公开(公告)号：EP1896841A2

公开(公告)日：2008-03-12

申请号：EP06786076.7

申请日：2006-06-29

Applicant: Intel Corporation

Inventor： MA, Qing ,  WANG, Li-Peng ,  RAO, Valluri

IPC: G01N29/02 ,  G01N33/543 ,  G01N29/036

CPC classification number: G01N29/022 ,  G01N29/036 ,  G01N33/54373 ,  G01N2291/021 ,  G01N2291/0255 ,  G01N2291/0256 ,  G01N2291/0426 ,  G01N2291/106

Abstract: An FBAR device may be chemically functionalized by depositing an interactive layer so that targeted chemicals are preferentially adsorbed. Such miniaturized chemical sensors may be combined with wireless network technology. For example, a chemical sensor may be integrated in a cell phone, PDA, a watch, or a car with wireless connection and GPS. Since such devices are widely populated, a national sensor network may be established. Consequently, a national toxicity map can be generated in real time. Detailed chemical information may be obtained, such as if a chemical is released by a source fixed on ground or by a moving object, or if is spread by explosives or by wind and so on.

公开(公告)号：EP1831957A1

公开(公告)日：2007-09-12

申请号：EP05853644.2

申请日：2005-12-09

Applicant: Intel Corporation

Inventor： MA, Qing ,  LIN, Xintian ,  BETTNER, Allen

IPC: H01Q13/10

CPC classification number: H01Q13/103

Abstract: Briefly, in accordance with one embodiment of the invention, a slot antenna may include a primary slot (210) and one or more secondary slots (212). The size of the antenna may be reduced by adding one or more of the secondary slots which may add additional inductance to the antenna. Furthermore, the size of the antenna may be reduced by increasing the inductance of the secondary slots via increasing the length of the slots or by changing the shape of the slots. The antenna may include one or more MEMS varactors (216) coupled to one or more of the secondary slots. The resonant frequency of the slot antenna may be tuned to a desired frequency by changing the capacitance value of one or more of the MEMS varactors to a desired capacitance value.

公开(公告)号：EP1761456A1

公开(公告)日：2007-03-14

申请号：EP05767695.9

申请日：2005-06-23

Applicant: Intel Corporation

Inventor： HECK, John ,  MA, Qing ,  BAR-SADEH, Eyal

IPC: B81B7/00

CPC classification number: B81C1/0023 ,  Y10S977/701 ,  Y10S977/724

Abstract: An apparatus may include a first substrate, one or more microelectromechanical systems (MEMS) coupled to the first substrate, a second substrate coupled with the first substrate, and one or more passive components coupled to the second substrate. A method may include aligning a first substrate having one or more MEMS coupled thereto and a second substrate having one or more passive components coupled thereto, and coupling the aligned substrates.

公开(公告)号：EP1552610B1

公开(公告)日：2007-01-10

申请号：EP03764688.2

申请日：2003-07-11

Applicant: INTEL CORPORATION

Inventor： MA, Qing ,  SHIM, Dong

IPC: H03H9/02

CPC classification number: H03H9/0542 ,  H03H9/02779 ,  H03H9/6403

Abstract: Microelectromechanical system (MEMS) apparatus and methods for surface acoustic wave (SAW) switching are disclosed. The apparatus includes a piezoelectric substrate having spaced apart input and output SAW transducers. A MEMS switch is arranged between the input and output SAW transducers The MEMS switch has a deformable member in electromagnetic communication with one or more actuation electrodes formed on or above the substrate. The deformable member is deformable to mechanically contact the substrate to deflect or absorb a SAW generated by the input SAW transducer.

公开(公告)号：EP1573762A1

公开(公告)日：2005-09-14

申请号：EP03787237.1

申请日：2003-12-03

Applicant: INTEL CORPORATION

Inventor： ZIPPER, Eliav ,  MA, Qing

IPC: H01H1/00 ,  H01H9/54 ,  H01P1/12

CPC classification number: H01H9/542 ,  H01H1/0036 ,  H01H9/541 ,  H01H59/0009

Abstract: In a switching scheme mechanical MEMs switches are connected in parallel with solid state switches. This parallel MEMs/solid-state switch arrangement takes advantage of the fast switching speeds of the solid state switches as well advantage of the improved insertion loss and isolation characteristics of the MEMs switches. The solid-state switches only need to be energized during a ramp up/down period associated with the slower MEMs switch thus conserving power. As an additional advantage, using a solid-state switch in parallel with MEMs switches improves the transient spectrum of the system during switching operations.

