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    SOLDER ALLOY
    55.
    发明公开
    SOLDER ALLOY 有权
    LÖTLEGIERUNG

    公开(公告)号：EP2839920A1

    公开(公告)日：2015-02-25

    申请号：EP13778363.5

    申请日：2013-04-17

    Applicant: SENJU METAL INDUSTRY CO., LTD.

    Inventor： NOMURA, Hikaru ,  YOSHIKAWA, Shunsaku

    IPC: B23K35/26 ,  B23K1/19 ,  C22C13/00 ,  B23K101/38 ,  B23K103/10

    CPC classification number: B23K35/262 ,  B23K1/00 ,  B23K1/0016 ,  B23K1/19 ,  B23K35/282 ,  B23K2201/00 ,  B23K2201/32 ,  B23K2201/38 ,  B23K2203/10 ,  C22C13/00 ,  Y10T403/479

    Abstract: To provide Sn-Zn series solder alloy that can decrease the amount of occurred dross, suppress discoloration of the fusion solder alloy and re-oxidation, and suppress the erosion phenomenon of Al and Ni even when the fusion solder alloy exposes the air.
    In order to suppress diffusion of Al and/or Ni to the solder alloy by forming an oxide film on a surface of the solder bath prior to Zn, a solder alloy has an alloy composition containing Zn of 3 through 25 mass %, Ti of 0.002 through 0.25 mass %, Al of 0.002 through 0.25 mass % and balance of Sn.

    Abstract translation: 为了提供可以减少发生的渣滓量的Sn-Zn系焊料合金，抑制熔融焊料合金的变色和再次氧化，并且即使当熔融焊料合金露出空气时也抑制Al和Ni的腐蚀现象。 为了通过在Zn之前在焊料槽的表面上形成氧化膜来抑制Al和/或Ni对焊料合金的扩散，焊料合金具有含有3〜25质量％的Zn，0.002的Ti的合金组成 通过0.25质量％的Al，0.002〜0.25质量％的Al和余量的Sn。

    OBJECT PRODUCTION
    56.
    发明公开
    OBJECT PRODUCTION 审中-公开
    OBJEKTHERSTELLUNG

    公开(公告)号：EP2817118A1

    公开(公告)日：2014-12-31

    申请号：EP13706690.8

    申请日：2013-02-20

    Applicant: Ward-Close, Charles Malcolm

    Inventor： Ward-Close, Charles Malcolm

    IPC: B22F3/105 ,  B22F3/24

    CPC classification number: B22F3/1039 ,  B22F3/003 ,  B22F3/02 ,  B22F3/1035 ,  B22F3/1055 ,  B22F3/15 ,  B22F3/168 ,  B22F3/24 ,  B22F2003/1056 ,  B22F2003/248 ,  B23K20/002 ,  B23K20/02 ,  B23K20/227 ,  B23K20/233 ,  B23K20/2333 ,  B23K2201/00 ,  B32B15/01 ,  B33Y70/00 ,  Y02P10/295 ,  Y10T428/12806

    Abstract: Methods and apparatus for producing an object, the method comprising: performing an Additive Manufacturing process to produce an intermediate object from provided metal or alloy (12), whereby the intermediate object comprises regions (50) having a contaminant concentration level above a threshold level; based upon one or more parameters, determining a temperature and a duration; and performing, on the intermediate object, a contaminant dispersion process by, for a duration that is greater than or equal to the determined duration, heating the intermediate object to a temperature that is greater than or equal to the determined temperature and less than the melting point of the metal or alloy, the contaminant dispersion process being performed so as to disperse,within the intermediate object, a contaminant from regions of high contaminant concentration to regions of low contaminant concentration until the intermediate object comprises no regions having a contaminant concentration level above the threshold level.

    Abstract translation: 公开了处理物体的方法，该物体由金属或合金制成，该物体具有多个开放空腔，该方法包括：对物体进行密封处理以密封开放空腔的开口，从而形成 多个闭合腔; 以及通过对具有封闭空腔的物体执行固结处理来减小封闭空腔的尺寸。 密封过程可以包括喷丸硬化或涂覆物体。 固结过程可以包括热等静压法。 封闭空腔的尺寸可以减小，直到封闭空腔不再存在于物体中。

    PROCESSING OF METAL OR ALLOY OBJECTS
    57.
    发明公开
    PROCESSING OF METAL OR ALLOY OBJECTS 审中-公开
    BEHANDLUNG VON金属加工厂LEGIERUNGSOBJEKTEN

