公开(公告)号：JPH07176383A

公开(公告)日：1995-07-14

申请号：JP34471293

申请日：1993-12-21

Applicant: CASIO COMPUTER CO LTD

Inventor： KAWAMURA YOSHIHIRO

IPC: H05B33/14 ,  G09F9/30 ,  G09F9/46 ,  H05B33/12

Abstract: PURPOSE:To provide an electroluminescent element whose applications range is broadened as it is capable of color display using plural colors. CONSTITUTION:An electroluminescent element has transparent electrodes 2-5 and phosphor layers 6-8 stacked alternately and three luminous portions including a blue luminous portion 17, a green luminous portion 16 and a red luminous portion 15, each of which comprises two of the transparent electrodes and the phosphor layer between those transparent electrodes. A voltage to be applied between both of the electrode films of each luminous portion 15-17 is turned on and off to obtain blue, green and red by the luminous portions 15-17 and other four colors derived from combinations of those colors, i.e., a total of seven colors.

公开(公告)号：JPH03244558A

公开(公告)日：1991-10-31

申请号：JP3983390

申请日：1990-02-22

Applicant: CASIO COMPUTER CO LTD

Inventor： YARITA YOSHIO ,  MUTO JIRO ,  KAWAMURA YOSHIHIRO

IPC: B41J2/335

Abstract: PURPOSE:To form heating parts of a heating resistor layer into a uniform size even if the heating resistor layer is varied in width by a method wherein the width of the heating resistor layer is made larger than the length at a part where the top end parts of signal electrodes and a common electrode are staggered with each other so that the respective top end parts are covered with the heating resistor layer. CONSTITUTION:A width W of a heating resistor layer 12 is made larger than a length L of a part where the top end parts 18a, 19a of signal electrodes 18 and a common electrode 19 are staggered with each other so that the respective top end parts 18a, 19a are covered with the heating resistor layer 12. Therefore, the size of heating parts 21 of the heating resistor layer 12 which generate heat at the time of printing depends on the opposed part between the top end parts 18a, 19a of the signal electrodes 18 and the common electrode 19. In addition, since the signal electrodes 18 and the common electrode 19 are formed patternwise by a photolithographic technique, the top end parts 18a, 19a are trued up at the top edges thereof, and the staggered length L is set uniformly and accurately. In this manner, even with the variation of the width W of the heating resistor layer 12, the heating parts 21 of the heating resistor layer 12 can be formed into a fixed size.

公开(公告)号：JPH02301187A

公开(公告)日：1990-12-13

申请号：JP12039689

申请日：1989-05-16

Applicant: CASIO COMPUTER CO LTD ,  TOYO METALIZING

Inventor： KAWAMURA YOSHIHIRO ,  YARITA YOSHIO ,  MINAMI TOMOYUKI

IPC: H05K3/42

Abstract: PURPOSE:To realize simple manufacturing process and improved productivity and to secure conductivity between the wiring patterns of both sides by forming a through hole in an insulating film, and then etching the wiring patterns in two-layer structure consisting of a plating layer and a metallic film to make a them conductive at the place of a through hole. CONSTITUTION:A through hole 2 running from the obverse to the reverse is formed on an insulating film 1 by machining such as drilling, press, etc. Next, metallic films 3 are formed on the obverse and reverse of the insulating film 1 and at the inner face of the through hole 2 by deposition or sputtering. Next, a plating layer 4 is formed at the entire surface of a metallic film 3 by electroless plating. On the plated layers 4 at the abverse and reverse, resists 5 are formed at the wiring pattern formation areas, corresponding to each other at the place of the through hole 2, by screen printing, photo patterning, or the like. After that, with the resist 5 as a mask, the plating layer 4 and the metallic film 3 are etched to remove unnecessary parts. Lastly, the resist 5 is removed.

公开(公告)号：JPH02228092A

公开(公告)日：1990-09-11

申请号：JP4877789

申请日：1989-03-01

Applicant: CASIO COMPUTER CO LTD

Inventor： YARITA YOSHIO ,  KAWAMURA YOSHIHIRO

IPC: H05K3/06 ,  H05K3/18 ,  H05K3/24

Abstract: PURPOSE:To simplify a plating process and achieve economical manufacture with improved productivity by forming a metal film on the front, rear, and side surfaces of an insulating substrate through deposition or sputtering. CONSTITUTION:An insulating substrate 1 is prepared, and a metal film 2 is formed all over the surfaces, i.e., on the upper, lower, and side surfaces, of this insulating substrate 1 by deposition or sputtering. Therefore, the metal film 2 pattern can be formed directly on the insulating substrate 1. In addition, this metal film 2 constitutes ground plating for a plating layer 4, so that the plating layer 4 can simply and easily be formed on the metal film 2. Thus, the plating process is simplified, and economical manufacturing is achieved with improved productivity.