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公开(公告)号：US20140037225A1
公开(公告)日：2014-02-06
申请号：US14029716
申请日：2013-09-17
Applicant: FLIR Systems, Inc.
Inventor： Nicholas Högasten , Malin Ingerhed , Mark Nussmeier , Eric A. Kurth , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp
IPC: G06T5/00
CPC classification number: G06T5/002 , G06T5/50 , G06T2207/10016 , G06T2207/10048 , G06T2207/20182 , H04N5/2253 , H04N5/2254 , H04N5/2257 , H04N5/33 , H04N5/3658
Abstract: Methods and systems are provided to reduce noise in thermal images. In one example, a method includes receiving an image frame comprising a plurality of pixels arranged in a plurality of rows and columns. The pixels comprise thermal image data associated with a scene and noise introduced by an infrared imaging device. The image frame may be processed to determine a plurality of column correction terms, each associated with a corresponding one of the columns and determined based on relative relationships between the pixels of the corresponding column and the pixels of a neighborhood of columns. In another example, the image frame may be processed to determine a plurality of non-uniformity correction terms, each associated with a corresponding one of the pixels and determined based on relative relationships between the corresponding one of the pixels and associated neighborhood pixels within a selected distance.
Abstract translation: 提供了方法和系统来减少热图像中的噪音。 在一个示例中，一种方法包括接收包括以多个行和列排列的多个像素的图像帧。 像素包括与场景相关联的热图像数据和由红外成像装置引入的噪声。 可以处理图像帧以确定多个列校正项，每个列修正项与列中的相应列之一相关联，并且基于相应列的像素和列的邻域的像素之间的相对关系来确定。 在另一示例中，图像帧可以被处理以确定多个不均匀性校正项，每一个都与相应的一个像素相关联，并且基于所选择的像素中的相应一个像素和相关邻域像素之间的相对关系确定 距离。
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公开(公告)号：US20130250125A1
公开(公告)日：2013-09-26
申请号：US13893809
申请日：2013-05-14
Applicant: FLIR Systems, Inc.
Inventor： Stanley H. Garrow , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp , Eric A. Kurth , Malin Ingerhed
IPC: H04N5/33
CPC classification number: H04N5/33 , H04N5/3651 , H04N5/3658
Abstract: Various techniques are provided to capture one or more thermal image frames using an infrared sensor array that is fixably positioned to substantially de-align rows and columns of infrared sensors. In one example, an infrared imaging system includes an infrared sensor array comprising a plurality of infrared sensors arranged in rows and columns and adapted to capture a thermal image frame of a scene exhibiting at least one substantially horizontal or substantially vertical feature. The infrared imaging system also includes a housing. The infrared sensor array is fixably positioned within the housing to substantially de-align the rows and columns from the feature while the thermal image frame is captured.
Abstract translation: 提供了各种技术来捕获使用红外传感器阵列的一个或多个热图像帧，所述红外传感器阵列可固定地定位成基本上对准红外传感器的行和列。 在一个示例中，红外成像系统包括红外传感器阵列，其包括布置成行和列的多个红外传感器，并适于捕获呈现至少一个基本上水平或基本垂直的特征的场景的热图像帧。 红外成像系统还包括壳体。 红外传感器阵列可固定地定位在壳体内，以在捕获热图像帧时从特征基本上对准行和列。
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公开(公告)号：US11070747B2
公开(公告)日：2021-07-20
申请号：US15919116
申请日：2018-03-12
Applicant: FLIR SYSTEMS, INC.
Inventor： Brian Simolon , Eric A. Kurth , Mark Nussmeier , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp
IPC: H04N5/33 , H01L27/146 , H04N5/378 , H04N5/225
Abstract: Various techniques are provided for implementing a segmented focal plane array (FPA) of infrared sensors. In one example, a system includes a segmented FPA. The segmented FPA includes a top die having an array of infrared sensors (e.g., bolometers). The top die may also include a portion of a read-out integrated circuit (ROIC). The segmented FPA also includes a bottom die having at least a portion of the ROIC. The top and the bottom dies are electrically coupled via inter-die connections. Advantageously, the segmented FPA may be fabricated with a higher yield and a smaller footprint compared with conventional FPA architectures. Moreover, the segmented FPA may be fabricated using different semiconductor processes for each die.
