公开(公告)号：EP1547780A4

公开(公告)日：2012-01-25

申请号：EP03748624

申请日：2003-09-30

Applicant: SONY CORP

Inventor： NAKAMURA ATSUSHI ,  KAWATANI NORIO ,  HOSOI MASAHISA ,  OSONIWA KAZUMASA ,  TOKUNAGA HIROSHI

IPC: B41J2/16 ,  B41J2/14 ,  H01L21/00 ,  H01L21/68 ,  H05K1/02 ,  H05K3/30 ,  H05K13/04

CPC classification number: H01L21/67294 ,  B41J2/14024 ,  H01L21/67144 ,  H01L21/67259 ,  H01L21/681 ,  H05K1/0269 ,  H05K3/303 ,  H05K13/08 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/53087 ,  Y10T29/53091 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191

公开(公告)号：JP2000101294A

公开(公告)日：2000-04-07

申请号：JP26535298

申请日：1998-09-18

Applicant: SONY CORP

Inventor： ICHIKAWA IWAO ,  KAWATANI NORIO ,  YAMAUCHI MANABU ,  OSONIWA KAZUMASA

IPC: B23P19/00 ,  H05K13/04

Abstract: PROBLEM TO BE SOLVED: To provide a part mounting machine which allows adjustment of the tilt of a spindle. SOLUTION: An attaching head part 210 for sucking a part, a first adjusting part 220 which adjusts the tilt of the attaching head part in two orthogonal directions (P direction and R direction), a rotation part 230 which rotates the attaching head part, and a second adjusting part 240 which adjusts the tilt of the spindle of the rotation part in two orthogonal directions (P direction and R direction), are provided. So, the tilt in orthogonal two directions related to the attaching head as well as the spindle of it is adjusted.

公开(公告)号：JP2002026587A

公开(公告)日：2002-01-25

申请号：JP2000215904

申请日：2000-07-12

Applicant: SONY CORP

Inventor： KAWATANI NORIO ,  OSONIWA KAZUMASA ,  ICHIKAWA IWAO ,  YAMAUCHI MANABU

IPC: H05K13/02

Abstract: PROBLEM TO BE SOLVED: To provide a component supplying apparatus and component installation unit which is simplified in mechanism and is reduced in size to speed up operations. SOLUTION: The component supplying apparatus 100 which holds and moves a component W comprises a base 301 having a guide rail 302 and a sub-base 310 so disposed as to move along the guide rail 302. The component supplying apparatus 100 also comprises a movable block 312 which is disposed nearly vertically to the sub-base 310 and is movable in the vertical direction, a shaft 321 inserted rotatably in the movable block 312, a driving section 320 for rotating the shaft 321, a component holding section 350 provided with an arm 351 installed on the shaft 321, a first movement mechanism 330 for moving the sub-base 310 along the guide rail 302, and a second movement mechanism 340 for moving the movable block 312 in the vertical direction.

公开(公告)号：JP2000094232A

公开(公告)日：2000-04-04

申请号：JP27270998

申请日：1998-09-28

Applicant: SONY CORP

Inventor： KAWATANI NORIO ,  ICHIKAWA IWAO ,  YAMAUCHI MANABU ,  OSONIWA KAZUMASA

IPC: B23P19/00 ,  B23P21/00 ,  G05D3/00 ,  H05K13/04 ,  H05K13/08

Abstract: PROBLEM TO BE SOLVED: To provide a height adjusting mechanism having comparatively simple structures and capable of stably mounting in high accuracy a chip, for example, on a substrate and using general members for adjusting the height at lower costs, and the chip mounting equipment using the same. SOLUTION: This chip mounting equipment recognizes the position of a bare chip and that of the electrode-forming surface on a substrate by means of a camera 20 position-adjusted through a height adjusting mechanism 3. Position alignment is applied to the bare chip and the electrode-forming surface. The electrode of the bare chip is then connected to the substrate. Where, the height adjusting mechanism 3 is formed of: a plate 32 used for holding the camera 20, and upwardly, downwardly, slidably installed on a base member 19; a cam follower 33 provided on the plate 32; a motor 34 provided on and held by the base member 19 side; a cam plate 36 mounted on an output shaft 35 rotated by the motor 34 and for upwardly, downwardly moving the plate 32 associated with a cam face 36a with the cam follower 33 mounted on the cam surface 36a; a sensor 38 for detecting the angle of the rotation of the cam plate 36; and a control circuit means for controlling the angle of the rotation of the cam plate 36 is accordance with an output from the sensor 38.

