公开(公告)号：US20080314723A1

公开(公告)日：2008-12-25

申请号：US11767413

申请日：2007-06-22

Applicant: Lianjun Liu

Inventor： Lianjun Liu

IPC: B81B5/00 ,  B81C1/00 ,  H01H11/00 ,  H01H11/04 ,  H01H3/04

CPC classification number: H01H1/0036 ,  B81B2201/016 ,  B81C1/00103 ,  H01H1/06 ,  H01H1/20 ,  H01H11/04 ,  Y10T29/49105 ,  Y10T29/49174

Abstract: A device 20 includes a substrate 22 coupled with a substrate 24 such that a volume 32 is formed between the substrates 22, 24. Contact posts 48, 50 on the substrate 22 and a cantilever beam structure 36 on the substrate 24 are located within the volume 32. The cantilever beam structure has a conductive trace 38 that is selectively contactable with the contact posts 48, 50 to yield a microelectromechanical (MEMS) switch within the volume 32. Fabrication methodology for making the contact posts 48, 50 entails forming post protrusions 68, 70 on the substrate 22 and shaping post protrusions 68, 70 so that they acquire a rounded shape. Input and output signal lines 42, 44 are constructed such that respective portions of input and output signal lines 42, 44 overly corresponding post protrusions 68, 70 and take on the shape of post protrusions 68, 70.

Abstract translation: 器件20包括与衬底24耦合的衬底22，使得在衬底22,24之间形成体积32.衬底22上的接触柱48,50和衬底24上的悬臂梁结构36位于体积 悬臂梁结构具有能够与接触柱48,50选择性地接触的导电迹线38，以在体积32内产生微机电（MEMS）开关。用于制造接触柱48,50的制造方法需要形成后突起68 ，70在基板22上，并且成形柱突起68,70，使得它们获得圆形。 输入和输出信号线42,44被构造成使得输入和输出信号线42,44的相应部分过度对应的柱形突起68,70并且呈立柱形突起68,70的形状。

公开(公告)号：US20080191293A1

公开(公告)日：2008-08-14

申请号：US11673015

申请日：2007-02-09

Applicant: Lianjun Liu ,  Melvy F. Miller

Inventor： Lianjun Liu ,  Melvy F. Miller

IPC: H01L29/84 ,  H01L21/00

CPC classification number: B81C1/00253 ,  H01L28/10 ,  H01L28/60

Abstract: A device 20 includes substrates 22 and 24 coupled to form a volume 32 between the substrates. A surface 28 of the substrate 22 faces a surface 30 of the substrate 24. A metal-insulator-metal capacitor 34 is formed on one of the surfaces 28 and 30. A conductive element 58 spans between a top electrode 56 of the capacitor 34 and the other surface 28 and 30. Vias 64 and 66 extend through the substrate 22 and are electrically interconnected with the conductive element 58 and a bottom electrode 52 of the capacitor 34. Another device 72 includes an underpass transmission line 92 formed on a surface 80 of a substrate 74 within a volume 84 formed between the substrate 74 and another substrate 76. The line 92 underlies an integrated device 96 formed on a surface 78 of the substrate 74.

Abstract translation: 装置20包括联接以在基板之间形成体积32的基板22和24。 基板22的表面28面向基板24的表面30。 金属 - 绝缘体 - 金属电容器34形成在一个表面28和30上。 导电元件58跨越电容器34的顶部电极56和另一个表面28和30之间。 通孔64和66延伸穿过基板22并与导电元件58和电容器34的底部电极52电互连。 另一装置72包括形成在基板74的表面80之间的地下通道传输线92，该基底74形成在基板74和另一基板76之间的体积84内。 管线92位于形成在基板74的表面78上的集成装置96的下面。

公开(公告)号：US20080119214A1

公开(公告)日：2008-05-22

申请号：US11600351

申请日：2006-11-16

Applicant: Lianjun Liu ,  Ricardo A. Uscola

Inventor： Lianjun Liu ,  Ricardo A. Uscola

IPC: H04B7/00 ,  H03H7/38

CPC classification number: H04B1/0458 ,  H03F1/02 ,  H03F3/24 ,  H03F3/72 ,  H03F2203/7239 ,  H03H7/38 ,  H04B2001/045