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公开(公告)号：US20190141261A1
公开(公告)日：2019-05-09
申请号：US16147381
申请日：2018-09-28
Applicant: FLIR Systems, Inc.
Inventor： Nicholas Högasten , Mark Nussmeier , Eric A. Kurth , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp
IPC: H04N5/33 , H04N5/225 , H01L27/146 , H04N13/243
Abstract: An imager array may be provided as part of an imaging system. The imager array may include a plurality of infrared imaging modules. Each infrared imaging module may include a plurality of infrared sensors associated with an optical element. The infrared imaging modules may be oriented, for example, substantially in a plane facing the same direction and configured to detect images from the same scene. Such images may be processed in accordance with various techniques to provide images of infrared radiation. The infrared imaging modules may include filters or lens coatings to selectively detect desired ranges of infrared radiation. Such arrangements of infrared imaging modules in an imager array may be used to advantageous effect in a variety of different applications.
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公开(公告)号：US10091439B2
公开(公告)日：2018-10-02
申请号：US14137573
申请日：2013-12-20
Applicant: FLIR Systems, Inc.
Inventor： Nicholas Högasten , Mark Nussmeier , Eric A. Kurth , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp
IPC: H04N5/33 , H04N13/243 , H01L27/146 , H04N5/225 , H04N5/365 , H04N5/367 , H04N13/218
Abstract: An imager array may be provided as part of an imaging system. The imager array may include a plurality of infrared imaging modules. Each infrared imaging module may include a plurality of infrared sensors associated with an optical element. The infrared imaging modules may be oriented, for example, substantially in a plane facing the same direction and configured to detect images from the same scene. Such images may be processed in accordance with various techniques to provide images of infrared radiation. The infrared imaging modules may include filters or lens coatings to selectively detect desired ranges of infrared radiation. Such arrangements of infrared imaging modules in an imager array may be used to advantageous effect in a variety of different applications.
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Patent Agency Ranking
公开(公告)号：US09986175B2
公开(公告)日：2018-05-29
申请号：US14747202
申请日：2015-06-23
Applicant: FLIR Systems, Inc.
Inventor： Jeffrey D. Frank , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp , Andrew C. Teich , Dwight Dumpert , Mark Nussmeier , Eric A. Kurth
CPC classification number: H04N5/33 , H04N5/2252 , H04N5/2257 , H04N5/2258 , H04N5/23229 , H04N5/23241 , H04N5/3651
Abstract: Various techniques are disclosed for providing a device attachment configured to releasably attach to and provide infrared imaging functionality to mobile phones or other portable electronic devices. For example, a device attachment may include a housing with a tub on a rear surface thereof shaped to at least partially receive a user device, an infrared sensor assembly disposed within the housing and configured to capture thermal infrared image data, and a processing module communicatively coupled to the infrared sensor assembly and configured to transmit the thermal infrared image data to the user device. Thermal infrared image data may be captured by the infrared sensor assembly and transmitted to the user device by the processing module in response to a request transmitted by an application program or other software/hardware routines running on the user device.
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公开(公告)号：US09961277B2
公开(公告)日：2018-05-01
申请号：US14751437
申请日：2015-06-26
Applicant: FLIR Systems, Inc.
