THERMOSETTING-RESIN-FORMING COMPOSITIONS

    公开(公告)号:CA2003664A1

    公开(公告)日:1990-05-28

    申请号:CA2003664

    申请日:1989-11-23

    Abstract: This invention provides thermosetting-resin-forming compositions which are formed of (a) a bismaleimide compound represented by the following formula: wherein R represents a divalent group of or , X being a direct bond or a group selected from the group consisting of divalent hydrocarbon groups having 1-10 carbon atoms, hexa-fluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxo, and (b) a specific diallylbisphenol compound. These compositions can provide thermosetting resins having high cracking resistance due to improved impact resistance and toughness and low water absorption.

    POLYIMIDE RESIN COMPOSITION
    54.
    发明专利

    公开(公告)号:AU589785B2

    公开(公告)日:1989-10-19

    申请号:AU7497187

    申请日:1987-06-30

    Abstract: This invention is a polyimide resin composition containing 100 parts by weight of polyimide having recurring units of the following formula : (where Y is a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, thio radical, sulfinyl radical, sulfonyl radical or oxide, and R is a tetra-valent radical of aliphatic radical having at least 2 carbons, alicyclic radical, monoaromatic radical, condensed polyaromatic radical, or non-condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function) and from 5 to 100 parts by weight of fluororesin. The resin composition can provide molded products which are excellent in high-temperature stability, dimensional stability and mechanical strength and moreover have a low friction coefficient and good wear resistance. Therefore, the composition is useful as the material for electric and electronic devices, precision instrument parts etc. Polyimide of this invention can be prepared from aromatic diamines and tetracarboxylic acid dianhydrides. Suitable aromatic diamines are 4,4'-bis(3-aminophenoxy)biphenyl, 2,2-bis[4-(3-aminophenoxy)phenyl]propane, bis[4-(3-aminophenoxy)phenyl] sulfide etc. Suitable tetracarboxylic acid dianhydrides are pyromellitic dianhydride and 3,3', 4,4'-benzophenonetetracarboxylic dianhydride. Representative fluororesin which can be used in this invention is polytetrafluoroethylene.

    POLYIMIDE RESIN COMPOSITION
    56.
    发明专利

    公开(公告)号:AU7235687A

    公开(公告)日:1987-11-09

    申请号:AU7235687

    申请日:1987-04-08

    Abstract: New polyimide resin compsn. is composed of 100 pts. by wt. of a polyimide having repeat units represented by general formula (I) and 5 to 100 pts. by wt. of fibrous reinforcing material, where Y represents a direct bond, a divalent 1-10C hydrocarbyl gp., a hexafluoroisopropylidene gp., a carbonyl gp., or a oxido gp. R represents a tetravalent 2 or more C aliphatic gp., an alicyclic gp., a monocyclic aromatic gp., a fused polycyclic aromatic gp., or a non-fused cyclic aromatic gp. in which aromatic gps. are linked direct to each other or via a linking member. The polyimide can have an isopropylidene gp. for Y in general formula (1), it can have a direct bond for Y and (II) for R, it can have an isopropylidene gp. for Y and (III) for R, etc. The fibrous reinforcing material can be glass fibres, carbon fibres, potassium titanate fibres or aromatic polyamide fibres.

    POLYIMIDE RESIN COMPOSITION.
    57.
    发明公开
    POLYIMIDE RESIN COMPOSITION. 失效
    的聚酰亚胺树脂的制备。

    公开(公告)号:EP0267289A4

    公开(公告)日:1988-07-25

    申请号:EP87902709

    申请日:1987-04-08

    CPC classification number: H01B3/306 C08K7/02 C08L79/08

    Abstract: A polyimide resin composition, which comprises 100 parts by weight of a polyimide having repeating units represented by general formula (I), (wherein Y represents a direct bond, a divalent hydrocarbyl group having 1 to 10 carbon atoms, a hexafluoroisopropylidene group, a carbonyl group, a thio group, a sulfinyl group, a sulfonyl group or an oxido group, and R represents a tetravalent aliphatic group having 2 or more carbon atoms, alicyclic group, monocylic aromatic group, fused polycyclic aromatic group or non-fused cyclic aromatic group wherein aromatic groups are linked to each other directly or via a linking member) and 5 to 100 parts by weight of fibrous reinforcing material such as glass fibers, carbon fibers, potassium titanate fibers, aromatic polymide fibers, etc. This resin composition has excellent heat resistance, dimensional stability, and mechanical strength and is a useful material for manufacturing electric or electronic components, precision machine parts, etc. The polyimide to be used can be prepared from an aromatic ether diamine and a tetracarboxylic acid dianhydride, using 4,4'-bis(3-aminophenoxy)biphenyl, 2,2'-bis(4-(3-aminophenoxy)phenyl)propane, bis(4-(3-aminophenoxy)phenyl) sulfide, etc. as the ether diamine and pyromellitic dianhydride, 3,3',4,4'-benzophenonetetracarboxylic acid dianhydride, etc. as the tetracarboxylic acid dianhydride.

    THERMOSETTING POLYMER COMPOSITION
    58.
    发明专利

    公开(公告)号:JPS6426668A

    公开(公告)日:1989-01-27

    申请号:JP9016888

    申请日:1988-04-14

    Abstract: PURPOSE:To obtain the titled composition, having excellent impact resistance and toughness without deteriorating heat resistance, by blending a polyaminobismaleimide polymer consisting of a specific bismaleimide compound and diamine compound with a specific amount of a fibrous reinforcing agent. CONSTITUTION:A thermoplastic polymer composition obtained by blending (A) 100pts.wt. polyaminobismaleimide polymer consisting of (A1) 1mol. bismaleimide compound expressed by formula I [R is formula II or III (X is direct bond, 1-10C bifunctional hydrocarbon, etc.) [e.g. 1,3-bis(3- maleimidophenoxy)benzene] and (A2) 0.1-1.2mol. diamine compound expressed by formula IV [e.g. 1,3-bis(3-aminophenoxy)benzene] with (B) 10-400pts.wt., preferably 20-350pts.wt. fibrous reinforcing agent (e.g. glass fiber, carbon fiber or potassium titanate fiber).

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