结构的真空区域的结构形成在第三晶片上。 第一晶片和第三晶片的抛光表面在真空环境中连接。
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公开(公告)号：KR1020010045331A
公开(公告)日：2001-06-05
申请号：KR1019990048591
申请日：1999-11-04
Applicant: 삼성전자주식회사
IPC: B81B7/00
CPC classification number: G01C19/574
Abstract: PURPOSE: A micro gyroscope having two resonance plates is provided to reduce a difference in resonance frequency between resonance plates, to reduce error, to prevent a mode coupling effect due to interference between excitation mode and detection mode, and to maintain a high stability to thermal stress. CONSTITUTION: A micro gyroscope having two resonance plates includes a substrate(1), first and second frames(11,12) mounted on the substrate oppositely, a plurality of anchor parts(3) supporting the first and second frames, first and second resonance plates(21,22) located between the first and second frames and separated from each other in a prescribed interval, and a matching link part(40). The matching link part is physically connected to the first and second resonance plates, restricts one resonance plate by the movement of the other resonance plate. If one resonance plate moves in a first direction, the matching link part operates the other resonance plate in a second direction opposed to the first direction.
Abstract translation: 目的：提供具有两个共振板的微型陀螺仪，以减少谐振板之间谐振频率的差异，以减少误差，防止由激励模式和检测模式之间的干扰引起的模式耦合效应，并保持高热稳定性 强调。 构成：具有两个共振板的微型陀螺仪包括基板（1），相对地安装在基板上的第一和第二框架（11,12），支撑第一和第二框架的多个锚固部件（3），第一和第二共振 位于第一和第二框架之间并且以规定间隔彼此分离的板（21,22）和匹配连杆部分（40）。 匹配连接部分物理地连接到第一和第二谐振板，通过另一共振板的运动来限制一个共振板。 如果一个共振板沿第一方向移动，则匹配连接部分在与第一方向相反的第二方向上操作另一共振板。
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