Abstract:
본 발명은 신규한 기능성 디아민 및 이를 사용하여 제조된 액정 배향막에 관한 것으로, 보다 상세하게는 상기 기능성 디아민, 방향족 고리형 디아민, 지방족 고리형 산이무수물 및 방향족 고리형 산이무수물을 이용하여 폴리아믹산을 제조하여 고내열성, 가시광선 영역에서의 고투과성, 우수한 배향특성 및 높은 전압보전율을 가지며, 선경사각의 조절이 용이한 액정 배향막을 제공한다. 액정 배향막, 폴리아믹산 폴리이미드, 선경사각, 전압보전율
Abstract:
본 발명은 균질한 점도를 갖는 폴리아믹산의 제조방법이 제공되는 것으로 다이안하이드라이드와 다이아민을 용매존재하에 반응시킴에 있어 건조된 다이안하이드라이드에 함수량이 조절된 용매에 건조된 다이아민을 용해시킨 용액을 조절된 투입시간에 투입반응시키는 것을 특징으로하여 소기한 수준의 점도를 가지면서 균질한 점도를 갖는 폴리아믹산을 제조할수 있는 이점이 있다.
Abstract:
본 발명은 신규한 기능성 디아민 및 이를 사용하여 제조된 액정 배향막에 관한 것으로, 보다 상세하게는 상기 기능성 디아민, 방향족 고리형 디아민, 지방족 고리형 산이무수물 및 방향족 고리형 산이무수물을 이용하여 폴리아믹산을 제조하여 고내열성, 가시광선 영역에서의 고투과성, 우수한 배향특성 및 높은 전압보전율을 가지며, 선경사각의 조절이 용이한 액정 배향막을 제공한다.
Abstract:
PURPOSE: A novel functional diamine compound, a polyamic acid prepared by using the diamine compound, a liquid crystal alignment layer prepared by using the polyamic acid and a liquid crystal display device containing the liquid crystal alignment layer are provided, to improve heat resistance, transmittance at visible light range, alignment characteristic and voltage holding ratio. CONSTITUTION: The diamine compound is represented by the formula 1, wherein A is H or a methyl group; B is -O-, -COO-, -CONH-, -OCO- or a single bond; and C is a linear, branched or cyclic alkyl group of C1-C20, an arylalkyl or alkylaryl group of C7-C30, or a cholesterol group of C16-C40; and the functional group can be substituted with a fluorinated alkyl group of C1-C20. The polyamic acid is prepared by copolymerizing the diamine compound of the formula 1, an aliphatic cyclic acid dianhydride, an aromatic cyclic acid dianhydride and optionally an aromatic cyclic diamine. Preferably the polyamic acid is represented by the formula 6.
Abstract:
PURPOSE: A co-crosslinking compound for a photosensitive polyimide composition and a photosensitive polyimide composition are provided, to improve the crosslinking density of a polyimide composition and to reduce shrinkage after curing. CONSTITUTION: The co-crosslinking compound is represented by the formula I or II, wherein R1 is an aliphatic hydrocarbon group of C2-C20, and n is an integer of 1-20. The photosensitive polyimide composition comprises 100 parts by weight of a polyimide precursor solution; 1-20 parts by weight of the co-crosslinking compound of the formula I or II; and optionally a photoinitiator, an intensifier, a polymerization inhibitor and/or a colloidal inorganic additive.
Abstract:
PURPOSE: An acid liable polyamide polymer and a photosensitive heat resisting insulator composition containing the polymer are provided, which are improved in the photosensitivity, the resolution, the mechanical properties and the flatness of coating. CONSTITUTION: The acid liable polyamide polymer has a repeating unit represented by the formula 1, and contains an acetal or carbonate side group as an acid liable group and a terminal group containing an acetylene group, wherein Ar1 is a tetravalent aromatic group; Ar2 is a divalent aromatic group; R1 and R2 are the same or different each other and are an acid liable group comprising carbonate or acetal; T1 and T2 are the same or different each other and are a terminal group comprising acetylene group; and m and n are an integer of 5-100, respectively. The acid liable polyamide polymer can be a homopolymer or a copolymer according to the combination of Ar1 and Ar2. The photosensitive heat resisting insulator composition comprises the polyamide polymer; and 0.3-15 wt% of a photoacid generator.
Abstract:
PURPOSE: A siloxane polyimide precursor composition and its preparation method are provided, to improve the heat resistance, the mechanical properties and the adhesive strength. CONSTITUTION: The siloxane polyimide precursor composition is prepared by reacting the aliphatic siloxane-based diamine represented by the formula I, the aromatic tetracarboxylic acid dihydrate represented by the formula II and the aromatic diamine represented by H2N-R1-NH2 in an organic solvent, wherein X is an aromatic, alicyclic or aliphatic group having a tetravalent radical, and is selected from the group consisting of butane, pentane, hexane, cyclopentane, bicyclopentane, cyclopropane, methylcyclohexane, benzophenone, benzene, perylene, diphenylsulfone, biphenyl, naphthalene, pyridine, terphenyl, phenoxybenzene, hexafluoro bis(phenoxyphenyl)propane, and bis(phenoxyphenyl)propane.
Abstract:
PURPOSE: Provided is a polyimide resin produced by using new functional diamine monomers, which is used as a liquid crystal alignment film and excellent in photo-permeability and liquid crystal alignment. CONSTITUTION: The polyimide resin is produced by reacting dioxy tetrahydro furan-3-methyl cyclo hexane-1,2-dicarboxylic dianhydride, at least one diamine selected from the diamine group represented by the formula 1, and at least one diamine selected from the diamine group represented by the formula 2 to produce polyamic acid and then imidating the polyamic acid. The polyimide resin has an intrinsic viscosity of 0.5-1.5dL/g(measured at the concentration of 0.5g/dL in NMP solution and 30deg.C), a glass transition temperature of 230-350deg.C, and a stand inclination angle of 1-15 degree. In the formula, X is hydrogen atom or -O2CR, -CO2R, -NRR', -CONRR', -NCOR, -OCO2R, -OR, or -R, n and m are each an integer of 1-16, wherein R and R' are each hydrogen atom, C1-C18 aliphatic or aromatic hydrocarbon.
Abstract:
PURPOSE: A novel polyamide polymer capable of preventing an increase of a dielectric constant by the remaining hydroxyl group and having high heat resistance by transforming a hydroxyl group produced by pyrolysis of acetal or a side chain of its cyclic derivatives by heating a patterned exposed section to a thermally stable benzoxazole group and photosensitive heat resistant insulator composition are provided, which are useful as a layer insulation film of a passivation layer of semiconductors, a buffer coat or composite multilayer PCP. CONSTITUTION: A polyamide polymer having an intrinsic viscosity of 0.1 to 2.5 dL/g contains the formula 1 as a repeating unit and a photosensitive heat resistant insulator composition contains 0.3 to 20% by weight of a photoacid generator based on the polyamide. A concentration of an acid sensitive group (-OR1 or -OR2) is 3 to 70%. The photoacid generator is a material for generating an acid by absorbing light in an area of long wavelength (more than 300nm) as compared to an absorbing area of polyamide