公开(公告)号：US20070257090A1

公开(公告)日：2007-11-08

申请号：US11787896

申请日：2007-04-18

Applicant: Ghassem Azdasht ,  Lars Titerle

Inventor： Ghassem Azdasht ,  Lars Titerle

IPC: B23K1/00

CPC classification number: H05K3/3478 ,  B23K3/0607 ,  B23K3/0623 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/074 ,  H05K2203/086

Abstract: A method for applying a solder to a substrate by positioning solder in a solid state, melting it and then impacting it against a substrate by means of compressed gas. The method utilizes a holder having a capillary bore whose diameter, at the substrate end, has a contraction whose diameter (D2) is smaller than the diameter (D3) of the solder globule, an energy source connected to the capillary, and a compressed gas source connected to the capillary.

Abstract translation: 一种通过将焊料定位在固态中将其焊接到基底上的方法，使其熔化，然后通过压缩气体将其冲击到衬底。 该方法利用具有毛细管孔的保持器，其直径在基底端处具有直径（D 2）小于焊球的直径（D 3）的收缩，连接到毛细管的能量源 压缩气源连接到毛细管。

公开(公告)号：US06478906B1

公开(公告)日：2002-11-12

申请号：US09693255

申请日：2000-10-20

Applicant: Ghassem Azdasht ,  Elke Zakel ,  Herbert Reichl

Inventor： Ghassem Azdasht ,  Elke Zakel ,  Herbert Reichl

IPC: B32B3116

CPC classification number: H05K3/328 ,  B23K20/10 ,  B23K2101/18 ,  B23K2101/40 ,  H01L24/81 ,  H01L2224/81205 ,  H01L2224/81224 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/189 ,  H05K2201/0108 ,  H05K2201/10719 ,  H05K2203/0285 ,  H05K2203/107

Abstract: Method for thermally bonding contact elements (14, 15) of a flexible film substrate (10) to contact metallizations (17) of an electronic component (12), the flexible film substrate having a support layer (13) of transparent plastics material and energy being applied to the contact elements from their rear by means of laser radiation (11), the transparency of the support layer (13), the absorption of the contact elements (14, 15) and the wavelength of the laser radiation (11) being matched to one another in such a way that the laser radiation is essentially transmitted through the support layer (13) and absorbed in the contact elements (14, 15), and the pressure being applied to the substrate (10) in such a way that the contact elements (14, 15) of the substrate (10) and the contact metallizations (17) of the component (12) are up against one another during the application of the laser radiation (11) in the region of an application point of the optical fibre.

Abstract translation: 用于热粘合柔性膜基底（10）的接触元件（14,15）以接触电子部件（12）的金属化（17）的方法，所述柔性膜基底具有透明塑料材料的支撑层（13）和能量 通过激光辐射（11）从其后方施加到接触元件，支撑层（13）的透明度，接触元件（14,15）的吸收和激光辐射（11）的波长是 以使得激光辐射基本上透过支撑层（13）并被吸收在接触元件（14,15）中的方式彼此匹配，并且将压力施加到基板（10），使得 在将激光辐射（11）施加到应用点的区域中时，衬底（10）的接触元件（14）和部件（12）的接触金属化部分（17） 光纤。

公开(公告)号：US06397465B1

公开(公告)日：2002-06-04

申请号：US08843492

申请日：1997-04-16

Applicant: Mohammad Akhavain ,  Ghassem Azdasht

Inventor： Mohammad Akhavain ,  Ghassem Azdasht

IPC: B21D5376

CPC classification number: H01L24/80 ,  B23K26/22 ,  B23K2101/42 ,  B23K2103/08 ,  B23K2103/12 ,  B23K2103/14 ,  B23K2103/56 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1631 ,  B41J2/1634 ,  B41J2/1643 ,  B41J2/1646 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01R43/02 ,  H01R43/0221 ,  H05K3/328 ,  H05K2201/0108 ,  H05K2201/0112 ,  H05K2201/10681 ,  H05K2203/107 ,  Y10T29/49083 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49179 ,  Y10T29/49401 ,  H01L2924/00

Abstract: A method is provided for the solderless electrical connection of two contact elements by using a laser light beam attached to a fiber optic system which directs the light to the spot to be bonded. By using a fiber optic system the laser beam is optimally converted into thermal energy and bad connections due to underheating or destruction of the contacts due to overheating does not occur. The method and apparatus provides rapid, reproducible bonding even for the smallest of contact geometries. For example, the method of the invention results in solderless gold to gold compression bonding of conductive leads contained in a polymer flex circuit tape, such as a polyimide, without damaging the tape. A strong solderless gold to gold bond can be formed between the gold plated copper lead on the flex circuit tape and a gold plated pad on a semiconductor chip without the need for a window in the flex circuit and without any damage to the tape. In the application of the present invention to the bonding of conductive leads on a TAB circuit to the silicon substrate of an inkjet printhead the need for a window in the TAB circuits is eliminated. The elimination of the window results in elimination of the need for an encapsulation material to cover the conductive leads in the TAB circuit. This in turn results in die size reduction, or increased number of nozzles with the same die size, ease of assembly, higher yields, improved reliability, ease of nozzle serviceability, and overall material and manufacturing cost reduction.

