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公开(公告)号：JP2000340585A
公开(公告)日：2000-12-08
申请号：JP15217099
申请日：1999-05-31
Applicant: SONY CORP
Inventor： OSONIWA KAZUMASA , ICHIKAWA IWAO , KAWATANI NORIO , YAMAUCHI MANABU
Abstract: PROBLEM TO BE SOLVED: To automatically and precisely adjust plane parallelism of a reference plane plate relative to a reference plane, even during operation of an apparatus. SOLUTION: A bonding device is described as an example of processing apparatus provided with this adjusting device 5A. This adjusting device 5A is disposed, so that an adsorbing surface 61 is opposed in parallel with to an electronic circuit board with a desired gap therebetween. This device is composed of a bonding tool 6, whose front and rear surfaces are reference planes finished in parallel, a tilting shaft 514 for rotatably supporting the bonding tool 6, planarity detecting sensors 521 disposed at a plurality of sites on the rear surface 62 side of the bonding tool 6 opposed thereto, so that tilting can be detected if the bonding tool 6 is tilted (flapped), a controller 9 which is connected to the planarity detecting sensors 521, processes each detection output and outputs prescribed information, a micrometer 515 for adjusting flapping of the bonding tool 6 based on the information outputted by the controller 9 and the like.
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公开(公告)号：JP2000307221A
公开(公告)日：2000-11-02
申请号：JP11765499
申请日：1999-04-26
Applicant: SONY CORP
Inventor： ICHIKAWA IWAO , KAWATANI NORIO
Abstract: PROBLEM TO BE SOLVED: To reduce the consumption of expensive conductive particles, and to electrically connect a fine electronic part with an electronic circuit board with high reliability. SOLUTION: In a method for electrically connecting the electronic part, at the time of connecting an electronic part (IC(semiconductor integrated circuit)) 10 equipped with plural electrodes 12 with plural prescribed electrode patterns 21 corresponding to the electrodes 12 of a polyimide resin substrate (electronic circuit board) 20 on which the electrode patterns 21 are formed, joining resin 2 being adhesive and conductive particles 31 are interposed so as to be mixed only between each electrode 12 part of the IC 10 and each electrode pattern 21 part and in the neighborhood, and afterwards the joining resin 32 is hardened so that the electrodes 12 of the IC 10 can be electrically connected with the electrode patterns 21 of the polyimide resin substrate 20.
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公开(公告)号：JPH10321996A
公开(公告)日：1998-12-04
申请号：JP12710097
申请日：1997-05-16
Applicant: SONY CORP
Inventor： KAWATANI NORIO
IPC: G02F1/1345 , H05K3/32 , H05K3/34 , H05K3/36
Abstract: PROBLEM TO BE SOLVED: To effectively and continuously provide a thermal bonding apparatus which can realize thermal bonding of electrical bonding member via an anisotropic conductive film for an object. SOLUTION: This apparatus comprises a first thermal bonding means 9 for thermally bonding an electrical connection member via an anisotropic conductive film ACF to a part of the first surface of an object received by a first receiving means 11 and a second thermal bonding means 10 for thermally bonding an electrical connecting member, via an anisotropic conductive film ACF to a part of the second surface of the object received by a second receiving means 12.
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54.发明专利
公开(公告)号：JPH1051115A
公开(公告)日：1998-02-20
申请号：JP21612296
申请日：1996-07-29
Applicant: SONY CORP
Inventor： KAWATANI NORIO
Abstract: PROBLEM TO BE SOLVED: To shorten the time necessary for dividing an anisotropic conducting film into sticking region parts for sticking the film on a board. SOLUTION: A notch is formed on an anisotropic conducting film 14 of base material 12 supplied from a base material supplying means 11, and the anisotropic conducting film 14 is divided into sticking region parts 14A and separating region parts for separating each of the sticking region parts 14A. The separating region parts are eliminated from a base film 13, pinching them. The sticking region parts 14A are stuck on a board 17. The base film 13 which is left after the sticking region parts 14A are stuck on a board 17 is wound up. Thereby the time necessary for dividing the anisotropic conducting film 14 into sticking region parts 14A can be remarkably reduced. Hence an anisotropic conducting film sticking equipment 10 wherein productivity can be more improved by a simple method and an isotropic conducting film dividing method can be realized.
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公开(公告)号：JPH08125316A
公开(公告)日：1996-05-17
申请号：JP28136294
申请日：1994-10-20
Applicant: SONY CORP
Inventor： ICHIKAWA IWAO , KAWATANI NORIO
Abstract: PURPOSE: To provide a thermocompression bonding device of a simple constitution which can stably pressurize a compression bonding member and can reduce a time until an aimed pressure is attained. CONSTITUTION: The title device is provided with holding means 1, 2 for holding compression bonding members 3, 4, a heating means 5 for heating the compression bonding member in contact therewith, a pressure generation means 6 for pressurizing the heating means 5 to the compression bonding member, an energization means 12 arranged between the heating means 5 and the pressure generation means 6 and a compression amount adjustment means 11 for preliminarily adjusting a compression amount of the energization means 12 to allow the energization means 12 to show a fixed compression bonding pressure to the compression bonding member when the heating means 5 is pressurized by the pressure generation means 6 starting from when the heating means 5 comes into contact with the compression bonding member.
