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公开(公告)号：US20170260045A1
公开(公告)日：2017-09-14
申请号：US15529619
申请日：2015-04-01
Applicant: Goertek.Inc
Inventor： Quanbo Zou , Zhe Wang
IPC: B81C1/00
CPC classification number: B81C1/00896 , B81C2201/0194 , B81C2203/01 , B81C2203/0127 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/97 , H01L25/50 , H01L2224/11312 , H01L2224/16227 , H01L2224/16235 , H01L2224/81005 , H01L2224/97 , H01L2924/1461 , H01L2924/00014 , H01L2224/81
Abstract: A transfer method, manufacturing method, device and electronic apparatus of MEMS. The method for MEMS transfer, comprising: depositing a laser-absorbing layer on a first surface of a laser-transparent carrier; forming a MEMS structure on the laser-absorbing layer; attaching the MEMS structure to a receiver; and performing a laser lift-off from the side of the carrier, to remove the carrier. A transfer of high-quality MEMS structure can be achieved in a simple, low cost manner.
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公开(公告)号：US10805716B2
公开(公告)日：2020-10-13
申请号：US15554623
申请日：2015-12-10
Applicant: GOERTEK.INC
Inventor： Guoguang Zheng
Abstract: The present invention discloses a package structure of a MEMS microphone. The package structure comprises a package substrate and a package shell, wherein the package shell is provided on the package substrate and forms a closed cavity with the package substrate. In the package structure provided by the present invention, the sound-absorbing layer is arranged on the inner wall of the Helmholtz resonant cavity. The sound-absorbing layer has a certain absorption capacity to high-frequency sound waves, but has a very low absorption to low-frequency sound waves, so it may be equivalent to a “low-pass filter”. Through the absorption of the high-frequency sound waves, a high-frequency amplitude value of sound waves can be suppressed, reducing high-frequency response of the Helmholtz resonant cavity. That is, a high-frequency cut-off frequency of the sound waves is improved, widening operation bandwidth of the MEMS microphone.
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公开(公告)号：US10511903B2
公开(公告)日：2019-12-17
申请号：US15560877
申请日：2015-12-14
Applicant: Goertek.Inc
Inventor： Liguo Sun , Lianshan Ge
Abstract: The present invention discloses a sound wave filtering structure. The sound wave filtering structure comprises a cavity wall, a cavity cover and a slit. The cavity cover is mounted on the cavity wall. The cavity wall and the cavity cover are combined to form an inner cavity. The slit is formed on the cavity wall and/or the cavity cover. The cavity wall and the cavity cover seal the inner cavity. A space in the inner cavity is communicated with the outside only through the slit. On the other hand, the present invention further provides a side sound generating speaker module. The side sound generating speaker module at least comprises a side sound generating cavity and the above-described sound wave filtering structure. The side sound generating cavity is configured to guide sound waves to be transmitted from a side surface of a single speaker body. The sound wave filtering structure is arranged on the side sound generating cavity. The slit faces the interior of the side sound generating cavity. The sound wave filtering structure provided by the present invention can adjust and filter high-frequency sound waves. Especially, in the side sound generating speaker module, the sound wave filtering structure can significantly improve the sound quality of the high-frequency sound waves.
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公开(公告)号：US10317355B2
公开(公告)日：2019-06-11
申请号：US15538226
申请日：2015-07-23
Applicant: Goertek.Inc
Inventor： Kun Wang
IPC: G01N27/12 , G01N35/00 , G05B13/02 , G05D23/19 , G05B19/042
Abstract: An environmental sensor and an environmental parameter measurement and prediction method, the environmental sensor comprising: a sensing element configured to sense an instant sensing characteristic value, so as to apply sending; an integrated circuit used for continuously obtaining the instant sensing characteristic value and an instant clock signal and obtaining via calculation an instant environmental parameter, so as to apply storing and outputting. A physical and chemical properties function corresponding to the sensing element is provided for the integrated circuit. Under a prediction model, the integrated circuit utilizes the physical and chemical properties function to conduct prediction calculation to obtain an actual environmental parameter, so as to apply storing and sending according to a current instant environmental parameter and an instant clock signal and at least one set of pre-stored instant environmental parameter and instant clock signal.
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公开(公告)号：US10264377B2
公开(公告)日：2019-04-16
申请号：US15553414
申请日：2015-12-17
Applicant: GOERTEK.INC
Inventor： Kang Ping , Xinfeng Yang , Jie Wei
Abstract: Disclosed are a method, system and controller for simultaneously verifying amplitude and temperature parameters of an electrical-acoustic conversion device, including: inputting a sweep signal to the electrical-acoustic conversion device; testing the amplitude of the electrical-acoustic conversion device while adjusting the gain of the whole frequency band of the sweep signal until the maximum value of the tested amplitude is a maximum amplitude parameter Xmax, and testing the temperature of a voice coil at this moment; and if the tested temperature of the voice coil at this moment is higher or lower than Tmax, gradually reducing/increasing the gain of the sweep signal in the frequency band above a gain improvement frequency point until the tested temperature of the voice coil is Tmax, and then maintaining the gain of the sweep signal for a predetermined period of time and then testing the performance of the electrical-acoustic conversion device.
