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公开(公告)号:US09754756B2
公开(公告)日:2017-09-05
申请号:US15150895
申请日:2016-05-10
Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS PTE LTD
Inventor: Davide Giuseppe Patti , Myung Sung Kim
CPC classification number: H01J19/02 , H01J9/025 , H01J9/18 , H01J21/04 , H01J21/105 , H01J21/20 , H01J2209/012 , H01J2209/02
Abstract: A vacuum integrated electronic device has an anode region of conductive material; an insulating region on top of the anode region; a cavity extending through the insulating region and having a sidewall; and a cathode region. The cathode region has a tip portion extending peripherally within the cavity, adjacent to the sidewall of the cavity. The cathode region is formed by tilted deposition, carried out at an angle of 30-60° with respect to a perpendicular to the surface of device.
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公开(公告)号:US20170148604A1
公开(公告)日:2017-05-25
申请号:US15150895
申请日:2016-05-10
Applicant: STMICROELECTRONICS S.R.L. , STMICROELECTRONICS PTE LTD
Inventor: Davide Giuseppe Patti , Myung Sung Kim
CPC classification number: H01J19/02 , H01J9/025 , H01J9/18 , H01J21/04 , H01J21/105 , H01J21/20 , H01J2209/012 , H01J2209/02
Abstract: A vacuum integrated electronic device has an anode region of conductive material; an insulating region on top of the anode region; a cavity extending through the insulating region and having a sidewall; and a cathode region. The cathode region has a tip portion extending peripherally within the cavity, adjacent to the sidewall of the cavity. The cathode region is formed by tilted deposition, carried out at an angle of 30-60° with respect to a perpendicular to the surface of device.
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