公开(公告)号：JPH01268037A

公开(公告)日：1989-10-25

申请号：JP9544888

申请日：1988-04-20

Applicant: CASIO COMPUTER CO LTD

Inventor： SUZUKI SATOSHI ,  KUWABARA OSAMU ,  MUTO JIRO ,  SHINOZAKI EIICHI

IPC: H01L21/603 ,  H01L21/60

Abstract: PURPOSE:To eliminate the dead space of a resin film in a junction, enable the high-density packaging, and prevent an electrical bad effect of unnecessary resin film, by cutting off the outside of the part where metal lead leaves are stuck inside the opening of the resin film by thermocompression to eliminate together with the resin film on the outer edge of the opening. CONSTITUTION:An opening 4b, which is a gap along one of the edges of a resin film 4, is formed in said resin film 4 with many metal lead leaves 5 connected to the electrodes 6a of an IC chip 6 stuck on the upper surface thereof. The opening 4b is bridged with each metal lead leaf 5 reaching the edge of the resin film 4 and the part of each metal lead leaf 5 at which is exposed through said opening 4b is sunk into said opening 4b by a thermocompression bonding head 10 to bond with the connecting lead 2a of an electronic part board 2 by thermocompression. The outside of the part bonded by thermocompression is cut off and eliminated together with the resin film 4 on the outer edge of the opening 4b. The outer edges 5b2 of the metal lead leaves 5, for example, are covered by silicon rubber 9 with bonded with the connecting lead 2a of the electronic part board 2.

公开(公告)号：JPH01137581A

公开(公告)日：1989-05-30

申请号：JP9681088

申请日：1988-04-21

Applicant: CASIO COMPUTER CO LTD

Inventor： SUZUKI SATOSHI ,  KUWABARA OSAMU ,  MUTO JIRO ,  SHINOZAKI HIDEKAZU

IPC: H01R43/02 ,  H01L21/60 ,  H05K1/11 ,  H05K3/34

Abstract: PURPOSE:To prevent the short circuit with the adjacent connection portion and allow reliable and firm connection by forming a bank section of solder plating on the side wall of a metal lead foil. CONSTITUTION:A metal lead foil 7 applied with solder plating 7C is thermally press-stuck to a connection terminal section 2a formed wider than the metal lead foil 7, and the bank section 10 of the solder plating 7C is formed on the side wall of the metal lead foil 7. When the width of the connection terminal section 2a is formed wider than the width of the metal lead foil 7 applied with solder plating 7C, the positioning of the metal lead foil 7 at the time of connection to the connection terminal section 2a can be facilitated. When the metal lead foil 7 is thermally press-stuck to the connection terminal section 2a and the bank section 10 of solder plating is formed on the side wall of the metal lead foil 7, reliable and firm connection can be performed, and the short circuit with the adjacent connection portion due to the outflow of solder plating in the side direction can be prevented.

公开(公告)号：JPH02119150A

公开(公告)日：1990-05-07

申请号：JP25073689

申请日：1989-09-28

Applicant: CASIO COMPUTER CO LTD

Inventor： SUZUKI SATOSHI ,  KUWABARA OSAMU ,  MUTO JIRO ,  SHINOZAKI HIDEKAZU

IPC: H01L21/60 ,  H05K3/36

Abstract: PURPOSE:To perform appropriate soldering to both of the inside and outside ends of metallic lead foil by making the thickness of the solder at the outside end of the metallic lead foil thicker than that at the inside end. CONSTITUTION:The pattern of prescribed metallic lead foil 7 is formed by laminating a carrier film 4 provided with opening 6 and 4a with metallic foil. Soldering 7c of the inside end 7a is performed to the whole surface of the foil 7 to a thickness of 0.2-0.6mum and an IC chip 5 is bonded to the inside end 7a. A resin 8 is applied to a certain surface of the electrode 5d of the chip 5 by potting and the resin 8 is dried. Then soldering 7c of the outside end 7b is performed to a thickness of 0.2-2.0mum and a soldering flux is applied to the outside end 7b by potting. Then the outside end 7b is put on the connecting lead 2a of the liquid crystal panel 5 and fixed with 8 vacuum head 21. After fixing, the outside end 7b is connected with the connecting lead 2a by means of a thermocompression fixing head 22.

公开(公告)号：JPH01135093A

公开(公告)日：1989-05-26

申请号：JP29215187

申请日：1987-11-20

Applicant: CASIO COMPUTER CO LTD

Inventor： SUZUKI SATOSHI ,  KUWABARA OSAMU ,  MUTO JIRO ,  SHINOZAKI HIDEKAZU

IPC: H01L21/60 ,  B23K1/00 ,  G09F9/00 ,  H05K3/34 ,  H05K3/36

Abstract: PURPOSE:To set the quantity of solder and the interval of the ends of leads to constant values and to simultaneously form and jointing adhere the bent parts of the leads by securing many metal lead foils connected to the electrodes of an IC chip, forming a solder-plating layer on a part exposed from an opening, and thermally press-bonding the center of the lead foil facing the opening. CONSTITUTION:An IC unit 1 is formed with an opening 6 which is larger than the profile of an IC chip 5 at a carrier film 4, many metal lead foils 7,... are pattern-formed, and the chip 5 is bonded to the inner ends 7a,... of the foils 7 protruding into the opening 6. The outer ends 7b,... of the side of a liquid crystal display panel 2 are submerged at central parts 7b1 facing the opening 4a in the opening 4a, thermally press-bonded through solder plating to the leads 2a of the panel 2, oblique parts 7b2, 7b3 are obliquely risen toward the upper edge of the opening 4a at both side ends of the submerged part 7b1, triangular solder reservoirs 9, 9 are thereby formed, and the parts 7b2, 7b3 are rigidly jointed to the leads 2a by the reservoirs 9, 9.

