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    Wafer level proximity sensor
    51.
    发明授权
    Wafer level proximity sensor 有权

    公开(公告)号：US11069667B2

    公开(公告)日：2021-07-20

    申请号：US15087959

    申请日：2016-03-31

    Applicant: STMicroelectronics Pte Ltd

    Inventor： David Gani

    IPC: H01L25/16 ,  H01L21/768 ,  H01L23/48 ,  H01L31/02 ,  H01L31/167 ,  H01L31/18 ,  H01S5/022 ,  H04M1/02 ,  G06F3/041 ,  G01S17/04 ,  H01S5/02325

    Abstract: Wafer level proximity sensors are formed by processing a silicon substrate wafer and a silicon cap wafer separately, bonding the cap wafer to the substrate wafer, forming an interconnect structure of through-silicon vias within the substrate, and singulating the bonded wafers to yield individually packaged sensors. The wafer level proximity sensor is smaller than a conventional proximity sensor and can be manufactured using a shorter fabrication process at a lower cost. The proximity sensors are coupled to external components by a signal path that includes the through-silicon vias and a ball grid array formed on a lower surface of the silicon substrate. The design of the wafer level proximity sensor passes more light from the light emitter and more light to the light sensor.

    Semiconductor package with protected sidewall and method of forming the same
    52.
    发明授权
    Semiconductor package with protected sidewall and method of forming the same 有权

    公开(公告)号：US10910287B2

    公开(公告)日：2021-02-02

    申请号：US16270927

    申请日：2019-02-08

    Applicant: STMICROELECTRONICS PTE LTD

    Inventor： Yun Liu ,  David Gani

    IPC: H01L23/31 ,  H01L21/78 ,  H01L21/56 ,  H01L21/304 ,  H01L23/00 ,  H01L23/28

    Abstract: A semiconductor package having a die with a sidewall protected by molding compound, and methods of forming the same are disclosed. The package includes a die with a first surface opposite a second surface and sidewalls extending between the first and second surfaces. A redistribution layer is formed on the first surface of each die. An area of the first surface of the die is greater than an area of the redistribution layer, such that a portion of the first surface of the die is exposed. When molding compound is formed over the die and the redistribution layer to form a semiconductor package, the molding compound is on the first surface of the die between an outer edge of the redistribution layer and an outer edge of the first surface. The molding compound is also on the sidewalls of the die, which provides protection against chipping or cracking during transport.

    CRACK DETECTION INTEGRITY CHECK
    54.
    发明申请
    CRACK DETECTION INTEGRITY CHECK 审中-公开

    公开(公告)号：US20200241068A1

    公开(公告)日：2020-07-30

    申请号：US16746201

    申请日：2020-01-17

    Applicant: STMicroelectronics Pte Ltd

    Inventor： Pedro Jr Santos PERALTA ,  David GANI

    IPC: G01R31/28 ,  G01R31/26 ,  G01R31/3185 ,  H01L21/66

    Abstract: A method of testing integrated circuit die for presence of a crack includes performing back end integrated circuit fabrication processes on a wafer having a plurality of integrated circuit die, the back end fabrication including an assembly process. The assembly process includes a) lowering a tip of a first manipulator arm to contact a given die such that pogo pins extending from the tip make electrical contact with conductive areas on the given die so that the pogo pins are electrically connected to a crack detector on the given die, b) picking up the given die using the first manipulator arm, and c) performing a conductivity test on the crack detector using the pogo pins to determine presence of a crack in the given die that extends from a periphery of the die, through a die seal ring of the die, and into an integrated circuit region of the die.

    Semiconductor sensor package
    55.
    发明授权
    Semiconductor sensor package 有权

    公开(公告)号：US10600758B2

    公开(公告)日：2020-03-24

    申请号：US16189010

    申请日：2018-11-13

    Applicant: STMICROELECTRONICS PTE LTD

    Inventor： Jian Zhou

    IPC: H01L25/065 ,  H01L25/00 ,  H01L23/31 ,  H01L23/10 ,  H01L21/50

    Abstract: A package packaged with a cap. The package features trenches, through holes, and a non-conductive coupling element forming a locking mechanism integrated embedded or integrated within a substrate. The package has a cap coupled to the non-conductive coupling element through ultrasonic plastic welding. The package protects the dice from an outside environment or external stresses or both. A method is desired to form package to reduce glue overflow defects in the package. Fabrication of the package comprises drilling holes in a substrate; forming trenches in the substrate; forming a non-conductive coupling element in the through holes and the trenches to form a locking mechanism; allowing the non-conductive coupling element to harden and cure; coupling a die or dice to the substrate; and coupling a cap to the non-conductive coupling element to protect the die or dice from an outside environment or external stresses or both.

    Integrated air quality sensor that detects multiple gas species
    56.
    发明授权
    Integrated air quality sensor that detects multiple gas species 有权

    公开(公告)号：US10254261B2

    公开(公告)日：2019-04-09

    申请号：US15213100

    申请日：2016-07-18

    Applicant: STMicroelectronics Pte Ltd

    Inventor： Olivier Le Neel ,  Tien Choy Loh ,  Shian Yeu Kam ,  Ravi Shankar

    IPC: G01N25/22 ,  G01N33/00

    Abstract: A microelectronic device capable of detecting multiple gas constituents in ambient air can be used to monitor air quality. The microelectronic air quality monitor includes a plurality of temperature-sensitive gas sensors tuned to detect different gas species. Each gas sensor is tuned by programming an adjacent heater. An insulating air pocket formed below the sensor helps to maintain the sensor at a desired temperature. A temperature sensor may also be integrated with each gas sensor to provide additional feedback control. The heater, temperature sensor, and gas sensors are in the form of patternable thin films integrated on a single microchip. The device can be incorporated into computer workstations, smart phones, clothing, or other wearable accessories to function as a personal air quality monitor that is smaller, more accurate, and less expensive than existing air quality sensors.

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