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公开(公告)号：JP2016069284A
公开(公告)日：2016-05-09
申请号：JP2014196980
申请日：2014-09-26
Applicant: 株式会社大和化成研究所 , 桜宮化学株式会社
IPC: C09D5/32 , C09D201/00 , C09K3/00 , C07F7/18
Abstract: 【課題】コーティング剤、インク、フィルム、接着剤などの用途に最適な新規反応性紫外線吸収剤を提供する。 【解決手段】次式で表されるビスベンゾトリアゾールフェノール化合物。 [Xは直接結合、C1〜6のアルキレン基等;R 1 及びR 2 はH、C1〜8のアルキル基、C1〜8のアルコキシ基、アリール基又はハロゲン原子;R 3 及びR 4 はC1〜6のアルキレン基;A 1 及びA 2 は、式:−(SiR 5 R 6 O) n −SiR 7 m (OR 8 ) 3−m で示される基、H、C1〜6のアルキル基又はアリール基;A 1 及びA 2 の少なくとも一つは−(SiR 5 R 6 O) n −SiR 7 m (OR 8 ) 3−m で表される基] 【選択図】なし
Abstract translation: 要解决的问题：提供一种最佳用于涂料，油墨，薄膜，粘合剂等的新型反应性紫外线吸收剂。解决方案：双苯并三唑酚类化合物由下式表示，其中X为直接键 ，C 1-6亚烷基等; 兰德稀有H，C 1-8烷基，C 1-8烷氧基，芳基或卤素原子; 兰稀有C 1-6亚烷基; Aand Aare是由下式表示的基团： - （SiRRO）-SiR（OR），H，C 1-6烷基或芳基; 至少一个Aand Ais是由 - （SiRRO）-SiR（OR）表示的基团。选择的图：无
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公开(公告)号：JP2015151369A
公开(公告)日：2015-08-24
申请号：JP2014026962
申请日：2014-02-14
Applicant: 株式会社大和化成研究所 , 桜宮化学株式会社
IPC: C07D405/12 , C07D249/20
Abstract: 【課題】紫外線吸収機能を発揮するベンゾトリアゾール誘導体の提供。 【解決手段】下記構造の化合物: Rは、炭素数1〜20のアルキル基であり;R 1 は、水素、炭素数1〜5のアルキル基、炭素数1〜5のアルコキシ基またはハロゲン。 【選択図】なし
Abstract translation: 要解决的问题：提供显示紫外线吸收功能的苯并三唑衍生物。本发明提供下列结构的化合物：R是1-20C的烷基; 和Ris氢，1-5C烷基，1-5C烷氧基或卤素。
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65.发明专利Tin and tin alloy plating bath, and electronic part with electrodeposited film formed with the bath 有权TIN和TIN合金涂层浴和电子部件与电泳膜形成与浴
公开(公告)号：JP2013044001A
公开(公告)日：2013-03-04
申请号：JP2011180987
申请日：2011-08-22
Applicant: Ishihara Chem Co Ltd , 石原薬品株式会社 , Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
Inventor： NISHIKAWA TETSUJI , YOSHIMOTO MASAKAZU
IPC: C25D3/32
Abstract: PROBLEM TO BE SOLVED: To improve the appearance of an electrodeposited film and the uniformity of electrodeposition in a wide range of current density region and stabilize the composition ratio of a tin alloy film in a tin or tin alloy plating bath.SOLUTION: The tin or tin alloy plating bath contains (A) a soluble salt composed of any of a tin salt and a mixture of a tin salt and a salt of a predetermined metal such as silver, copper, bismuth, and lead, (B) an acid or a salt thereof, and (C) a specific phenanthroline-dione compound. The film has excellent electrodeposition uniformity and good film appearance in a wide range of current density region because the phenanthroline-dione compound is contained. In the tin alloy plating, a uniform alloy composition can be obtained in a wide range of current density region.
