公开(公告)号：WO2007062171A3

公开(公告)日：2009-04-30

申请号：PCT/US2006045292

申请日：2006-11-22

Applicant: SHOCKING TECHNOLOGIES INC ,  KOSOWSKY LEX

Inventor： KOSOWSKY LEX

IPC: H01L33/00

CPC classification number: H05K1/0257 ,  H01L25/167 ,  H01L51/5203 ,  H01L2924/0002 ,  H01L2924/12044 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/05 ,  H05K1/167 ,  H05K2201/0738 ,  H05K2201/10106 ,  H01L2924/00

Abstract: A voltage switchable dielectric material (VSD) material as part of a light-emittin component, including LEDs and OLEDs.

Abstract translation: 作为发光锡组分的一部分的可变压电介质材料（VSD）材料，包括LED和OLED。

公开(公告)号：WO2007062170A3

公开(公告)日：2009-04-30

申请号：PCT/US2006045291

申请日：2006-11-22

Applicant: SHOCKING TECHNOLOGIES INC ,  KOSOWSKY LEX

Inventor： KOSOWSKY LEX

IPC: H04B1/59

CPC classification number: G06K19/07345 ,  G06K19/07318 ,  G06K19/07735 ,  H05K1/0254 ,  H05K1/0373 ,  H05K2201/0738

Abstract: A wireless communication device, such as an RFID tag, is provided material that is dielectric, unless a voltage is applied that exceeds the materials characteristic voltage level. In the presence of such voltage, the material becomes conductive. The integration of such material into the device may be mechanical and/or electrical.

Abstract translation: 提供诸如RFID标签的无线通信设备，其是介电材料，除非施加超过材料特性电压电平的电压。 在存在这种电压的情况下，材料变得导电。 将这种材料整合到装置中可以是机械的和/或电的。

公开(公告)号：WO2007062122A3

公开(公告)日：2009-04-23

申请号：PCT/US2006045206

申请日：2006-11-21

Applicant: SHOCKING TECHNOLOGIES INC ,  KOSOWSKY LEX

Inventor： KOSOWSKY LEX

IPC: H01L23/495

CPC classification number: H01L23/60 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/62 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/1132 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/8592 ,  H01L2224/92125 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Semiconductor devices are provided that employ voltage switchable materials for over-voltage protection. In various implementations, the voltage switchable materials are substituted for conventional die attach adhesives, underfill layers, and encapsulants. While the voltage switchable material normally functions as a dielectric cmaterial, during an over-voltage event the voltage switchable material becomes electrically conductive and can conduct electricity to ground. Accordingly, the voltage switchable material is in contact with a path to ground such as a grounded trace on a substrate, or a grounded solder ball in a flip-chip package.

Abstract translation: 提供了使用用于过电压保护的可切换电压材料的半导体器件。 在各种实施方案中，电压可切换材料代替常规的芯片附着粘合剂，底部填充层和密封剂。 虽然电压可切换材料通常用作电介质材料，但在过电压事件期间，电压可切换材料变得导电并且可以将电导向地电。 因此，电压可切换材料与衬底上的接地迹线或倒装芯片封装中的接地焊球接地。

公开(公告)号：WO2008016858A9

公开(公告)日：2008-07-17

申请号：PCT/US2007074676

申请日：2007-07-29

Applicant: SHOCKING TECHNOLOGIES INC ,  KOSOWSKY LEX ,  FLEMING ROBERT

Inventor： KOSOWSKY LEX ,  FLEMING ROBERT

IPC: H01B1/24

CPC classification number: H01B1/24 ,  H01L51/0037 ,  H01L51/0081

Abstract: One or more embodiments provide for a composition that includes (i) organic material that is conductive or semi-conductive, and (ii) conductor and/or semiconductor particles other than the organic material. The organic material and the conductor and/or semiconductor particles are combined to provide the composition with a characteristic of being (i) dielectric in absence of a voltage that exceeds a characteristic voltage level, and (ii) conductive with application of the voltage exceeding the characteristic voltage level.