Abstract: A power amplifier (PA) line-up (210) and a method (500) for more efficiently utilizing battery power are disclosed. PA line-up (210) includes a driver (220), a matching circuit (214), and a PA (230) coupled to a matching circuit (216), wherein matching circuit (216) is configured to be coupled to a filter (260). PA line-up (210) includes a transmission line (260) coupled to matching circuit (216) and a switch (262) configured to selectively couple driver (220) to either matching circuit (214) or matching circuit (216) such that signal (205) is capable of by-passing PA (230) when signal (205) does not need to be amplified by PA (230). Furthermore, PA line-up (210) may include a second transmission line (250) so that signal (205) is capable of by-passing a driver (220) and a PA (230) when signal (205) does not need to be amplified by driver (220) and PA (230).

Abstract translation: 公开了一种用于更有效地利用电池电力的功率放大器（PA）阵容（210）和方法（500）。 PA阵列（210）包括驱动器（220），匹配电路（214）和耦合到匹配电路（216）的PA（230），其中匹配电路（216）被配置为耦合到滤波器 （260）。 PA阵列（210）包括耦合到匹配电路（216）的传输线（260）和配置成将驱动器（220）选择性地耦合到匹配电路（214）或匹配电路（216）的开关（262），使得 当信号（205）不需要被PA放大（230）时，信号（205）能够旁路PA（230）。 此外，PA阵列（210）可以包括第二传输线（250），使得当信号（205）不需要时，信号（205）能够旁路驱动器（220）和PA（230） 由驱动器（220）和PA（230）放大。

公开(公告)号：US20080102762A1

公开(公告)日：2008-05-01

申请号：US11590277

申请日：2006-10-30

Applicant: Lianjun Liu ,  James R. Griffiths

Inventor： Lianjun Liu ,  James R. Griffiths

IPC: H04B1/44

CPC classification number: H04B1/48 ,  H04B1/006

Abstract: A hybrid antenna switching system in a communications device generally includes an antenna, a first switching device, and a second switching device. The first switching device is configured to selectively couple the antenna to a first set of communication paths within the communications device, wherein the first set of communication paths includes at least one transmit path associated with a first type of wireless communication standard (e.g., a global system for communication (GSM) standard). The second switching device is configured to selectively couple the antenna to a second set of communication paths within the communications device, wherein the second set of communication paths includes at least one reception path associated with the first type of wireless communication standard. The second switching device is a micro-electromechanic system (MEMS) switch integrated with the first switching device on, for example, a common printed circuit board (PCB) or multi-chip module (MCM) substrate.

Abstract translation: 通信设备中的混合天线切换系统通常包括天线，第一交换设备和第二交换设备。 第一交换设备被配置为选择性地将天线耦合到通信设备内的第一组通信路径，其中第一组通信路径包括与第一类型的无线通信标准相关联的至少一个发送路径（例如，全局 通信系统（GSM）标准）。 第二交换设备被配置为选择性地将天线耦合到通信设备内的第二组通信路径，其中第二组通信路径包括与第一类型的无线通信标准相关联的至少一个接收路径。 第二开关装置是与第一开关装置集成在例如普通印刷电路板（PCB）或多芯片模块（MCM））基板上的微机电系统（MEMS）开关。

公开(公告)号：US20080036035A1

公开(公告)日：2008-02-14

申请号：US11830577

申请日：2007-07-30

Applicant: Lianjun Liu ,  Qiang Li ,  Melvy Miller ,  Sergio Pacheco

Inventor： Lianjun Liu ,  Qiang Li ,  Melvy Miller ,  Sergio Pacheco

IPC: H01L29/00

CPC classification number: H01L25/16 ,  H01L23/642 ,  H01L23/645 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/18 ,  H01L28/10 ,  H01L28/40 ,  H01L2223/6655 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48195 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H03H7/38 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: An impedance matching network is integrated on a first die and coupled to a second die, with the first and second dies mounted on a conductive back plate. The impedance matching network comprises a first inductor bridging between the first and second dies, a second inductor coupled to the first inductor and disposed on the first die, and a metal-insulator-metal (MIM) capacitor disposed on the first die. The MIM capacitor has a first metal layer coupled to the second inductor, and a second metal layer grounded to the conductive back plate. A method for manufacturing the integrated impedance matching network comprises the steps of forming an inductor on a die, forming a capacitor on the die, coupling the capacitor to the inductor, coupling the die bottom surface and the capacitor to a conductive plate, and coupling the inductor to another inductor that bridges between the die and another die.