Abstract translation: 要解决的问题：为了改善电沉积膜的外观和在电流密度范围宽的电沉积的均匀性，并稳定锡或锡合金电镀浴中锡合金膜的组成比。 锡或锡合金电镀液含有（A）由锡盐和锡盐与预定金属的盐（如银，铜，铋和铅）的盐的混合物组成的可溶性盐 ，（B）酸或其盐，和（C）特殊的菲咯啉二酮化合物。 由于含有菲咯啉二酮化合物，该膜在电流密度范围宽的范围内具有优异的电沉积均匀性和良好的膜外观。 在锡合金镀层中，可以在宽的电流密度范围内获得均匀的合金组成。 版权所有（C）2013，JPO＆INPIT
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Patent Agency Ranking66.发明专利Imidazole ring-bonded type oxyalkylene compound and plating bath containing the compound 有权咪唑环键合型氧化亚烷基化合物和包含化合物的包衣浴
公开(公告)号：JP2013023693A
公开(公告)日：2013-02-04
申请号：JP2011155990
申请日：2011-07-14
Applicant: Ishihara Chem Co Ltd , 石原薬品株式会社 , Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
Inventor： NISHIKAWA TETSUJI , SAKAEGAWA MASAHIRO , YOSHIMOTO MASAKAZU
IPC: C25D3/30 , C08G65/333 , C23C18/31 , C23C18/48 , C25D3/12 , C25D3/22 , C25D3/34 , C25D3/38 , C25D3/46 , C25D3/48 , C25D3/50 , C25D3/56
Abstract: PROBLEM TO BE SOLVED: To satisfy both of solubility in water and defoaming property and to make the management of plating solutions easy, in various kinds of plating baths.SOLUTION: A new imidazole ring-bonded type oxyalkylene compound includes an oxyalkylene chain selected from 2 to 4C alkylene, wherein an imidazole ring is bonded to the oxyalkylene chain through nitrogen atom at the third position and located at the terminal. When the oxyalkylene compound is used for various kinds of plating baths, foaming property is dominantly reduced while satisfactorily maintaining water solubility by introducing an imidazole ring group to the terminal in comparison with a conventional nonionic surfactant. When the oxyalkylene compound, in which an imidazole ring group exists in the molecule of a nonionic surfactant, is used for a copper plating bath for example, both of the action of the surfactant and leveling action are provided, and the plating solutions are easily managed.
Abstract translation: 要解决的问题：为了满足在水中的溶解性和消泡性，并且能够在各种电镀浴中容易地进行电镀溶液的管理。 解决方案：新的咪唑环键合氧化烯化合物包括选自2至4个亚烷基的氧化烯链，其中咪唑环通过位于末端的第三位的氮原子与氧化烯链结合。 当将氧化烯化合物用于各种电镀浴时，与常规的非离子表面活性剂相比，通过将咪唑环引入末端，令人满意地保持水溶性，从而显着降低发泡性。 当在非离子表面活性剂分子中存在咪唑环基的氧化烯化合物用于例如铜电镀浴时，提供表面活性剂的作用和流平作用，并且电镀溶液容易管理 。 版权所有（C）2013，JPO＆INPIT
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68.发明专利
公开(公告)号：JP4342792B2
公开(公告)日：2009-10-14
申请号：JP2002326659
申请日：2002-11-11
Applicant: 株式会社大和化成研究所
IPC: A01N25/04 , A41B9/00 , A01N37/02 , A01N37/44 , A01N41/04 , A01N59/16 , A01N59/26 , A01P3/00 , A41B17/00 , A61F13/15 , A61F13/472 , A61F13/49 , A61K8/00 , A61K8/02 , A61K8/19 , A61K8/23 , A61K8/24 , A61K8/36 , A61K8/365 , A61K8/368 , A61K8/46 , A61L9/00 , A61L9/01 , A61L9/18 , A61Q5/00 , A61Q11/00 , A61Q15/00 , A61Q17/04 , A61Q19/00 , A61Q19/10 , B01D11/04 , B01J13/00 , C08K3/08 , C08K3/10 , C08K3/32 , C08K5/09 , C08L101/00
Abstract: PROBLEM TO BE SOLVED: To provide an antibacterial, bactericidal or antifungal composition containing silver colloid. SOLUTION: This composition contains at least the following ingredients (A), (B) and (C) as essential ingredients. (A) Silver colloid. (B) A metal ion having an electric potential capable of reducing silver ion to metal silver in a solution. (C) A counter ion or (or) a complexing agent for dissolving the metal ion in an aqueous solution. COPYRIGHT: (C)2004,JPO