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Patent Agency Ranking
公开(公告)号：JPH0848946A
公开(公告)日：1996-02-20
申请号：JP13578095
申请日：1995-05-09
Applicant: SONY CORP , SONY CHEMICALS
Inventor： ICHIKAWA IWAO , KAWATANI NORIO , YAMADA YUKIO , SUZUKI KAZUAKI , YAMAZAKI TOYOJI
IPC: C09J5/00
Abstract: PURPOSE:To provide an apparatus and method for separating a release film from an adhesive film whereby a release film can completely be separated from an adhesive film while enabling the decrease in tact time. CONSTITUTION:This apparatus has a thermal transfer means 60 for thermally transferring an adhesive film ST to an object 40 and a separating means 70 which is installed at a specified distance A from the transfer means 60 in order to separate a release film TH from the transferred adhesive film ST after the adhesive layer of the film ST is cooled to lower than its softening point.
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公开(公告)号：JPH0783835A
公开(公告)日：1995-03-31
申请号：JP24854593
申请日：1993-09-10
Applicant: SONY CORP
Inventor： KAWATANI NORIO , YANAGISAWA YOSHIYUKI , HONDA TAKAYUKI
Abstract: PURPOSE:To provide a method and a device for simultaneous observations at two points, by which two distant portions (points) of an object (subject for photography) can be recognized simultaneously at high magnifications. CONSTITUTION:In a two-point observation system for observing subjects for photography present in two points by forming their images on the same image- forming face 10 through an objective lens 12, the objective lens 12 is provided in such a way that the images can be formed with the two points in the same field of view, and a prism 12 by which the images of the subject for photography at two points, passed through the objective lens 12, are divided into two and guided to the image forming face 10, and which when moved on the optical axis 14 of the optical lens 12 can change that portion of the image of each subject for photography which is formed on the image forming face 10, is provided between the objective lens 12 and the image forming face 10.
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公开(公告)号：JPH06304888A
公开(公告)日：1994-11-01
申请号：JP11781693
申请日：1993-04-21
Applicant: SONY CORP
Inventor： KAWATANI NORIO
IPC: B25J15/06
Abstract: PURPOSE:To mount a circuit part of various sizes on an accurate position of a mounting board by providing a life means for selectively lifting at least a plurality of holding parts in accordance with an area of the circuit part. CONSTITUTION:Relating to a first sucker head 21, a second sucker head 22 is liftably provided. The first lift means 24 to 26 for lifting this first sucker head 21 and the second lift means 27, 28 for lifting the second sucker head 22 are arranged. In accordance with sizes of a circuit part 12 to be sucked, the first/second sucker heads 21, 22 are selectively lifted by the lift means (24 to 26), (27, 28), and the circuit part is sucked by sucker surfaces 21A, 22A of the first/second sucker heads 21, 22, to also mount the circuit part on a mounting board with press contact.
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59.发明专利
公开(公告)号：JPH0669643A
公开(公告)日：1994-03-11
申请号：JP24279392
申请日：1992-08-19
Applicant: SONY CORP
Inventor： HARUNA YASUSHI , KAWATANI NORIO
Abstract: PURPOSE:To realize a conductor connecting method and a connecting device which are capable of beforehand preventing a short-circuit accident even when an electrode interval is made small and accurately connecting between desired electrodes. CONSTITUTION:An anisotropic conductive film 24 is interposed between electrodes 8, 10 to heat and press, and conductive particles 36 composed of a magnetic body are scattered in a predetermined binder 34 to form the aniso- tropic conductive 24 to which a predetermined magnetic field 4 is applied.
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公开(公告)号：JPH0613522A
公开(公告)日：1994-01-21
申请号：JP18895792
申请日：1992-06-24
Applicant: SONY CORP
Inventor： KAWATANI NORIO , ICHIKAWA IWAO , ISHIKAWA MINORU , ARAKAWA SETSUKO
Abstract: PURPOSE:To enhance a soldering work which is capable of soldering a lead section with a soldered land to a satisfactory extent and making electrical connections without any failure even when the shape of the lead section is subject to slight variability by pressing a bending part of a V-shaped section of the lead to the soldered land of a board. CONSTITUTION:There are provided a plurality of lead sections 4, which are soldered to soldered lands 12 of a board 11. The lead sections 4 provide V-shaped sections 7 which are protectively bent to the soldered lands 12 at an acute angle over an IC component ranging from near its fixed end to its tip. When the IC component is soldered to the board 11, it is arranged that the bending parts of the V-shaped section 5 are depressed to the soldered lands 12. The V-shaped lead sections 4 are deformable when they are depressed so that they may adjust thrust force and minimize the effect of shape variability. This construction makes it possible to minimize effect on soldering induced by the thrust force and perform reliable soldering.
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