公开(公告)号：EP1529300A1

公开(公告)日：2005-05-11

申请号：EP03751854.5

申请日：2003-08-13

Applicant: Intel Corporation (a Delaware Corporation)

Inventor： MA, Qing

IPC: H01H59/00

CPC classification number: H01H59/0009

Abstract: A microelectromechanical system (MEMS) switch that includes a signal contact (78), an actuation electrode (76) and a beam (80) that engages the signal contact when a voltage is applied to the actuation electrode. The signal contact includes a first portion and a second portion. The actuation electrode is positioned between the first and second portions of the signal contact.

公开(公告)号：EP1354354A2

公开(公告)日：2003-10-22

申请号：EP01992286.3

申请日：2001-11-09

Applicant: INTEL CORPORATION

Inventor： HENAO, Maria, V. ,  MU, Xiao-Chun ,  MA, Qing ,  VU, Quat, T. ,  TOWLE, Steven, N.

IPC: H01L23/433 ,  H01L23/538

CPC classification number: H01L24/20 ,  H01L21/561 ,  H01L23/16 ,  H01L23/3128 ,  H01L23/4334 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/20 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2224/82 ,  H01L2924/00

Abstract: A microelectronic package fabrication technology that attaches at least one microelectronic die onto a heat spreader and encepsulates the microelectronic die/dice thereon which may further include a microelectronic packaging core abutting the heat spreader wherein the microelectronic die/dice reside within at least one opening in a microelectronic package core. After encapsulation, build-up layers may be fabricated to form electrical connections with the microelectronic die/dice.

公开(公告)号：EP1317773A2

公开(公告)日：2003-06-11

申请号：EP01966655.1

申请日：2001-09-07

Applicant: INTEL CORPORATION

Inventor： MA, Qing

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  H01L23/31

CPC classification number: H01L24/97 ,  H01L21/561 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/5389 ,  H01L23/564 ,  H01L24/19 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/13022 ,  H01L2224/16225 ,  H01L2224/20 ,  H01L2224/97 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2224/82 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A packaging technology that fabricates a microelectronic package including build-up layers (118, 124, 136) having conductive traceses (124) on an encapsulated microelectronic die (102) and on other packaging material that surrounds the microelectronic die (112), wherein an moisture barrier structure is simultaneously formed with the conductive traces. An exemplary microelectronic package includes a microelectronic die having an active surface and at least one side. Packaging material(s) (112) is disposed adjacent the microelectronic die side (2), wherein the packaging material (112) includes at least one surface substantially planar to the microelectronic die active surface. A first dielectric material layer (118) may be disposed on at least a portion of the microelectronic die active surface and the encapsulation material surface. At least one conductive (124) trace is then formed on the first dielectric material layer to electrically contact the microelectronic die active surface. A barrier structure proximate an edge of the microelectronic package is formed simultaneously out of the same material as the conductive traces (124).

公开(公告)号：EP1700125B1

公开(公告)日：2012-04-11

申请号：EP04815440.5

申请日：2004-12-24

Applicant: Intel Corporation

Inventor： RAO, Valluri ,  MA, Qing ,  YAMAKAWA, Mineo ,  BERLIN, Andrew ,  WANG, Li-Peng ,  ZHANG, Yuegang

IPC: G01N33/543 ,  G01N29/02

CPC classification number: G01N33/54373 ,  B82Y15/00 ,  B82Y30/00 ,  G01N27/126 ,  G01N29/022 ,  G01N29/036 ,  G01N29/2437 ,  G01N29/348 ,  G01N33/0031 ,  G01N2291/02466 ,  G01N2291/0255 ,  G01N2291/0256 ,  G01N2291/0426 ,  Y10T436/11 ,  Y10T436/143333 ,  Y10T436/144444 ,  Y10T436/25375

Abstract: Systems and methods for detecting the presence of biomolecules in a sample using biosensors that incorporate resonators which have functionalized surfaces for reacting with target biomolecules. In one embodiment, a device includes a piezoelectric resonator having a functionalized surface configured to react with target molecules, thereby changing the mass and/or charge of the resonator which consequently changes the frequency response of the resonator. The resonator’s frequency response after exposure to a sample is compared to a reference, such as the frequency response before exposure to the sample, a stored baseline frequency response or a control resonator’s frequency response.

公开(公告)号：EP1250707B1

公开(公告)日：2010-05-05

申请号：EP01908665.1

申请日：2001-01-22

Applicant: Intel Corporation

Inventor： CHENG, Peng ,  MA, Qing

IPC: H01G5/16

CPC classification number: H01G5/16 ,  Y10T29/435