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    MICRO-TRANSFER-PRINTED COMPOUND SENSOR DEVICE
    51.
    发明申请
    MICRO-TRANSFER-PRINTED COMPOUND SENSOR DEVICE 审中-公开

    公开(公告)号：US20170225945A1

    公开(公告)日：2017-08-10

    申请号：US15412881

    申请日：2017-01-23

    Applicant: X-Celeprint Limited

    Inventor： Ronald S. Cok

    IPC: B81B7/00 ,  B81C3/00

    CPC classification number: B81C3/001 ,  B81B2207/012 ,  B81C1/00373 ,  B81C2201/0194 ,  B81C2203/051 ,  B81C2203/0792

    Abstract: A compound sensor device includes a semiconductor substrate having an active electronic circuit formed in or on the semiconductor substrate. A sensor comprising a sensor substrate including a sensor circuit having an environmental sensor or actuator formed in or on the sensor substrate is micro-transfer printed onto the semiconductor substrate. One or more electrical conductors electrically connects the active electronic circuit to the sensor circuit. The semiconductor substrate comprises a first material and the sensor substrate comprises a second material different from the first material.

    Method for producing a micromechanical component, and micromechanical component
    53.
    发明授权
    Method for producing a micromechanical component, and micromechanical component 有权

    公开(公告)号：US09365410B2

    公开(公告)日：2016-06-14

    申请号：US14624071

    申请日：2015-02-17

    Applicant: Robert Bosch GmbH

    Inventor： Dietmar Haberer

    IPC: H01L21/00 ,  B81B3/00 ,  B81B1/00 ,  B81B7/02 ,  B81C1/00

    CPC classification number: B81B1/004 ,  B81B7/02 ,  B81B2201/04 ,  B81B2201/047 ,  B81B2203/0353 ,  B81C1/00087 ,  B81C1/00103 ,  B81C2201/0194 ,  B81C2203/0172

    Abstract: A method for producing a micromechanical component, and a micromechanical component, includes providing a substrate having first and second outer surfaces, the second surface facing away from the first surface; forming a through-hole through the substrate from the first outer surface up to the second outer surface; attaching an optical functional layer, on the second outer surface, to cover the through-hole; removing a first segment of the substrate on the first surface of the substrate so that there arises a third outer surface inclined relative to the second surface, the third surface facing away from the second surface, the inclined surface enclosing the through-hole; and separating the micromechanical component by separating a first part of the substrate, having the through-hole, and a second part, attached to the first part, of the optical functional layer from a remaining part of the substrate and a remaining part of the optical functional layer.

    METHOD AND APPARATUS FOR RELEASE-ASSISTED MICROCONTACT PRINTING OF MEMS
    57.
    发明申请
    METHOD AND APPARATUS FOR RELEASE-ASSISTED MICROCONTACT PRINTING OF MEMS 审中-公开
    用于微机械辅助微型打印的方法和装置

    公开(公告)号：US20150076632A9

    公开(公告)日：2015-03-19

    申请号：US13604613

    申请日：2012-09-05

    Applicant: Apoorva MURARKA ,  Vladimir BULOVIC ,  Sarah PAYDAVOSI

    Inventor： Apoorva MURARKA ,  Vladimir BULOVIC ,  Sarah PAYDAVOSI

    IPC: B81C1/00 ,  B81B3/00

    CPC classification number: B81B3/0021 ,  B81B2203/0127 ,  B81C1/00158 ,  B81C1/00492 ,  B81C2201/0194

    Abstract: The disclosure provides methods and apparatus for release-assisted microcontact printing of MEMS. Specifically, the principles disclosed herein enable patterning diaphragms and conductive membranes on a substrate having articulations of desired shapes and sizes. Such diaphragms deflect under applied pressure or force (e.g., electrostatic, electromagnetic, acoustic, pneumatic, mechanical, etc.) generating a responsive signal. Alternatively, the diaphragm can be made to deflect in response to an external bias to measure the external bias/phenomenon. The disclosed principles enable transferring diaphragms and/or thin membranes without rupturing.

    Abstract translation: 本公开提供了用于MEMS的释放辅助微接触印刷的方法和装置。 具体来说，本文公开的原理使得能够在具有所需形状和尺寸的关节的基底上形成膜片和导电膜。 这种隔膜在施加的压力或力（例如，静电，电磁，声学，气动，机械等）下偏转，产生响应信号。 或者，可以使隔膜响应于外部偏置而偏转以测量外部偏置/现象。 所公开的原理使得能够在不破裂的情况下传送膜片和/或薄膜。

    Methods for fabricating MEMS structures by etching sacrificial features embedded in glass
    59.
    发明授权
    Methods for fabricating MEMS structures by etching sacrificial features embedded in glass 有权
    通过蚀刻嵌入玻璃中的牺牲特征来制造MEMS结构的方法

    公开(公告)号：US08735199B2

    公开(公告)日：2014-05-27

    申请号：US13749008

    申请日：2013-01-24

    Applicant: Honeywell International Inc.

    Inventor： Ryan Supino ,  Grant H. Lodden

    IPC: H01L21/00

    CPC classification number: B81C1/00523 ,  B81C1/00182 ,  B81C1/00619 ,  B81C2201/019 ,  B81C2201/0194

    Abstract: In an embodiment a method of fabricating a MEMS structure is provided. The method includes fabricating a working structure in a doped layer proximate a first surface of a silicon substrate. The first surface of the silicon substrate is bonded to a first planar glass structure having a first one or more sacrificial features embedded therein. The method also includes etching to remove a bulk of the silicon substrate, wherein the bulk is reverse of the first surface on the silicon substrate, wherein etching removes the bulk and leaves the working structure bonded to the first planar glass structure. The method also includes etching to remove the first one or more sacrificial features from the first planar glass structure.

    Abstract translation: 在一个实施例中，提供了一种制造MEMS结构的方法。 该方法包括在接近硅衬底的第一表面的掺杂层中制造工作结构。 硅衬底的第一表面被结合到具有嵌入其中的第一个或多个牺牲特征的第一平面玻璃结构。 该方法还包括蚀刻以去除大部分硅衬底，其中本体与硅衬底上的第一表面相反，其中蚀刻去除体并离开结合到第一平面玻璃结构的工作结构。 该方法还包括蚀刻以从第一平面玻璃结构去除第一或多个牺牲特征。

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