Abstract translation: 提供了一种通过使用连接到将光引导到待粘合点的光纤系统的激光束来实现两个接触元件的无焊接电连接的方法。 通过使用光纤系统，激光束被最佳地转换成热能，并且不会由于过热而导致由于过热或触点的破坏导致的不良连接。 该方法和装置即使对于最小的接触几何形状也提供了快速，可再现的结合。 例如，本发明的方法导致包含在聚合物柔性电路带（例如聚酰亚胺）中的导电引线的无金与金压接，而不会损坏带。 可以在柔性电路胶带上的镀金铜引线和半导体芯片上的镀金焊盘之间形成牢固的无焊金到金键，而不需要在柔性电路中的窗口并且不会对磁带造成任何损坏。 在本发明的应用中，将TAB电路上的导电引线与喷墨打印头的硅衬底接合，消除了TAB电路中的窗口的需要。 消除窗口导致消除了需要封装材料以覆盖TAB电路中的导电引线。 这又导致模具尺寸减小或具有相同模具尺寸，易于组装，更高产量，改进的可靠性，易于喷嘴可使用性以及整体材料和制造成本降低的喷嘴的数量增加。

公开(公告)号：US6160218A

公开(公告)日：2000-12-12

申请号：US894604

申请日：1997-10-06

Applicant: Ghassem Azdasht ,  Elke Zakel ,  Herbert Reichl

Inventor： Ghassem Azdasht ,  Elke Zakel ,  Herbert Reichl

IPC: H01L23/02 ,  B23K26/18 ,  H01L23/057 ,  H01L23/08 ,  H01L25/10 ,  H05K5/06

CPC classification number: H01L23/057 ,  B23K26/009 ,  B23K26/18 ,  H01L25/105 ,  H01L2224/50 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1076 ,  H01L2924/01079

Abstract: A housing to accept at least one electronic component, e.g., a chip with a cover and an opposing cover. The cover and opposing cover are formed to surround the component. On the inner surface of the cover and the opposing cover, there are conductive paths arranged such that the paths on the cover connect terminal areas of the component to the paths on the opposing cover and the paths on the opposing cover open into external terminals of the housing. The cover and/or the opposing cover is/are flexible and are suitable to be interconnected with surrounding sub-housings.

Abstract translation: PCT No.PCT / DE96 / 00058 Sec。 371日期：1997年10月6日 102（e）日期1997年10月6日PCT 1996年1月12日PCT PCT。 公开号WO96 / 24162 日期1996年8月8日一种用于接受至少一个电子部件的壳体，例如具有盖和相对盖的芯片。 盖和相对的盖形成为围绕部件。 在盖的内表面和相对的盖上，导电路径被布置成使得盖上的路径将部件的端部区域连接到相对的盖上的路径上，并且相对的盖上的路径打开到外部端子 住房。 盖和/或相对的盖是柔性的并且适于与周围的子壳互连。

公开(公告)号：US5977512A

公开(公告)日：1999-11-02

申请号：US875722

申请日：1997-07-31

Applicant: Ghassem Azdasht ,  Martin Lange

Inventor： Ghassem Azdasht ,  Martin Lange

IPC: B23K1/06 ,  B23K1/005 ,  B23K1/20 ,  H01L21/60 ,  H01L23/12 ,  H05K3/24 ,  H05K3/34 ,  B23K26/00

CPC classification number: H05K3/3478 ,  B23K1/0056 ,  B23K1/206 ,  B23K2201/42 ,  H01L2224/11334 ,  H05K2203/0126 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/086 ,  H05K2203/107 ,  H05K2203/108 ,  H05K3/3489 ,  H05K3/3494

Abstract: In a method and an apparatus for the flux-free application of a solder to a substrate or a chip an area on the surface of the substrate or on the pad of the chip, to which the solder is applied, is cleaned, to produce a sace which is suitable for soldering. Subsequently, the cleaned area is isolated from the surroundings by means of a protective gas, and finally the solder is applied to the cleaned, isolated area and remelted.

Abstract translation: PCT No.PCT / EP96 / 04067 Sec。 371日期1997年7月31日 102（e）日期1997年7月31日PCT提交1996年9月17日PCT公布。 公开号WO97 / 20654 日期：1997年6月12日在将焊料无焊剂施加到衬底或芯片上的方法和装置中，衬底表面上或衬底上施加焊料的区域是 清洁，以产生适合焊接的表面。 随后，通过保护气体将清洁的区域与周围环境隔离，最后将焊料施加到清洁的隔离区域并重新熔化。