Abstract translation: 一个或多个实施方案提供了组合物，其包括（i）导电或半导电的有机材料，和（ii）有机材料以外的导体和/或半导体颗粒。 有机材料和导体和/或半导体颗粒被组合以提供组合物的特征是：（i）不存在超过特征电压电平的电压的电介质，以及（ii）通过施加超过 特征电压电平。

公开(公告)号：WO2008036984A2

公开(公告)日：2008-03-27

申请号：PCT/US2007/079345

申请日：2007-09-24

Applicant: SHOCKING TECHNOLOGIES INC ,  KOSOWSKY, Lex ,  FLEMING, Robert

Inventor： KOSOWSKY, Lex ,  FLEMING, Robert

IPC: H01B1/24 ,  H01B1/22 ,  C23C18/16 ,  C25D5/02 ,  C25D5/48

CPC classification number: C25D5/02 ,  C23C18/02 ,  C23C18/14 ,  C25D5/10 ,  C25D5/18 ,  C25D5/48 ,  C25D5/54 ,  H05K3/188 ,  H05K3/423 ,  H05K2203/105 ,  H05K2203/107 ,  H05K2203/1136

Abstract: An electroplating process is performed using a substrate that includes a thickness of voltage switchable dielectric (VSD) material having photoactive components that are dispersed, mixed or dissolved in a binder of the VSD material. A pattern of conductive elements may be formed on the substrate by switching the VSD material from a dielectric state to a conductive state using, in part, voltage generated by directing light onto the thickness and VSD material.

Abstract translation: 使用包括具有分散，混合或溶解在VSD材料的粘合剂中的光敏组分的电压可切换电介质（VSD）材料的厚度的衬底来执行电镀工艺。 部分使用通过将光引导到厚度和VSD材料上而产生的电压，通过将VSD材料从电介质状态切换到导电状态，可以在衬底上形成导电元件图案。

公开(公告)号：WO2007062171A2

公开(公告)日：2007-05-31

申请号：PCT/US2006/045292

申请日：2006-11-22

Applicant: SHOCKING TECHNOLOGIES, INC. ,  KOSOWSKY, Lex

Inventor： KOSOWSKY, Lex

IPC: H01L33/00

CPC classification number: H05K1/0257 ,  H01L25/167 ,  H01L51/5203 ,  H01L2924/0002 ,  H01L2924/12044 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/05 ,  H05K1/167 ,  H05K2201/0738 ,  H05K2201/10106 ,  H01L2924/00

Abstract: A voltage switchable dielectric material (VSD) material as part of a light-emittin component, including LEDs and OLEDs.

Abstract translation: 作为发光锡组分的一部分的可变压电介质材料（VSD）材料，包括LED和OLED。

公开(公告)号：WO2011149989A1

公开(公告)日：2011-12-01

申请号：PCT/US2011/037813

申请日：2011-05-24

Applicant: SHOCKING TECHNOLOGIES, INC. ,  FLEMING, Robert ,  GRAYDON, Bhret ,  VASQUEZ, Daniel ,  WU, Junjun ,  RAZAVI, Farhad

Inventor： FLEMING, Robert ,  GRAYDON, Bhret ,  VASQUEZ, Daniel ,  WU, Junjun ,  RAZAVI, Farhad

IPC: H01L21/28

CPC classification number: H01L28/10 ,  H01L45/00

Abstract: Ferroic circuit elements that include a set of conductive structures that are at least partially embedded within a ferroic medium are disclosed. The ferroic medium may be a voltage switched dielectric material that includes ferroic particles in accordance with various embodiments. A ferroic circuit element may be at least partially embedded within a substrate in accordance with embodiments of the current invention as an embedded ferroic circuit element. An embedded ferroic circuit element that is an inductor in accordance with embodiments of the current invention may be denoted as an embedded ferroic inductor. An embedded ferroic circuit element that is a capacitor in accordance with embodiments of the current invention may be denoted as an embedded ferroic capacitor.

