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    THERMALLY-CONDUCTIVE, ELECTRICALLY-CONDUCTIVE ADHESIVE COMPOSITION
    53.
    发明公开
    THERMALLY-CONDUCTIVE, ELECTRICALLY-CONDUCTIVE ADHESIVE COMPOSITION 有权
    热传导散热导电粘合剂组合物

    公开(公告)号：EP2940093A4

    公开(公告)日：2016-08-03

    申请号：EP13866780

    申请日：2013-12-25

    Applicant: KANSAI UNIVERSITY ,  TANAKA PRECIOUS METAL IND

    Inventor： MITSUKAZU OCHI ,  IRIFUNE AKIRA ,  ICHIKAWA NATSUKO ,  HARADA MIYUKI ,  FURUSHO RIKIA ,  KONDO TAKESHI ,  OKUDA AKIHIKO

    IPC: C09J163/00 ,  C09D5/00 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  H01B1/00 ,  H01B1/22

    CPC classification number: C09J9/02 ,  C08K2003/0806 ,  C08K2201/001 ,  C08K2201/003 ,  C08K2201/011 ,  C09D5/00 ,  C09J163/00 ,  C09K5/14 ,  H01B1/22 ,  C08K3/08

    Abstract: [PROBLEMS TO BE SOLVED] A thermally conductive, electrically conductive adhesive composition having high thermal conductivity and consistent electrical conductivity for use as a die-bonding material is provided. [SOLUTION] A thermally conductive, electrically conductive adhesive composition including: (A) an electrically conductive filler, (B) an epoxy resin, and (C) a curing agent, the electrically conductive filler (A) being a submicron fine silver powder, and the content of the fine silver powder being 75 to 94% by mass of the total amount of the thermally conductive, electrically conductive adhesive composition, the content of the epoxy resin (B) being 5 to 20% by mass of the total amount of the thermally conductive, electrically conductive adhesive composition, the curing agent (C) being a compound of Formula (I), (II), or (III), and the content of the compound being 0.4 to 2.4 molar equivalents in terms of equivalent of active hydrogen relative to 1 molar equivalent of epoxy groups in the epoxy resin (B), and during heat curing and before the electrically conductive filler (A) starts to sinter, the thermally conductive, electrically conductive adhesive composition being in an uncured state or a half-cured state: (in which X is -SO 2 -, -CH 2 -, or -O-, and R1 to R4 are independently a hydrogen atom or a lower alkyl group), (in which X is -SO 2 -, -CH 2 -, or -O-, and R5 to R8 are independently a hydrogen atom or a lower alkyl group), and (in which X is -SO 2 -, -CH 2 -, or -O-, and R9 to R12 are independently a hydrogen atom or a lower alkyl group).

    NANOCOMPOSITES CONTAINING NONSPHERICAL SILICA NANOPARTICLES, COMPOSITES, ARTICLES, AND METHODS OF MAKING SAME
    56.
    发明公开
    NANOCOMPOSITES CONTAINING NONSPHERICAL SILICA NANOPARTICLES, COMPOSITES, ARTICLES, AND METHODS OF MAKING SAME 审中-公开
    纳米复合材料ROUND不以二氧化硅组合物，制品和方法及其生产

    公开(公告)号：EP3033382A2

    公开(公告)日：2016-06-22

    申请号：EP14841374.3

    申请日：2014-08-12

    Applicant: 3M Innovative Properties Company

    Inventor： CONDO, Peter D. ,  SWANSON, Jeremy O. ,  THORSON, James E. ,  SCHULTZ, William J. ,  THUNHORST, Kristin L.

    IPC: C08J5/00 ,  C09D7/12 ,  C08K9/06 ,  C08J5/24

    CPC classification number: C08K9/04 ,  B05D2601/02 ,  B05D2601/22 ,  C08J5/005 ,  C08J5/24 ,  C08J2333/08 ,  C08J2333/24 ,  C08J2363/00 ,  C08K3/36 ,  C08K7/00 ,  C08K7/18 ,  C08K7/28 ,  C08K9/06 ,  C08K2201/003 ,  C08K2201/011 ,  C08L63/00 ,  C09D7/40 ,  C08L71/00

    Abstract: A nanocomposite is provided including silica nanoparticles and a dispersant dispersed in a curable resin or a curing agent, where the nanocomposite contains less than 2% by weight solvent. The silica nanoparticles include nonspherical silica nanoparticles and/or spherical pyrogenic silica nanoparticles. A composite is also provided including from about 4 to 70 weight percent of silica nanoparticles, and a dispersant, dispersed in a cured resin, and a filler embedded in the cured resin. Optionally, the composite further contains a curing agent. Further, a method of preparing a nanoparticle-containing curable resin system is provided including mixing from 10 to 70 weight percent of aggregated silica nanoparticles with a curable resin and a dispersant to form a mixture. The mixture contains less than 2% by weight solvent. The method also includes milling the mixture in an immersion mill containing milling media to form a milled resin system including silica nanoparticles dispersed in the curable resin.