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Patent Agency Ranking
公开(公告)号：US10212501B2
公开(公告)日：2019-02-19
申请号：US15505001
申请日：2014-08-27
Applicant: Goertek.Inc
Inventor： Zhe Wang , Quanbo Zou , Jifang Tao
Abstract: The disclosure provides a MEMS device. The MEMS device comprises a printed circuit board, a cover attached to the printed circuit board to form a housing, at least one sound hole formed in the housing, a transducer with a diaphragm inside the housing, and at least one shutter structure. Each shutter structure is mounted to the housing around a respective sound hole. Each shutter structure comprises a moveable component disposed near the inner surface of the housing, the moveable component remains at an open position under regular pressure such that an air flow path from the sound hole to the at least one ventilation hole of the substrate across the moveable component is opened, and moves to a first closed position under a high external pressure to block the at least one ventilation hole and close the air flow path.
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公开(公告)号：US10178467B2
公开(公告)日：2019-01-08
申请号：US15540194
申请日：2015-12-09
Applicant: Goertek.Inc
Inventor： Jincai Hou , Mingjie Zhong
Abstract: A speaker module relates to the technical field of electroacoustic products, and comprises a lower module casing, an upper module casing and a steel sheet which are successively combined together. A speaker monomer is contained in a space enclosed by the lower module casing, the upper module casing and the steel sheet. The speaker monomer, the upper module casing and the steel sheet together enclose a front sound cavity of the module. The front sound cavity is in communication with a sound outlet hole of the module, and the sound outlet hole is located on a side part of the speaker monomer. A sheet is adhered inside the steel sheet, the thickness of the sheet being about 0.1 mm˜0.2 mm and the material of the sheet being a soundproof material.
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公开(公告)号：US20180270578A1
公开(公告)日：2018-09-20
申请号：US15556091
申请日：2015-12-17
Applicant: GOERTEK.INC
Inventor： Xiuli CHANG , Jianbin YANG
CPC classification number: H04R7/125 , H04R7/06 , H04R7/127 , H04R31/003 , H04R2307/023 , H04R2307/025 , H04R2307/029
Abstract: Disclosed are a vibration diaphragm and a speaker device. The vibration diaphragm includes a vibration diaphragm body portion and a reinforcement portion incorporated at the center of the vibration diaphragm body portion and including a carbon fiber cloth layer. The vibration diaphragm in the present invention employs a carbon fiber cloth with a relatively light weight and relatively high rigidity as the reinforcement portion, which can sufficiently satisfy the requirements to the vibration diaphragm acoustic performance by the speaker device.
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公开(公告)号：US20180152773A1
公开(公告)日：2018-05-31
申请号：US15570542
申请日：2015-12-14
Applicant: Goertek.Inc
Inventor： Zhibing ZHANG , Gang CHEN
CPC classification number: H04R1/025 , H04R1/22 , H04R1/2865 , H04R9/025 , H04R9/045 , H04R9/046 , H04R9/06 , H04R2209/024 , H04R2209/041 , H04R2400/11 , H04R2499/11
Abstract: A speaker module is disclosed, which comprises an inner cavity defined by a shell, and a magnetic circuit system and a vibrating system arranged inside the inner cavity, wherein the vibrating system comprises a vibrating diaphragm fixed in the inner cavity, a voice coil is fixed to a lower end of the vibrating diaphragm, a first induction coil is provided to an upper end of the vibrating diaphragm, the voice coil is electrically connected with the first induction coil via its down-lead, and a second induction coil is provided above the first induction coil for electrically connecting a terminal device. When the speaker module operates, the terminal device conducts a current signal of an external audio to the second induction coil, so that the second induction coil generates a magnetic field which changes along with the change of the audio signal current.
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公开(公告)号：US20180136062A1
公开(公告)日：2018-05-17
申请号：US15572072
申请日：2015-12-10
Applicant: GOERTEK.INC
Inventor： Guoguang ZHENG
IPC: G01L9/00
CPC classification number: G01L9/0051 , G01L9/0064 , G01L2009/0066
Abstract: An MEMS pressure sensing element is disclosed, comprising a substrate with a groove; a pressure-sensitive film on the substrate for sealing an opening of the groove to form a sealed cavity body; and a pressure-sensitive beam suspended in the sealed cavity body and parallel with the pressure-sensitive film provided with varistors, wherein a center of the pressure-sensitive beam is fixedly connected to that of the pressure-sensitive film, and a periphery is fixedly connected to a bottom wall of the groove of the substrate, such that the pressure-sensitive film drives the pressure-sensitive beam to bending deformation under an external pressure.
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