公开(公告)号：US10903392B2

公开(公告)日：2021-01-26

申请号：US16090635

申请日：2017-04-06

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Jürgen Moosburger ,  Matthias Sabathil ,  Frank Singer

IPC: H01L33/02 ,  H01L27/15 ,  H01L21/66 ,  H01L33/00 ,  H01L33/38 ,  H01L33/50

Abstract: A method of producing optoelectronic semiconductor components, the method includes: a) providing a composite comprising a semiconductor layer sequence including an active region that generates or receives radiation; b) determining a position of at least one defect region of the semiconductor layer sequence; c) forming a plurality of electrically contactable functional regions that each include a part of the semiconductor layer sequence and are free of a defect region; and d) separating the composite into a plurality of optoelectronic semiconductor components that each include at least one of the functional regions.

公开(公告)号：US20190189874A1

公开(公告)日：2019-06-20

申请号：US16228588

申请日：2018-12-20

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Florian Bösl ,  Matthias Sabathil

IPC: H01L33/60 ,  H01L33/50 ,  H01L33/54

Abstract: A device with semiconductor chips on a primary carrier is disclosed. In an embodiment a device includes a primary carrier, a plurality of semiconductor chips arranged on the primary carrier, a radiation conversion material arranged at least in places on the semiconductor chips and the primary carrier, a secondary carrier to which the primary carrier is attached and a scattering body arranged on a front side of the secondary carrier facing the primary carrier, the scattering body covering the semiconductor chips, wherein the primary carrier is formed reflective to primary radiation at least in a region of the semiconductor chips, and wherein, during operation of the device, at least secondary radiation exits through a front side of the scattering body facing away from the secondary carrier and through a rear side of the secondary carrier facing away from the primary carrier.

公开(公告)号：US20190189598A1

公开(公告)日：2019-06-20

申请号：US16322069

申请日：2017-08-01

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Frank Singer ,  Jürgen Moosburger ,  Thomas Schwarz ,  Lutz Hoeppel ,  Matthias Sabathil

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/56 ,  H01L33/58

CPC classification number: H01L25/0753 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2933/0066

Abstract: A multi-chip module is disclosed. In an embodiment, a multi-chip module includes a first carrier including a mold material and at least two light-emitting diode chips embedded at least by side faces in the first carrier, wherein the light-emitting diode chips have first electrical contacts on a front side and second electrical contacts on a rear side, wherein the front side is configured as a radiation side, wherein the first electrical contacts are connected to control lines, wherein the control lines are arranged on a front side of the first carrier, wherein the second electrical contacts are connected to a collective line, and wherein the collective line is led to a rear side of the first carrier.

公开(公告)号：US10217910B2

公开(公告)日：2019-02-26

申请号：US15944328

申请日：2018-04-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias Sabathil ,  Alexander Linkov ,  Britta Göötz ,  Georg Dirscherl

IPC: H01L33/50 ,  H01L33/56 ,  H01L33/54 ,  H01L33/00 ,  H01L31/14 ,  H01L33/44 ,  H01L25/16 ,  H01L25/00 ,  H01L31/173

Abstract: A method of producing a light-emitting arrangement includes providing a carrier including a top side, attaching a multitude of first conversion elements on the top side of the carrier, wherein the first conversion elements are arranged in a lateral direction spaced apart from one another, attaching an encapsulation on the top side of the carrier, wherein the encapsulation covers the carrier and the first conversion elements at least sectionally, removing the encapsulation in regions between the first conversion elements, and attaching optoelectronic semiconductor chips between the first conversion elements.

公开(公告)号：US10074769B2

公开(公告)日：2018-09-11

申请号：US14767634

申请日：2014-02-06

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Hans-Jürgen Lugauer ,  Jürgen Moosburger ,  Stefan Illek ,  Tansen Varghese ,  Matthias Sabathil

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/48 ,  H01L33/60

CPC classification number: H01L33/0095 ,  H01L33/483 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/04105 ,  H01L2224/96 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2924/00

Abstract: A method of producing an optoelectronic component includes providing a carrier having a carrier surface, a first lateral section of the carrier surface being raised relative to a second lateral section of the carrier surface; arranging an optoelectronic semiconductor chip having a first surface and a second surface on the carrier surface, wherein the first surface faces toward the carrier surface; and forming a molded body having an upper side facing toward the carrier surface and a lower side opposite the upper side, the semiconductor chip being at least partially embedded in the molded body.