    公开(公告)号：EP2817116A1

    公开(公告)日：2014-12-31

    申请号：EP13706689.0

    申请日：2013-02-20

    Applicant: Ward-Close, Charles Malcolm

    Inventor： Ward-Close, Charles Malcolm

    IPC: B22F3/00

    CPC classification number: B22F3/1039 ,  B22F3/003 ,  B22F3/02 ,  B22F3/1035 ,  B22F3/1055 ,  B22F3/15 ,  B22F3/168 ,  B22F3/24 ,  B22F2003/1056 ,  B22F2003/248 ,  B23K20/002 ,  B23K20/02 ,  B23K20/227 ,  B23K20/233 ,  B23K20/2333 ,  B23K2201/00 ,  B32B15/01 ,  B33Y70/00 ,  Y02P10/295 ,  Y10T428/12806

    Abstract: Disclosed are methods of processing an object (2), the object (2) being made of a metal or an alloy, the object (2) having a plurality of open cavities (10), the method comprising: performing a sealing process on the object (2) to seal the openings of the open cavities (10), thereby forming a plurality of closed cavities (8); and reducing the sizes of the closed cavities (8) by performing a consolidation process on the object (2) having the closed cavities (8).Sealing process may comprise shot peening or coating the object (2). A consolidation process may comprise a hot isostatic pressing process. The sizes of the closed cavities (8) may be reduced until the closed cavities (8) are no longer present in the object (2).

    Abstract translation: 公开了处理物体的方法，该物体由金属或合金制成，该物体具有多个开放空腔，该方法包括：对物体进行密封处理以密封开放空腔的开口，从而形成 多个闭合腔; 以及通过对具有封闭空腔的物体执行固结处理来减小封闭空腔的尺寸。 密封过程可以包括喷丸硬化或涂覆物体。 固结过程可以包括热等静压法。 封闭空腔的尺寸可以减小，直到封闭空腔不再存在于物体中。

    ALUMINIUM ALLOY-COPPER ALLOY BOND, AND BONDING METHOD FOR SAME
    58.
    发明公开
    ALUMINIUM ALLOY-COPPER ALLOY BOND, AND BONDING METHOD FOR SAME 有权
    VERBINDUNG AUS EINER ALUMINIUMLEGIERUNG UND EINER KUPFERLEGIERUNG SOWIE VERBINDUNGSVERFAHRENDAFÜR

    公开(公告)号：EP2786831A2

    公开(公告)日：2014-10-08

    申请号：EP12853569.7

    申请日：2012-11-28

    Applicant: UACJ Corporation

    Inventor： KITAWAKI Kotaro ,  MURASE Takashi

    IPC: B23K20/00 ,  B23K20/16 ,  B23K20/233 ,  B23K35/362 ,  B32B15/01 ,  C22C21/02 ,  C22C21/12 ,  C22C9/04

    CPC classification number: B23K31/02 ,  B23K20/2333 ,  B23K35/002 ,  B23K35/007 ,  B23K35/286 ,  B23K35/38 ,  B23K2201/00 ,  B23K2203/10 ,  B23K2203/12 ,  B23K2203/18 ,  B32B15/017 ,  C22C9/00 ,  C22C9/04 ,  C22C21/02 ,  C22C21/14 ,  C22C21/16 ,  C22C21/18 ,  Y10T428/1275

    Abstract: [Object] To provide a bonded body of an aluminum alloy and a copper alloy and a bonding method for the bonded body, the bonded body being bonded by a novel bonding method which ensures excellent bonding properties, small material deformation during bonding, and high reliability.
    [Solving Means] A bonded body made of an aluminum alloy and a copper alloy and obtained by employing the aluminum alloy as one member to be bonded and the copper alloy as the other member to be bonded, the one bonded member and the other bonded member being bonded to each other through metallic connection, wherein the one bonded member is made of comprising an aluminum alloy containing Cu: 3.0 mass % to 8.0 mass % and Si: 0.1 mass % to 10 mass % with balance being Al and unavoidable inevitable impurities, and satisfying the chemical formula: C + 2.4 · S · 7.8 where C (mass %) is a Cu concentration and S (mass %) is a Si composition concentration is satisfied, and the other bonded member is made of comprising a copper alloy having a higher solidus temperature than the one bonded member. A bonding method for the bonded body is also provided.

    Abstract translation: 为了提供铝合金和铜合金的接合体以及接合体的接合方法，通过新的接合方法将接合体接合，确保了良好的接合性，接合时的材料变形小，可靠性高 。 [解决方案]一种铝合金和铜合金制成的接合体，通过使用铝合金作为一个待接合部件，将铜合金作为另一个被接合部件，将一个接合部件和另一个接合部件 通过金属连接彼此粘合，其中一个接合部件由包含Cu：3.0质量％至8.0质量％的Al合金和Si：0.1质量％至10质量％的Al和不可避免的不可避免的杂质构成， 满足化学式C + 2.4·S·7.8，其中C（质量％）为Cu浓度，S（质量％）为Si组成浓度，另一方接合部件由包含铜合金 比一个接合构件更高的固相线温度。 还提供了一种用于接合体的接合方法。

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