Abstract translation: 阻抗匹配网络集成在第一裸片上并耦合到第二裸片，第一和第二裸片安装在导电背板上。 阻抗匹配网络包括桥接在第一和第二管芯之间的第一电感器，耦合到第一电感器并且设置在第一管芯上的第二电感器和设置在第一管芯上的金属 - 绝缘体 - 金属（MIM）电容器。 MIM电容器具有耦合到第二电感器的第一金属层和接地到导电背板的第二金属层。 一种用于制造集成阻抗匹配网络的方法包括以下步骤：在管芯上形成电感器，在管芯上形成电容器，将电容器耦合到电感器，将管芯底表面和电容器耦合到导电板上， 电感器到另一个电感器，其在管芯和另一个管芯之间桥接。

公开(公告)号：US07305223B2

公开(公告)日：2007-12-04

申请号：US11021843

申请日：2004-12-23

Applicant: Lianjun Liu ,  Jonathan K. Abrokwah ,  Marcus R. Ray

Inventor： Lianjun Liu ,  Jonathan K. Abrokwah ,  Marcus R. Ray

IPC: H04B1/28

CPC classification number: H01L23/5227 ,  H01L23/66 ,  H01L27/016 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H01P5/185 ,  H01L2924/00

Abstract: A radio frequency (“RF”) circuit configured in accordance with an embodiment of the invention is fabricated on a substrate using integrated passive device (“IPD”) process technology. The RF circuit includes at least one RF signal line section and an integrated RF coupler located proximate to the RF signal line section. The integrated RF coupler, its output and grounding contact pads, and its matching network are fabricated on the same substrate using the same IPD process technology. The integrated RF coupler provides efficient and reproducible RF coupling without increasing the die footprint of the RF circuit.

Abstract translation: 根据本发明的实施例构造的射频（“RF”）电路使用集成无源器件（“IPD”）处理技术在基板上制造。 RF电路包括至少一个RF信号线部分和位于RF信号线部分附近的集成RF耦合器。 使用相同的IPD工艺技术，在同一基板上制造集成RF耦合器，其输出和接地接触焊盘及其匹配网络。 集成RF耦合器提供高效和可重复的射频耦合，而不增加射频电路的裸片占空比。

公开(公告)号：US20070236307A1

公开(公告)日：2007-10-11

申请号：US11401797

申请日：2006-04-10

Applicant: Lianjun Liu

Inventor： Lianjun Liu

IPC: H01P1/10

CPC classification number: H01P1/127 ,  H01H1/0036 ,  H01H59/0009

Abstract: A micro-electro mechanical system (NEMS) device, such as a MEMS switch (100), includes a package seal (104) bonded to a substrate (102), wherein an electrode 106 (e.g., an actuation electrode associated with a switch) is provided on an inner surface (103) of the package seal (104). The MEMS switch (100) might include, for example, a central switch structure implementing a double-pole, single-throw switch using a push-pull arrangement of internal activation electrodes (106, 108). The central switch structure might include a cantilevered moveable actuation electrode (122) or an electrode supported in two or more peripheral regions.

Abstract translation: 诸如MEMS开关（100）的微机电系统（NEMS）装置包括结合到基板（102）的封装密封件（104），其中电极106（例如与开关相关联的致动电极） 设置在包装密封件（104）的内表面（103）上。 MEMS开关（100）可以包括例如使用内部激活电极（106,108）的推挽布置来实现双极单掷开关的中央开关结构。 中心开关结构可以包括悬臂可移动致动电极（122）或支撑在两个或更多个周边区域中的电极。

公开(公告)号：US07141989B1

公开(公告)日：2006-11-28

申请号：US11401592

申请日：2006-04-10

Applicant: Lianjun Liu

Inventor： Lianjun Liu

IPC: G01R27/26 ,  H01L21/20 ,  B01B7/02

CPC classification number: H01G5/18 ,  H01G5/014 ,  H01G5/16 ,  H01G5/38

Abstract: A micro-electro mechanical system (MEMS) variable capacitor (varactor) generally includes a substrate (102), a first capacitive plate (112) formed on the substrate, a flexible structure (150) coupled to the substrate, a second capacitive plate (116) and a first electrode (122) formed on the flexible structure; a package seal (104) coupled to the substrate and having a second electrode (106) formed thereon, wherein the distance between the first capacitive plate and the second capacitive plate (and hence, the capacitance of the structure) is responsive to a bias voltage applied to the electrodes.