公开(公告)号：JPH07157066A

公开(公告)日：1995-06-20

申请号：JP32984393

申请日：1993-11-30

Applicant: SONY CORP

Inventor： OTA YOSHINORI ,  OSONIWA KAZUMASA ,  HIGEBU TETSUO ,  TOMIKAWA HIDEAKI

IPC: B23P19/06 ,  B65G11/20 ,  B65G47/08 ,  B65G47/78

Abstract: PURPOSE:To supply parts more smoothly and reliably in a part supply device to supply the parts the prescribed number by the prescribed number to an external part from a stock part in which plural parts are stocked. CONSTITUTION:Since parts situated in a guide part of a sending-out means are delivered the prescribed number by the prescribed number to a carrying means 23 while locking them by a locking means 31, carrying operation of the parts held by the carrying means 23 can be effectively avoided from being hindered by the parts situated in the guide part of the sending-out means.

公开(公告)号：JP2004122388A

公开(公告)日：2004-04-22

申请号：JP2002285992

申请日：2002-09-30

Applicant: Sony Corp ,  ソニー株式会社

Inventor： NAKAMURA ATSUSHI ,  KAWATANI NORIO ,  HOSOI MASAHISA ,  OSONIWA KAZUMASA

IPC: B41J2/16 ,  H01L21/52 ,  H05K13/04

Abstract: PROBLEM TO BE SOLVED: To obtain an aligning method realizing highly accurate alignment.
SOLUTION: When electronic components are aligned, a first electronic component provided with alignment holes 27a and 27b at specified positions at a specified interval is disposed oppositely to a second electronic component provided with polygonal alignment marks 28a and 28b arranged concentrically with a plurality of alignment index parts of different size in alignment with the alignment holes 27a and 27b. The electronic components are adjusted roughly such that the entire image of a small alignment index part S of the alignment marks 28a and 28b can be captured in the alignment holes 27a and 27b, and the entire image of a large alignment index part L of the alignment marks 28a and 28b can be captured in the alignment holes 27a and 27b using the small alignment index part S. Furthermore, a positional correction amount is measured by the large alignment index part L or by both the large and small alignment index parts L and S, and then fine adjustment of the first and second electronic components is performed by moving the second electronic component relatively by the positional correction amount thus aligning the electronic component.
COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2004119535A

公开(公告)日：2004-04-15

申请号：JP2002278337

申请日：2002-09-25

Applicant: Sony Corp ,  ソニー株式会社

Inventor： NAKAMURA ATSUSHI ,  KAWATANI NORIO ,  HOSOI MASAHISA ,  OSONIWA KAZUMASA ,  TOKUNAGA HIROSHI

IPC: H05K13/04

Abstract: PROBLEM TO BE SOLVED: To accurately arrange and package all electronic components on a substrate by small information quantity in an electronic component packaging method for arranging a plurality of electronic components on the substrate at regular intervals, and to improve the productivity of a packaged product. SOLUTION: An electronic component 10 to be arranged at first out of a plurality of electronic components 10, 10, .... to be arranged at the regular intervals and packaged on the substrate 11 positioned and fixed on a prescribed position is positioned and packaged on the basis of distance information from a prescribed reference position on the substrate 11. Electronic components 10 to be arranged on the 2nd position or later out of the plurality of electronic components 10, 10, .... are positioned and packaged on the basis of the position information of the adjacent electronic component packaged before and interval distance information between the electronic components. Consequently, all the electronic components 10 can be accurately packaged on the substrate 11 by the small information quantity, and the productivity of the packaged product can be improved. COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：为了在电子元件封装方法中以小的信息量将基板上的所有电子部件精确地布置和封装，以便以规则的间隔在基板上布置多个电子部件，并且提高生产率 包装产品。 解决方案：首先在多个电子部件10,10，...中排列成规则间隔并封装在定位和固定在规定位置上的基板11上的电子部件10是： 基于来自基板11上的规定基准位置的距离信息来定位和封装。布置在多个电子部件10,10，...中的第二位置或更后的电子部件10被定位和包装 基于之前封装的相邻电子部件的位置信息和电子部件之间的间隔距离信息。 因此，可以通过小的信息量将所有电子部件10精确地封装在基板11上，并且可以提高封装产品的生产率。 版权所有（C）2004，JPO