Inventor： Theodore R. Hoelter , Mark Nussmeier , Eric A. Kurth , Nicholas Högasten , Katrin Strandemar , Pierre Boulanger , Barbara Sharp
IPC: H04N5/33 , H04N5/225 , G01J5/04 , H01L27/146 , G01J5/06 , G01J5/08 , G01J5/20 , H04N5/365 , G01J5/02 , G01J5/00
CPC classification number: H04N5/33 , G01J5/025 , G01J5/0265 , G01J5/027 , G01J5/04 , G01J5/061 , G01J5/0881 , G01J5/20 , G01J2005/0077 , G01J2005/202 , H01L27/14618 , H01L27/14683 , H01L2224/48091 , H01L2224/73265 , H04N5/2257 , H04N5/332 , H04N5/3655 , H04N5/3656 , H01L2924/00014
Abstract: In one embodiment, an infrared (IR) sensor module includes an IR sensor assembly, including a substrate, a microbolometer array disposed on an upper surface of the substrate; and a cap disposed on the upper surface of the substrate and hermetically enclosing the microbolometer array. A base is disposed below the substrate, and a heat spreader having a generally planar portion is interposed between a lower surface of the substrate and an upper surface of the base. In some embodiments, the heat spreader can include a material having an anisotropic thermal conductivity, e.g., graphite.
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公开(公告)号：US09843742B2
公开(公告)日：2017-12-12
申请号：US13893809
申请日：2013-05-14
Applicant: FLIR Systems, Inc.
Inventor： Stanley H. Garrow , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp , Eric A. Kurth , Malin Ingerhed
CPC classification number: H04N5/33 , H04N5/3651 , H04N5/3658
Abstract: Various techniques are provided to capture one or more thermal image frames using an infrared sensor array that is fixably positioned to substantially de-align rows and columns of infrared sensors. In one example, an infrared imaging system includes an infrared sensor array comprising a plurality of infrared sensors arranged in rows and columns and adapted to capture a thermal image frame of a scene exhibiting at least one substantially horizontal or substantially vertical feature. The infrared imaging system also includes a housing. The infrared sensor array is fixably positioned within the housing to substantially de-align the rows and columns from the feature while the thermal image frame is captured.
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公开(公告)号：US20170318237A1
公开(公告)日：2017-11-02
申请号：US15645949
申请日：2017-07-10
Applicant: FLIR Systems, Inc.
Inventor： Mark Nussmeier , Eric A. Kurth , Nicholas Högasten , Theodore R. Hoelter , Katrin Strandemar , Pierre Boulanger , Barbara Sharp
CPC classification number: H04N5/33 , H04M1/725 , H04M2250/52 , H04N5/2252 , H04N5/2257 , H04N5/357 , H04N5/378
Abstract: Various techniques are provided for implementing an infrared imaging system. In one example, a system includes a focal plane array (FPA). The FPA includes an array of infrared sensors adapted to image a scene. The FPA also includes a bias circuit adapted to provide a bias voltage to the infrared sensors. The bias voltage is selected from a range of approximately 0.2 volts to approximately 0.7 volts. The FPA also includes a read out integrated circuit (ROIC) adapted to provide signals from the infrared sensors corresponding to captured image frames. Other implementations are also provided.
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公开(公告)号：US09756264B2
公开(公告)日：2017-09-05
申请号：US14750781
申请日：2015-06-25
Applicant: FLIR Systems, Inc.
Inventor： Theodore R. Hoelter , Nicholas Högasten , Malin Ingerhed , Mark Nussmeier , Eric A. Kurth , Katrin Strandemar , Pierre Boulanger , Barbara Sharp
CPC classification number: H04N5/33 , G06T5/002 , G06T5/20 , G06T2207/10048 , H04N5/2254 , H04N5/2257 , H04N5/3651 , H04N5/3658 , H04N5/3675
Abstract: Various techniques are provided to identify anomalous pixels in images captured by imaging devices. In one example, an infrared image frame is received. The infrared image frame is captured by a plurality of infrared sensors based on infrared radiation passed through an optical element. A pixel of the infrared image frame is selected. A plurality of neighborhood pixels of the infrared image frame are selected. Values of the selected pixel and the neighborhood pixels are processed to determine whether the value of the selected pixel exhibits a disparity in relation to the neighborhood pixels that exceeds a maximum disparity associated with a configuration of the optical element and the infrared sensors. The selected pixel is selectively designated as an anomalous pixel based on the processing.
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