Abstract translation: 公开了包括至少部分地嵌入在铁介质内的一组导电结构的铁电回路元件。 铁介质可以是根据各种实施方案的包括铁粉的电压切换电介质材料。 根据本发明的实施例，铁电电路元件可以至少部分地嵌入衬底内，作为嵌入式铁电元件。 根据本发明的实施例的作为电感器的嵌入式铁电元件可以表示为嵌入式铁电感器。 根据本发明的实施例的作为电容器的嵌入式铁电元件可以表示为嵌入式铁电容器。

公开(公告)号：WO2011106751A1

公开(公告)日：2011-09-01

申请号：PCT/US2011026389

申请日：2011-02-26

Applicant: SHOCKING TECHNOLOGIES INC ,  KOSOWSKY LEX ,  FLEMING ROBERT ,  GRAYDON BHRET ,  VASQUEZ DANIEL

Inventor： KOSOWSKY LEX ,  FLEMING ROBERT ,  GRAYDON BHRET ,  VASQUEZ DANIEL

IPC: H05K1/09

CPC classification number: H05K1/0254 ,  H05K1/0259 ,  H05K1/181 ,  H05K2201/0738 ,  H05K2203/304

Abstract: Printed circuit boards including voltage switchable dielectric materials (VSDM) are disclosed. The VSDMs are used to protect electronic components, arranged on or embedded in printed circuit boards, against electric discharges, such as electrostatic discharges or electric overstresses. During an overvoltage event, a VSDM layer shunts excess currents to ground, thereby preventing electronic components from destruction or damage.

Abstract translation: 公开了包括可切换电介质材料（VSDM）的印刷电路板。 VSDM用于保护布置在印刷电路板上或嵌入印刷电路板中的电子部件，以防止放电，例如静电放电或电动过载。 在过电压事件期间，VSDM层将多余的电流分流到地，从而防止电子元件破坏或损坏。

公开(公告)号：WO2011059806A1

公开(公告)日：2011-05-19

申请号：PCT/US2010/054682

申请日：2010-10-29

Applicant: SHOCKING TECHNOLOGIES, INC. ,  KOSOWSKY, Lex

Inventor： KOSOWSKY, Lex

IPC: C25D5/48

CPC classification number: C25D5/022 ,  C25D5/54 ,  H05K1/0373 ,  H05K3/07 ,  H05K3/107 ,  H05K3/188 ,  H05K2201/0191 ,  H05K2201/0215 ,  H05K2201/0738 ,  H05K2201/09036 ,  H05K2203/1492

Abstract: Systems and methods include depositing one or more materials on a voltage switchable dielectric material. In certain aspects, a voltage switchable dielectric material is disposed on a conductive backplane. In some embodiments, a voltage switchable dielectric material includes regions having different characteristic voltages associated with deposition thereon. Some embodiments include masking, and may include the use of a removable contact mask. Certain embodiments include electrografting. Some embodiments include an intermediate layer disposed between two layers.

Abstract translation: 系统和方法包括在电压可切换介电材料上沉积一种或多种材料。 在某些方面，电压可切换介电材料设置在导电背板上。 在一些实施例中，电压可切换介电材料包括具有与其上的沉积相关联的不同特征电压的区域。 一些实施例包括掩模，并且可以包括使用可移除的接触掩模。 某些实施例包括电接枝。 一些实施例包括设置在两层之间的中间层。

公开(公告)号：WO2010053846A1

公开(公告)日：2010-05-14

申请号：PCT/US2009/062844

申请日：2009-10-30

Applicant: SHOCKING TECHNOLOGIES, INC. ,  KOSOWSKY, Lex ,  FLEMING, Robert ,  SHI, Ning

Inventor： KOSOWSKY, Lex ,  FLEMING, Robert ,  SHI, Ning

IPC: H01C7/12

CPC classification number: H01C7/12 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/115 ,  H05K1/167 ,  H05K2201/0738 ,  H05K2201/09736 ,  H05K2201/09781

Abstract: A substrate device includes a layer of non-linear resistive transient protective material and a plurality of conductive elements that form part of a conductive layer. The conductive elements include a pair of electrodes that are spaced by a gap, but which electrically interconnect when the transient protective material is conductive. The substrate includes features to linearize a transient electrical path that is formed across the gap.

Abstract translation: 衬底装置包括形成导电层的一部分的非线性电阻性瞬态保护材料层和多个导电元件。 导电元件包括​​一对间隔开的电极，但当瞬态保护材料是导电的时，它们进行电互连。 衬底包括使跨越间隙形成的瞬态电路线性化的特征。