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公开(公告)号：JP2009191335A
公开(公告)日：2009-08-27
申请号：JP2008035092
申请日：2008-02-15
Applicant: Daiwa Fine Chemicals Co Ltd (Laboratory) , Ishihara Chem Co Ltd , 株式会社大和化成研究所 , 石原薬品株式会社
Inventor： NISHIKAWA TETSUJI , SAKAEGAWA MASAHIRO , YOSHIMOTO MASAKAZU
Abstract: PROBLEM TO BE SOLVED: To provide an electrolytic or electroless plating solution which has excellent temporal stability and a wide gloss range, shows uniform plating appearance, can effectively provide an intended coating film composition and contains no cyanide, and to provide electronic parts having a metal film which has been formed by using the same. SOLUTION: The plating solution includes a chemical compound shown by Formula (1) and one or more water-soluble salts of a metal selected from the group consisting of the Group VIII, IB, IIB, IIIA, IVA and VA in the fourth period to the sixth period. The water-soluble salt of the metal in the plating solution is that of tin, silver, gold, platinum, palladium or copper in particular. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：为了提供具有优异的时间稳定性和宽光泽范围的电解或化学镀溶液，显示出均匀的电镀外观，可以有效地提供预期的涂膜组合物并且不含氰化物，并且提供电子部件 具有通过使用其形成的金属膜。 解决方案：电镀液包含式（1）所示的化合物和一种或多种选自第VIII，IB，IIB，IIIA，IVA和VA族的金属的水溶性盐，其中 第四期至第六期。 镀液中金属的水溶性盐特别是锡，银，金，铂，钯或铜的金属盐。 版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JP2009149965A
公开(公告)日：2009-07-09
申请号：JP2007341848
申请日：2007-12-19
Applicant: Daiwa Fine Chemicals Co Ltd (Laboratory) , 株式会社大和化成研究所
Inventor： YOSHIMOTO MASAKAZU , KITAMURA SHINGO , OMORI SATOSHI , KADOKAWA SOJI
Abstract: PROBLEM TO BE SOLVED: To provide a silver-plating method, which does not need to form an unnecessary layer of a nickel layer inbetween a substrate which is difficult to be plated and a silver-plated film, and can form the silver-plated film having sufficient adhesiveness directly on the substrate which is difficult to be plated with the use of a halide-free plating bath under a satisfactory working environment.
SOLUTION: The silver-plating method is used for forming the silver-plated film on the substrate on which an oxide film is easily formed and the oxide film hinders the adhesiveness of a plated film, and comprises at least the steps of: (A) degreasing the substrate; (B) removing the oxide film with a strongly acidic solution; and subsequently to the step (B), (C) plating the substrate with silver by using a phosphine-containing acidic silver-plating bath which essentially does not contain a halide ion and a cyanide ion while skipping a step of nickel strike plating or nickel-alloy strike plating.
COPYRIGHT: (C)2009,JPO&INPITAbstract translation: 要解决的问题：提供一种镀银方法，其不需要在难以镀覆的基板和镀银膜之间形成不需要的镍层的层，并且可以形成银 在基板上直接具有足够的粘合性的薄膜，其难以在令人满意的工作环境下使用不含卤化物的电镀液进行电镀。 解决方案：使用镀银方法在容易形成氧化膜的基板上形成镀银膜，并且氧化膜阻碍电镀膜的粘附性，并且至少包括以下步骤： （A）脱脂基材; （B）用强酸溶液除去氧化膜; 然后在步骤（B）中，（C）通过使用基本上不含有卤离子和氰离子的含磷酸性镀银浴，同时跳过镍触镀或镍的步骤 合金打击电镀。 版权所有（C）2009，JPO＆INPIT
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