公开(公告)号：JP2001239430A

公开(公告)日：2001-09-04

申请号：JP2000056025

申请日：2000-02-28

Applicant: SONY CORP

Inventor： OSONIWA KAZUMASA ,  KAWATANI NORIO ,  ICHIKAWA IWAO ,  YAMAUCHI MANABU

IPC: B23P21/00

Abstract: PROBLEM TO BE SOLVED: To provide a component mounting device and a component mounting method allowing cycle time reduction by continuously performing temporary crimp and real crimp of the component. SOLUTION: The component mounting device comprises a component mounting part 11 having a holding part 12 for holding the component 70, a component supply part for supplying the component to the holding part, and a tape member supply part 40 for supplying a dirt preventing tape member 43 to the holding part. The dirt preventing tape member is provided with an opening for holding the component by the holding part.

公开(公告)号：JP2000049199A

公开(公告)日：2000-02-18

申请号：JP21580098

申请日：1998-07-30

Applicant: SONY CORP

Inventor： KAWATANI NORIO ,  ICHIKAWA IWAO ,  YAMAUCHI MANABU ,  OSONIWA KAZUMASA

IPC: G01B5/00 ,  G01B21/00 ,  H01L21/603

Abstract: PROBLEM TO BE SOLVED: To obtain a higher accuracy in setting the position of a chip component in a parallelism adjusting device, compared with the conventional accuracy. SOLUTION: An chucking part 75 which chucks chip components is provided at the tip of a bar-shaped axle 102, and the chucking part 75 freely supports a position which is away by a prescribed distance (X) from the tip of the said axle with the help of supporters (100, 100A, and 101), even in waving movement. In addition, adjusters (103-110) are provided to adjust the parallelism of the chucking part to set at a position which is away by a longer distance (Y) than the distance between the tip and the supporters. As a result, the parallelism of the chucking part against the substrate can be finely adjusted, and fluctuations of the parallelism can be avoided by bonding the chip components. Thus, position setting at higher accuracy than ever can be ensured.

公开(公告)号：JP2008170794A

公开(公告)日：2008-07-24

申请号：JP2007004737

申请日：2007-01-12

Applicant: Sony Corp ,  ソニー株式会社

Inventor： OSONIWA KAZUMASA ,  MAEDA MASARU ,  OKUMA HIDEO

IPC: G03B9/02 ,  G03B9/10

CPC classification number: G03B9/02

Abstract: PROBLEM TO BE SOLVED: To make thinner in the direction of an optical axis, in the technical field of a light quantity adjustment device and imaging apparatus. SOLUTION: A base body 68 to which a cover plate 91, a first separator 92 and a second separator 93 are attached is formed by injection molding that uses a first mold 600 and a second mold 700. Mounting grooves 89d are formed in the first and the second molds by forming mounting groove formation projections 601 and 701 which project close to each other and come into contact with each other when the molds with molten resin 900 injected in the respective cavities 800 are butted against each other. One of the elastically deformed separators is elastically restored and thereby at least parts of a circumferential part are inserted and mounted in the mounting grooves. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：在光量调节装置和成像装置的技术领域中，使光轴方向更薄。 解决方案：通过使用第一模具600和第二模具700的注射成型形成安装有盖板91，第一隔板92和第二隔板93的基体68.安装槽89d形成在 第一模具和第二模具通过形成安装槽形成突起601和701，当注射在各个腔室800中的熔融树脂900的模具彼此抵靠时，形成彼此靠近并彼此接触的安装槽形成突起601和701。 一个弹性变形的分离器被弹性恢复，从而至少一部分圆周部分被插入安装在安装槽中。 版权所有（C）2008，JPO＆INPIT