    Abstract translation: 一种纳米复合材料提供了一种包括二氧化硅纳米颗粒和分散在固化性树脂或固化剂，其中该纳米复合材料包含小于2重量％的溶剂中的分散剂。 二氧化硅纳米粒子包括非球形二氧化硅纳米颗粒和/或球形热解二氧化硅纳米粒子。 因此，一个复合物提供约4至70重量％的二氧化硅纳米颗粒，和分散剂，分散于固化的树脂，并包埋在固化树脂的填料包括。 任选地，所述复合材料还含有固化剂。 此外，提供了一种制备包含纳米粒子的可固化树脂体系的方法，包括从10至70重量％的聚集的二氧化硅纳米粒子的混合与固化性树脂和分散剂以形成混合物。 该混合物含有按重量计的溶剂小于2％。 因此，该方法包括在研磨所述混合物，以浸没含磨研磨介质以形成研磨的树脂体系包含分散于可固化树脂的二氧化硅纳米粒子。

    MAGNESIUM HYDROXIDE FIRE RETARDANT NANOPARTICLES AND PRODUCTION METHOD THEREOF
    60.
    发明公开
    MAGNESIUM HYDROXIDE FIRE RETARDANT NANOPARTICLES AND PRODUCTION METHOD THEREOF 有权
    难燃MAGNESIUMHYDROXIDNANOPARTIKEL及其制造方法

    公开(公告)号：EP2998273A1

    公开(公告)日：2016-03-23

    申请号：EP14858993.0

    申请日：2014-10-06

    Applicant: Otkrytoe Aktsionernoe Obshchestvo "Kaustik"

    Inventor： GORDON, Elena Petrovna ,  KOROTCHENKO, Alla Vitalievna ,  LEVCHENKO, Nadezhda Illarionovna ,  UGNOVENOK, Tatiana Sergeevna

    IPC: C01F5/22 ,  B82B3/00 ,  B82Y99/00 ,  C08K3/22 ,  C09K21/02

    CPC classification number: C09K21/02 ,  C01F5/14 ,  C01F5/22 ,  C01P2004/03 ,  C01P2004/24 ,  C01P2004/51 ,  C01P2004/54 ,  C01P2004/60 ,  C01P2004/61 ,  C01P2006/12 ,  C01P2006/14 ,  C01P2006/19 ,  C08K3/22 ,  C08K7/00 ,  C08K2003/2217 ,  C08K2003/2224 ,  C08K2201/003 ,  C08K2201/004 ,  C08K2201/006 ,  C08K2201/011 ,  C08L23/12

    Abstract: The invention relates to chemical technologies, specifically nanoparticles of flame retardant magnesium hydroxide, and a process for the preparation thereof.
    The present nanoparticles of flame retardant magnesium hydroxide, including surface-processed nanoparticles, have a hexagonal plate-like structure with a specific surface area of up to 20 m 2 /g, an average diameter of the secondary particles of up to 2 µm, a diameter of 10 % of the secondary particles of up to 0.8 µm, a diameter of 90 % of the secondary particles of up to 5 µm, with a longitudinal size of the primary particles of from 150 to 900 nm, and a thickness of from 15 to 150 nm.
    The present process for the preparation of nanoparticles of flame retardant magnesium hydroxide, including surface-processed nanoparticles, consists of two steps, wherein the first step consists in interacting an aqueous solution of magnesium chloride with an alkali component at a temperature of up to 100 °C and atmospheric pressure, with a molar ion ratio OH - : Mg ++ in the range of 1,9÷2,1 : 1, and the second step consists in hydrothermal recrystallization of the magnesium hydroxide particles at a temperature of 120 - 220 °C, a pressure of from 0.18 to 2.3 MPa and a duration of from 2 to 24 h, wherein, during hydrothermal recrystallization, in order to prevent the further growth of primary particles and the coarsening of the secondary particles by aggregation, the reaction mass is subjected to periodic hydraulic impacts with superheated vapour at a temperature of 160 - 240 °C and a pressure of from 0.6 to 3.3 MPa.
    The nanoparticles of flame retardant magnesium hydroxide, obtained according to the present process, have controllable sizes of the primary and secondary particles and a specific surface area, which allows using them as smoke-suppressing, non-toxic flame retardant without a reduction in mechanical properties and technological effectiveness in organic polymeric matrices comprising polyethylene, polypropylene, ethylene propylene copolymer, ethylene acrylate copolymer, polystyrene, ethylene-co-vinylacetate based polymer, polyamide, polyimide, polycarbonate, polyethyleneterephthalate, polybutyleneterephthalate, ABS plastic.

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