Abstract translation: 微机电系统（MEMS）可变电容器（变容二极管）通常包括衬底（102），形成在衬底上的第一电容板（112），耦合到衬底的柔性结构（150），第二电容板 116）和形成在柔性结构上的第一电极（122） 封装密​​封件（104），其耦合到所述基板并且具有形成在其上的第二电极（106），其中所述第一电容板和所述第二电容板之间的距离（并且因此所述结构的电容）响应偏置电压 施加到电极。

公开(公告)号：US20170341926A9

公开(公告)日：2017-11-30

申请号：US14537498

申请日：2014-11-10

Applicant: Chad S Dawson ,  Dubravka Bilic ,  Lianjun Liu ,  Andrew C McNeil

Inventor： Chad S Dawson ,  Dubravka Bilic ,  Lianjun Liu ,  Andrew C McNeil

IPC: B81B3/00 ,  G01L9/00

CPC classification number: B81B3/007 ,  B81B2201/0264 ,  B81B2203/0127 ,  G01L9/0072

Abstract: Methods for fabricating crack resistant Microelectromechanical (MEMS) devices are provided, as are MEMS devices produced pursuant to such methods. In one embodiment, the method includes forming a sacrificial body over a substrate, producing a multi-layer membrane structure on the substrate, and removing at least a portion of the sacrificial body to form an inner cavity within the multi-layer membrane structure. The multi-layer membrane structure is produced by first forming a base membrane layer over and around the sacrificial body such that the base membrane layer has a non-planar upper surface. A predetermined thickness of the base membrane layer is then removed to impart the base membrane layer with a planar upper surface. A cap membrane layer is formed over the planar upper surface of the base membrane layer. The cap membrane layer is composed of a material having a substantially parallel grain orientation.

公开(公告)号：US09448251B2

公开(公告)日：2016-09-20

申请号：US14004595

申请日：2012-02-23

Applicant: Lianjun Liu

Inventor： Lianjun Liu

IPC: G01P15/125 ,  G01P15/02 ,  G01P15/08 ,  B81B7/02 ,  H01L29/84 ,  G01C19/574 ,  G01C19/5769

CPC classification number: G01P15/02 ,  B81B7/02 ,  B81B2201/025 ,  B81B2201/0264 ,  G01C19/574 ,  G01C19/5769 ,  G01P15/0802 ,  G01P15/125 ,  H01L29/84

Abstract: An integrated inertial sensor and pressure sensor may include a first substrate including a first surface and a second surface; at least one or more conductive layers, formed on the first surface of the first substrate; a movable sensitive element, formed by using a first region of the first substrate; a second substrate and a third substrate, the second substrate being coupled to a surface of the conductive layer, the third substrate being coupled to the second surface of the first substrate in which the movable sensitive element of the inertial sensor is formed, and the third substrate and the second substrate are respectively arranged on opposite sides of the movable sensitive element; and a sensitive film of the pressure sensor, including at least a second region of the first substrate, or including at least one of the conductive layers on the second region of the first substrate.

Abstract translation: 集成的惯性传感器和压力传感器可以包括包括第一表面和第二表面的第一基底; 形成在所述第一基板的所述第一表面上的至少一个或多个导电层; 通过使用第一衬底的第一区域形成的可移动敏感元件; 第二基板和第三基板，所述第二基板耦合到所述导电层的表面，所述第三基板耦合到所述第一基板的形成所述惯性传感器的可移动敏感元件的第二表面，并且所述第三基板 基板和第二基板分别布置在可移动敏感元件的相对侧上; 以及压力传感器的敏感膜，包括第一衬底的至少第二区域，或者在第一衬底的第二区域上包括至少一个导电层。