公开(公告)号：US20180101016A1

公开(公告)日：2018-04-12

申请号：US15693531

申请日：2017-09-01

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Roland Enzmann ,  Hubert Halbritter ,  Markus Arzberger ,  Andreas Ploessl ,  Roland Schulz ,  Georg Rossbach ,  Bernd Boehm ,  Frank Singer ,  Matthias Sabathil

IPC: G02B27/09 ,  G02B5/18 ,  G02B3/00

CPC classification number: G02B27/0916 ,  G02B3/0025 ,  G02B3/0068 ,  G02B3/0075 ,  G02B5/1814 ,  G02B5/1823 ,  G02B5/1857 ,  G02B5/1866 ,  G02B27/0944 ,  G02B27/0961 ,  G02B27/4272

Abstract: An optically effective element includes a carrier, a first optically effective structure arranged on a top side of the carrier, and a cover arranged above the first optically effective structure. A method of producing an optically effective element includes providing a carrier, forming a first optically effective structure on a top side of the carrier, and arranging a cover above the top side of the carrier and the first optically effective structure.

公开(公告)号：US09911719B2

公开(公告)日：2018-03-06

申请号：US15310428

申请日：2015-03-31

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Frank Singer ,  Juergen Moosburger ,  Georg Bogner ,  Herbert Brunner ,  Matthias Sabathil ,  Norwin Von Malm

IPC: H01L25/075 ,  H01L33/54 ,  H01L33/62 ,  H01L33/00

CPC classification number: H01L25/0753 ,  H01L24/25 ,  H01L33/0095 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2224/82 ,  H01L2924/0002 ,  H01L2924/19105 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00

Abstract: The invention relates to a semiconductor component (1) comprising: a plurality of semiconductor chips (2), each having a semiconductor layer sequence (200) with an active region (20) for generating radiation; a radiation output side (10) that runs parallel to the active regions (20); a mounting side surface (11) which is provided for securing the semiconductor component, and which runs in a transverse or perpendicular direction to the radiation output side; a molded body (4) which is shaped in places on the semiconductor chips, and which at least partially forms the mounting side surface; and a contact structure (50) which is arranged on the molded body, and which connects at least two semiconductor chips of the plurality of semiconductor chips in an electrically conductive manner. The invention also relates to a lighting device (9) and to a method for producing a semiconductor component.

公开(公告)号：US09746141B2

公开(公告)日：2017-08-29

申请号：US14423026

申请日：2013-08-20

Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

Inventor： Rainer Butendeich ,  Matthias Sabathil

IPC: F21V9/00 ,  F21K99/00 ,  H01L25/075 ,  H01L33/50 ,  H05B33/14 ,  F21V9/16 ,  F21K9/64 ,  F21Y115/10 ,  F21Y113/13

CPC classification number: F21V9/30 ,  F21K9/64 ,  F21Y2113/13 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/504 ,  H01L2924/0002 ,  H05B33/14 ,  H01L2924/00

Abstract: An arrangement (1) for generating white light (5), having at least two light-emitting diodes, wherein the first diode (2) is designed to generate blue light, wherein a conversion element (4) is associated with the first diode, wherein the conversion element is designed to convert a part of the blue light from the first diode into green light, and wherein the conversion element is designed to convert a part of the blue light from the first diode into red light, wherein the second diode (3) is provided to emit red light.

公开(公告)号：US09698326B2

公开(公告)日：2017-07-04

申请号：US15058667

申请日：2016-03-02

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias Sabathil ,  Stefan Illek ,  Thomas Schwarz

IPC: H01L33/54 ,  H01L33/60 ,  H01L31/00 ,  H01L51/52 ,  H01L31/0232 ,  H01L25/075 ,  H01L33/48 ,  H01L33/56 ,  H01L25/16 ,  H01L25/00 ,  H01L33/46

CPC classification number: H01L33/60 ,  H01L25/0753 ,  H01L25/167 ,  H01L25/50 ,  H01L31/00 ,  H01L31/02322 ,  H01L33/46 ,  H01L33/486 ,  H01L33/54 ,  H01L33/56 ,  H01L51/5271 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00

Abstract: An optoelectronic semiconductor component including an optoelectronic semiconductor chip having a first surface, wherein the first surface is a radiation emission surface of the optoelectronic semiconductor chip, the semiconductor chip is embedded in a mold body, the first surface is elevated with respect to a top side of the mold body, and a reflective layer is arranged on the top side of the mold body.

公开(公告)号：US09608172B2

公开(公告)日：2017-03-28

申请号：US14441458

申请日：2013-11-04

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Matthias Sabathil

IPC: H01L33/50 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62 ,  H05K1/02 ,  H01L25/075 ,  H01L33/64

CPC classification number: H01L33/483 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/021 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2201/2054 ,  H01L2924/00014

Abstract: In at least one embodiment, the optoelectronic semiconductor component contains at least one chip support having electrical contact devices and also at least one optoelectronic semiconductor chip that is set up to produce radiation and that is mechanically and electrically mounted on the chip support. A component support is attached to the chip support. The semiconductor chip is situated in a recess in the component support. The component support is electrically insulated from the chip support and from the semiconductor chip. The component support is formed from a metal or from a metal alloy. On a top that is remote from the chip support, the component support is provided with a reflective coating.