公开(公告)号：JP2518186B2

公开(公告)日：1996-07-24

申请号：JP13857790

申请日：1990-05-30

Applicant: CASIO COMPUTER CO LTD

Inventor： KUWABARA OSAMU ,  MUTO JIRO ,  ABE AKIHIKO

IPC: B41J2/335

公开(公告)号：JPH0439067A

公开(公告)日：1992-02-10

申请号：JP14537690

申请日：1990-06-05

Applicant: CASIO COMPUTER CO LTD

Inventor： MUTO JIRO ,  KUWABARA OSAMU ,  ABE AKIHIKO

IPC: B41J2/345

Abstract: PURPOSE:To easily position a thin-film heating resistor layer to electrodes to perform an efficient production by a method wherein the electrodes are disposed across a projected insulating layer provided on a substrate, and the thin-film heating resistor layer is formed in a belt form on the projected insulating layer in an electrode aligning direction so as to connect to the electrodes at the both skirt parts beyond said insulating layer. CONSTITUTION:On a film substrate 10, a selection electrode 11 and a common electrode 12 are patterned. Ni and Au are laminated to form a metal layer. A resist is patterned on the metal layer. The metal layer is masked by the resist to be etched for removing an unnecessary part. Then, the selection electrode 11 and the common electrode 12 made of the metal layer are formed in a staggered form. After that, an adhesive 17 is applied between end parts 13, 14 opposed to the selection electrode 11 and the common electrode 12. A fiber 16 is bonded on the film substrate 10. The adhesive 17 is intruded between the periphery of the fiber 16 and the end parts 13, 14. After that, the adhesive 17 is dried, and a thin-film heating resistor layer 18 is formed on the fiber 16. In this manner, the thin-film heating resistor layer 18 is formed beyond the fiber 16 with the both ends thereof connected to the end parts 13, 14 of the electrodes 11, 12.

公开(公告)号：JPH03244558A

公开(公告)日：1991-10-31

申请号：JP3983390

申请日：1990-02-22

Applicant: CASIO COMPUTER CO LTD

Inventor： YARITA YOSHIO ,  MUTO JIRO ,  KAWAMURA YOSHIHIRO

IPC: B41J2/335

Abstract: PURPOSE:To form heating parts of a heating resistor layer into a uniform size even if the heating resistor layer is varied in width by a method wherein the width of the heating resistor layer is made larger than the length at a part where the top end parts of signal electrodes and a common electrode are staggered with each other so that the respective top end parts are covered with the heating resistor layer. CONSTITUTION:A width W of a heating resistor layer 12 is made larger than a length L of a part where the top end parts 18a, 19a of signal electrodes 18 and a common electrode 19 are staggered with each other so that the respective top end parts 18a, 19a are covered with the heating resistor layer 12. Therefore, the size of heating parts 21 of the heating resistor layer 12 which generate heat at the time of printing depends on the opposed part between the top end parts 18a, 19a of the signal electrodes 18 and the common electrode 19. In addition, since the signal electrodes 18 and the common electrode 19 are formed patternwise by a photolithographic technique, the top end parts 18a, 19a are trued up at the top edges thereof, and the staggered length L is set uniformly and accurately. In this manner, even with the variation of the width W of the heating resistor layer 12, the heating parts 21 of the heating resistor layer 12 can be formed into a fixed size.

公开(公告)号：JPH0345558B2

公开(公告)日：1991-07-11

申请号：JP29215187

申请日：1987-11-20

Applicant: CASIO COMPUTER CO LTD

Inventor： SUZUKI SATOSHI ,  KUWABARA OSAMU ,  MUTO JIRO ,  SHINOZAKI HIDEKAZU

IPC: H01L21/60 ,  B23K1/00 ,  G09F9/00 ,  H05K3/34 ,  H05K3/36

公开(公告)号：JPS62281496A

公开(公告)日：1987-12-07

申请号：JP12369186

申请日：1986-05-30

Applicant: CASIO COMPUTER CO LTD

Inventor： MUTO JIRO

IPC: H05K3/32

公开(公告)号：JPH0443050A

公开(公告)日：1992-02-13

申请号：JP14978790

申请日：1990-06-11

Applicant: CASIO COMPUTER CO LTD

Inventor： MUTO JIRO ,  ABE AKIHIKO

IPC: B41J2/335

Abstract: PURPOSE:To from a thin film heating element layer by a uniform film thickness even for a low cost resin substrate by a method wherein the thin film heating element layer is formed by using a thin film forming device of sputtering, vapour deposition, etc., while the other face side of the resin substrate is being cooled. CONSTITUTION:A selective electrode 2 and a common electrode 3 are formed opposed to each other via a space on a film substrate 1. Then, a fiber 7 of approx. 50mum in thickness is bonded to the film substrate 1 by an adhesive 8. Thereafter, the adhesive 8 is dried, and a thin film heating element layer 9 consisting of tantalum nitrides such as TaN, Ta2N, etc., are formed by a film thickness of approx. 1000Angstrom on the fiber 7. When the tantalum nitride is applied by sputtereing herein, the application is performed while the film substrate 1 is being cooled with a cooling system 12. Lastly, a protective layer 16 which protects the thin film heating element layer 9 and the electrodes 2, 3 is provided onto all surfaces.